Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Junichi Imaizumi

Hiroshi Nomura

Masakatsu Suzuki

Kouichi Nagao

Eikichi Satou

Noriyuki Kinjo

Koji Fujisaki

Yoshikatsu Mikami

Shun-ichi Numata

Koushi Sakairi

Michio Uruno

Kouhei Horiuchi

Hiroaki Takahashi

Seiji Sunohara

Hajime Nakamura

Yasushi Numaguchi

Yasushi Katoh

Takato Oti

The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order.

Adhesive film

An electromagnetic wave shield film () comprises a transparent base (), a conductor () positioned on the transparent base () via an adhesive () and having a mesh geometric pattern, and an earth portion () arranged around the conductor () and including conductive regions () which absorb electromagnetic waves, and non-conductive regions () which prevent the earth portion () from being creased.

Electromagnetic shield film, electromagnetic shield unit and display

A flexible printed-circuit board covered with a coverlay is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.

Method of producing flexible printed-circuit board covered with coverlay

A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.

Heat resistant adhesive composition and bonding method using the same

A resin material comprising a polyamide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

Low thermal expansion resin material and composite shaped article

A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

Growing community of inventors

Shimodate, Japan

Junichi Imaizumi