Screen Holdings Co., Ltd.

Dainippon Screen Mfg. Co., Ltd.

Junichi Ishii

Kazuki Nakamura

Takashi Shinohara

Tomoyuki Shinohara

Takuma Takahashi

Nobuaki Okita

Yoshifumi Okada

Akio Hashizume

Hiroaki Ishii

Koichi Okamoto

Kazuhiro Honsho

Takayuki Nishida

Shotaro Tsuda

Masahiro Nonomura

Ryohei Hokaku

An upper holding device holds a substrate in a horizontal attitude without rotating the substrate. A lower holding device rotates a substrate while holding the substrate by suction. A substrate held by the upper holding device is cleaned with use of a cleaning liquid, and a substrate held by the lower holding device is cleaned with use of a cleaning liquid. Gas in a processing space is exhausted by exhaust equipment of a factory through an exhaust system. When a substrate is held by the upper holding device, gas in the processing space is not exhausted or gas in the processing space is exhausted at a first flow rate. Gas in the processing space is exhausted at a second or third flow rate that is higher than the first flow rate when the substrate is held by the lower holding device.

Substrate cleaning device, substrate cleaning system, substrate processing system, substrate cleaning method and substrate processing method

A substrate cleaning device includes a substrate holder, a lower-surface brush, a first liquid nozzle and a second liquid nozzle. The substrate holder holds a substrate in a horizontal attitude. The lower-surface brush is configured to be movable between a processing position for cleaning of the substrate and a waiting position that overlaps with the substrate held by the substrate holder in an up-and-down direction. Further, the lower-surface brush is configured to be rotatable about an axis extending in the up-and-down direction. The lower-surface brush cleans a lower surface of the substrate by coming into contact with the lower surface of the substrate. The first liquid nozzle discharges a cleaning liquid to a center portion of the lower-surface brush, at a waiting position. The second liquid nozzle discharges a cleaning liquid to an end portion of the lower-surface brush, at the waiting position.

Substrate cleaning device

A substrate is held in a horizontal attitude by a substrate holder. At a processing position, a lower surface of the substrate held by the substrate holder is cleaned by a lower-surface brush. The lower-surface brush is cleaned by a brush cleaner at a waiting position that overlaps with the substrate held by the substrate holder in an up-and-down direction and is below a processing position. The lower-surface brush is lifted and lowered by a lower-surface brush lifting-lowering driver between the processing position and the waiting position.

Substrate cleaning device and substrate cleaning method

The substrate processing system is provided with a first substrate holding unit which includes a first base that faces from below a substrate having a protected target surface and a cleaning target surface on the opposite side of the protected target surface and holds the substrate in a first posture in which the protected target surface is facing upward, a protective film coating nozzle which coats a protective film at least at a peripheral edge portion of the protected target surface of the substrate that is held by the first substrate holding unit, a first turning unit which turns around the substrate while in contact with a peripheral edge portion of the substrate so that the posture of the substrate can be changed from the first posture to a second posture in which the protected target surface is facing downward, a second substrate holding unit which includes a second base that faces the substrate from below and holds the substrate in the second posture, and a cleaning unit which cleans the cleaning target surface of the substrate that is held by the second substrate holding unit.

Substrate processing system and substrate processing method

A cleaner comes into contact with a lower-surface center region of a substrate held by a first holder, so that the lower-surface center region is cleaned. The cleaner comes into contact with a lower-surface outer region of the substrate rotated by a second holder, so that the lower-surface outer region of the substrate is cleaned. During cleaning of the lower-surface center region, the second holder is rotated about a vertical axis while not holding the substrate. Alternatively, during cleaning of the lower-surface center region, the gas injector arranged between the cleaner and the second holder injects gas toward the substrate from a first height spaced apart from the substrate by a predetermined distance. Further, during drying of the lower-surface center region, the gas injector injects gas toward the substrate from a second height closer to the substrate than the first height.

