Shin-etsu Polymer Co., Ltd.

Saitama University

Shin-etsu Chemical Co., Ltd.

Mitsubishi Chemical Corporation

National University Corporation Saitama University

Junichi Ikeno

Hideki Suzuki

Yohei Yamada

Hitoshi Noguchi

Rika Matsuo

Hiroto Komatsu

Yousuke Kunishi

Tomonari Yoshimura

Kenji Yagi

A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unitconfigured to condense laser light B so as to face an upper surfaceof a blockof single crystal diamond, a step of forming a modified layer, which includes a processing markof graphite and a crackextending along a surface (111) around the processing mark, in a partial region of the upper surfaceof the blockalong the surface (111) of the single crystal diamond, along the surface (111) of the single crystal diamond at a predetermined depth from the upper surfaceof the blockby radiating the laser light B on the upper surfaceof the blockfrom the laser condensing unitunder predetermined conditions and condensing the laser light B inside the block, and moving the laser condensing unitand the blockin a relative manner two-dimensionally, and a step of forming a cleavage planeat the predetermined depth of the remaining region of the upper surfaceof the blockby spontaneously propagating cleavage from the modified layer

Method of manufacturing diamond substrate

A method for manufacturing a peeled substrate has a laser condensing step for focusing laser light at a prescribed depth from the surface of a substrate and a positioning step for moving and positioning a laser condenser relative to the substrate, the method involving forming a processed layer in the substrate. The laser condensing step includes a laser light adjustment step in which a diffraction optical element is used to branch the laser light into a plurality of branched laser beams, and at least one of the branched laser beams is branched such that the intensity thereof differs from the other branched laser beams. The processed layer is elongated using the branched laser beam having a relatively high intensity among the plurality of branched laser beams to process the substrate, and the elongation of the processed layer is restrained using the branched laser beams having a relatively low intensity.

Method for manufacturing peeled substrate

An etching method for etching a substrate using a molten alkali, wherein, while an oxide coating is formed on the surface of the substrate PL to be etched in a high-temperature oxygen-containing environment, the surface to be etched is isotropically etched to remove the oxide coating using a molten alkali AL brought into a prescribed high-temperature range.

Etching method

A substrate manufacturing method capable of easily obtaining a thin magnesium oxide single crystal substrate is provided. A first step is performed which disposes a condenser for condensing a laser beam on an irradiated surface of a magnesium oxide single crystal member in a non-contact manner. A second step is performed which forms processing mark lines in parallel by irradiating the laser beam to the surface of the single crystal substrate under designated irradiation conditions to condense the laser beam into an inner portion of the single crystal substrate while moving the condenser and the single crystal substrate relative to each other in a two-dimensional manner. A third step is performed which forms new processing mark lines between the adjacent irradiation lines in the second step to allow planar separation, by irradiating the laser beam to the surface of the single crystal substrate under designated irradiation conditions to condense the laser beam into an inner portion of the single crystal substrate while moving the condenser and the single crystal substraterelative to each other in a two-dimensional manner.

Method of making a peeled magnesium oxide substrate using laser irradiation

An etching method in which: molten sodium hydroxide in a prescribed temperature range is used as a molten alkali, whereby an Si surface of an etching surface of an SiC substrate, in which the substrate surface is configured from the Si surface and a C surface, is removed at a higher speed than is the C surface while an oxide film is formed on the etching surface in a high-temperature environment containing oxygen.

A substrate manufacturing method includes: a first step of disposing a condenser for condensing a laser beam in a non-contact manner on a surfaceof a magnesium oxide single crystal substrateto be irradiated; and a second step of irradiating a laser beam to a surface of the magnesium oxide single crystal substrateand condensing the laser beam into an inner portion of the single crystal member under designated irradiation conditions using the condenser, and at a same time, two-dimensionally moving the condenser and the magnesium oxide single crystal substraterelatively to each other, and sequentially forming processing marks to sequentially allow planar peeling.

Method of making a peeled substrate using laser irradiation

Provided are a thermoplastic resin shaped-article in which vacancies with satisfactory light emission efficiency are formed, and a thermoplastic resin light guide that uses the thermoplastic resin shaped-article. Pulse laser irradiation is performed in a state in which the pulse laser is focused to an inner region of a primary thermoplastic resin shaped-article, thereby forming cracks at the inner side of the primary thermoplastic resin shaped-article. Then, a heat treatment is performed at a temperature equal to or higher than a glass transition temperature of a thermoplastic resin that constitutes the primary thermoplastic resin shaped-article, thereby obtaining a thermoplastic resin shaped-articlein which substantially spherical vacancieshaving minimum diameter of 30 &#x3bc;m or more are formed only at the inner region distant from a surface thereof by 10 &#x3bc;m or more.

Thermoplastic resin shaped-article, method of manufacturing the same, thermoplastic resin light guide, light source device, and liquid crystal display device

A transparent conductive film () including a transparent base material () having insulation properties; and a mesh member made of a conductive metal and provided in the transparent base material (), wherein the transparent base material () is provided with a conductive portion in which the mesh member is arranged, and an insulating portion (I) in which a gap () formed by removing the mesh member is arranged.

Growing community of inventors

Saitama, Japan

Junichi Ikeno