Sony Chemical & Information Device Corporation

Sony Corporation

Ihara Chemical Industry Co., Ltd.

Sony Chemicals Corporation

Junichi Ishii

Masatoshi Hasegawa

Mamiko Nomura

Tadashi Akamatsu

Tomoyasu Sunaga

Etsuchi Nishikawa

Hiroki Kanaya

A novel polyimide resin is formed by imidizing a diamine component including an amide group-containing siloxane diamine compound represented by the following formula (1) and an acid dianhydride component including an aromatic acid dianhydride such as 3,3',4,4&#x2032;-diphenylsulfone tetracarboxylic dianhydride. This novel polyimide resin utilizes a novel polyimide resin into which a reaction group capable of reacting with a crosslinking agent to form a crosslinking point is pre-introduced before imidization. The novel polyimide resin can confer a comparatively low elastic modulus and heat resistance to a dry film or a photosensitive cover film formed from a photosensitive polyimide resin composition containing the novel polyimide resin. In the formula (1), Rand Rare each independently an optionally-substituted alkylene group, m denotes an integer of 1 to 30, and n denotes an integer of 0 to 20.

Polyimide resin and photosensitive polyimide resin composition

A novel amide group-containing siloxane amine compound, which is useful as a diamine component of a polybenzimidazole resin, a polybenzoxazole resin, and particularly a polyimide resin, which is derived from an amine monomer, has a chemical structure represented by the formula (1).  In the formula (1), Rand Reach independently represent an optionally substituted alkylene group; p denotes an integer of 0 to 3; q denotes an integer of 0 to 3; m denotes an integer of 1 to 30; and n denotes an integer of 0 to 20; provided that p and q are not 0 at the same time.

Amide group-containing siloxane amine compound

A poly(imide-azomethine)copolymer that has a low linear thermal expansion coefficient and a method for producing the same copolymer are provided. Also provided are a poly(amic acid-azomethine)copolymer that is a precursor polymer of the poly(imide-azomethine)copolymer; a positive photosensitive resin composition composed of the precursor polymer and a photosensitizer; and a method for making a fine pattern of poly(imide-azomethine) copolymer from the resin composition.

Poly (imide-azomethine) copolymer, poly (amic acid-azomethine) copolymer, and positive photosensitive resin composition

A polyimide compound has a low coefficient of linear thermal expansion comparable to the coefficient of linear thermal expansion of a conductor to be covered by the polyimide. The polyimide compound is less susceptible to contraction caused by dehydration process. The compound is obtained by the reaction of a highly linear acid dianhydride with a highly linear diamine and has a high imidization rate. Having a low coefficient of linear thermal expansion comparable to the conductor to be covered by the polyimide, the polyimide compound of the present invention is less susceptible to contraction that occurs during polyimide formation. The polyimide compound is suitable for making curl-free flexible wiring boards.

Polyimide compound and flexible wiring board

Provided are an ester group-containing poly(imide-azomethine)copolymer having low linear thermal expansion coefficient; a production method thereof; an ester group-containing poly(amide acid-azomethine)copolymer to serve as the precursor of the poly(imide-azomethine)copolymer; a positive photosensitive composition including the poly(amide acid-azomethine)copolymer and a photosensitizer; a method for forming a fine pattern of an ester group-containing poly(imide-azomethine)copolymer from the composition; and a method for forming a fine pattern of an ester group-containing poly(imide-azomethine)copolymer by etching a photosensitizer-free, ester group-containing poly(imide-azomethine)copolymer in an alkaline solution. The ester group-containing poly(imide-azomethine)copolymer comprises an ester group-containing azomethine polymer unit of the formula (1) and an imide polymer unit of the formula (2): wherein in the formulas (1) and (2), A and D are each independently a divalent aromatic or aliphatic group with D containing an ester group; and B is a tetravalent aromatic or aliphatic group.

Ester group-containing poly (imide-azomethine) copolymer, ester group-containing poly (amide acid-azomethine) copolymer, and positive photosensitive resin composition

Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below:wherein chemical structure Aincludes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.

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Tochigi, Japan

Junichi Ishii