A lower-surface center region of a substrate held by a first holder is cleaned by a cleaner. A lower-surface outer region of the substrate rotated by a second holder is cleaned by the cleaner. A mobile base provided with the second holder and the cleaner is moved in a horizontal plane such that a reference position of the first holder coincides with a center axis of the second holder in a plan view when the substrate is received and transferred between the first holder and the second holder, and is moved in the horizontal plane such that the cleaner overlaps with the lower-surface center region of the substrate held by the first holder and a center axis of the cleaner coincides with a first portion different from a center of the substrate in the plan view when the lower-surface center region is cleaned.

It is an object to prevent adhesion of a processing liquid to a non-processing region of a substrate. In order to achieve the object, a substrate processing apparatus includes a substrate rotating mechanism, a discharging portion for discharging a processing liquid to a substrate, a moving portion for moving a discharging portion, and a controller. The discharging portion starts to discharge the processing liquid at a first position and is moved to a second position. The first position is a position of the discharging portion where a section of a passage of the discharging portion is projected onto a first region, and the second position is a position of the discharging portion where the section of the passage is projected onto a second region. The first region is a region on the peripheral edge side of the substrate from the second region.

Substrate processing apparatus and substrate processing method

While a substrate is being rotated, the lower surface of a brush is moved along the upper surface of the substrate. The brush and a spray nozzle are moved upward from a takeoff position to a lower non-contact position so as to separate the lower surface of the brush from the upper surface of the substrate. The spray nozzle generates the droplets in a state where the brush and the spray nozzle are located in the lower non-contact position so as to make the droplets collide with the upper surface of the substrate, and then the droplets colliding with the upper surface of the substrate are discharged from a gap between the lower surface of the brush and the upper surface of the substrate while the droplets are being supplied to the lower surface of the brush.

Substrate processing method and substrate processing apparatus

In parallel with a lower-side scrub cleaning step where a brush is contacted with a lower surface inclined portion of a substrate, a center-side spray cleaning step is performed where a collision position of liquid droplets with respect to an upper surface of the substrate is moved between the center of the substrate and the middle of the substrate while the liquid droplets collide with the upper surface of the substrate. Thereafter, in parallel with an upper-side scrub cleaning step where the brush is contacted with an upper surface inclined portion of the substrate, an outer circumference-side spray cleaning step is performed where the collision position of the liquid droplets with respect to the upper surface of the substrate is moved between the middle of the substrate and the outer circumference of the substrate while the liquid droplets collide with the upper surface of the substrate.

Substrate treatment method and substrate treatment device

A technique for reducing the amount of particles adhering to a substrate with a simple structure is provided. A substrate processing apparatus is an apparatus for processing a substrate by ejecting a processing liquid from a nozzle. The substrate processing apparatus includes supply piping and an air-bubble capturing part. One end of the supply piping is connected via a first filter for removing particles to a tank of a processing-liquid supply part that supplies the processing liquid, and the other end of the supply piping is connected to the nozzle. The air-bubble capturing part is inserted at a position between the first filter and the nozzle in the supply piping, and captures air bubbles contained in the processing liquid. Pressure loss caused by the air-bubble capturing part is approximately equal to or smaller than pressure loss caused by the first filter.

Substrate processing apparatus

An inventive substrate treatment apparatus includes a substrate rotation unit which rotates a substrate, a brush to be brought into contact with at least a peripheral edge portion of a front surface of the substrate rotated by the substrate rotation unit, and a peripheral rinse liquid ejection unit which ejects a rinse liquid toward a predetermined rinse liquid applying position on the peripheral edge portion of the front surface of the substrate from a position located radially inward of the predetermined rinse liquid applying position with respect to a rotation radius of the substrate, the predetermined rinse liquid applying position being spaced downstream in a substrate rotation direction from a brush contact area of the peripheral edge portion kept in contact with the brush.

Growing community of inventors

Kyoto, Japan

Junichi Ishii