Hitachi Chemical Company, Ltd.

Resonac Corporation

National Institute of Advanced Industrial Science and Technology

Junichi Kamei

Takuya Imai

Kazuhiko Sato

Koichi Saito

Yuki Miyamoto

Tooru Kikuchi

Akihiro Kobayashi

Sadaaki Katou

Youichi Kimura

Kenichi Tominaga

Souichirou Komiya

Tetsuya Okazaki

Takashi Kumaki

Tetsushi Maruyama

Chika Kuramochi

Kazuyuki Magome

Shujie Qu

Shunrin Ryuu

Hiroshi Osaki

Masayuki Wada

An optically softening resin composition contains a compound having a disulfide bond; and a radical scavenger. The compound having a disulfide bond may be a copolymer including a monomer unit having a disulfide bond and a functional group, and a monomer unit having a substituent reactive with the functional group. A curable resin composition contains a monomer having a disulfide bond and a functional group; a monomer having a substituent reactive with the functional group; and a radical scavenger.

Optically softening resin composition, method for producing softened product of optically softening resin composition, curable resin composition and cured product of same, and patterned film and method for producing same

A moisture-curable hot-melt adhesive composition is disclosed. This moisture-curable hot-melt adhesive composition contains: a urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having two or more isocyanate groups; and a modified urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having one or more isocyanate groups modified with a castor oil monool.

Moisture-curable hot-melt adhesive composition, bonded object, and garment

Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.

Reactive hot-melt adhesive composition, and bonded body and method for producing same

Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition. Used as the component (A) are acrylate compounds or methacrylate compounds, to be specific, an acrylate compound or a methacrylate compound having an amide group and an acrylate compound or a methacrylate compound containing a urethane bond.

Photosensitive resin composition, photosensitive film, rib pattern formation method, hollow structure and formation method for same, and electronic component

A production method by which an alkyldiol monoglycidyl ether can be efficiently produced without requiring a complex purification step is provided. A method for producing an alkyldiol monoglycidyl ether, including a step of reacting a vinyl ether-containing alcohol with an epihalohydrin to form a vinyl ether-containing glycidyl ether, conducting a devinylation reaction in the presence of an acid catalyst and water, and further conducting an acetal decomposition reaction by adding an acid aqueous solution.

Method for producing alkyldiol monoglycidyl ether

Provided is a liquid curable resin composition containing (A) a polymer component containing (A1) a polymer having an ethylenically unsaturated bond in a molecule thereof; (B) a low-molecular weight monomer having one ethylenically unsaturated group in a molecule thereof; and (C) a polymerization initiator, wherein the component (B) contains a compound represented by the following general formula (I). The liquid curable resin composition may be a material which is suitably applicable for the purpose of filling a space between a protective panel and an image display unit or the like in a large-sized image display device and which is excellent in moist heat resistance reliability.  (In the formula, Rrepresents a hydrogen atom or a methyl group; Rrepresents an alkyl group having 4 or more carbon atoms; and n represents a number of from 1 to 20.)

Liquid curable resin composition, method for manufacturing image display device using same, and image display device

Provided is a production method which is capable of efficiently producing an alkanediol glycidyl ether (meth)acrylate with high purity and high yield without requiring a troublesome purification process. A method for producing an alkanediol glycidyl ether (meth)acrylate, which comprises: a step wherein a vinyloxyalkyl glycidyl ether is subjected to a devinylation reaction in the presence of an acid catalyst and water; and a subsequent step wherein an esterification reaction is carried out.

Method for producing alkanediol monoglycidyl ether (meth)acrylate

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Chiba, Japan

Junichi Kamei