Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Junichi Hada

Masamichi Morimoto

Shigeki Imafuku

Shozo Fukuda

Kimiaki Sano

Yoshiyuki Hattori

Akira Noudo

Yasutaka Tsuboi

Eiichi Hachiya

Atsushi Tanabe

Omur Bozma

Noriaki Yoshida

Yoshihiro Mimura

Akira Kobayashi

Kazumasa Okumura

Seiji Mizuoka

Youichi Tanaka

Hiroyoshi Saitoh

Seishiro Yanachi

Kazuyuki Nakano

A method for profiling the shape of a component using a line sensor () which is provided in a component mounter () and which profiles the shape of the component () three-dimensionally by (a) projecting a sweeping light onto the component () in a relative movement between the line sensor () and the component () held by a mounting head () so that the sweeping light traverses the direction of the movement and (b) detecting the reflected light from the component using a detector (). The method includes getting the component () from the component supply unitusing the mounting head (), rotating the component () by a predetermined angle within a predetermined surface, and profiling the shape of the rotated component using the line sensor ().

Component shape profiling method and component mounting method

It is an object of the present invention to provide a parts recognition data preparing method and a preparing device and an electronic parts mounting device and a recording medium, which are capable of preparing parts recognition data, which are set to respective electronic parts and are referred to when the electronic parts are to be recognized, precisely and quickly not to know particularly the characteristic of the recognition algorithm. In the present invention, there are provided an inputting means for inputting information of a body and electrodes of the electronic parts, a recognition algorithm selecting means for identifying a type of the electronic parts based on input information of the body and the electrodes and then selecting a recognition algorithm that is adaptive to the identified type, and a parts shape data extracting means for extracting automatically parts shape data, which are required for a recognizing process executed by the selected recognition algorithm, from the input information of the body and the electrodes, whereby parts recognition data in which recognition conditions of the electronic parts are recorded are prepared.

Part recognition data creation method and apparatus, electronic part mounting apparatus, and recorded medium

An illumination apparatus includes a through-hole for detection formed at a center portion, and irradiates diffused light and directional light to an object to be detected. The apparatus includes an annular diffusion plate which diffuses light, a light source disposed annularly, and an annular reflection plate which reflects light from the light source to the side of said object to be detected. The diffusion plate, light source, and reflection plate are disposed in the order from the side of said object to be detected. The diffused light is generated by irradiating light from said light source to the object to be detected through said diffusion plate. Light from said light source is reflected by said reflection plate and then irradiated to the object to be detected.

Illumination device, recognizing device with the illumination device, and part mounting device

An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Apparatus for mounting components on substrate

Apparatus and method for mounting components on substrate

In an electronic component installation device for manufacturing an electronic circuit substrate, wherein components are picked up from a parts supply device and placed on a circuit substrate, the height of the installing surface s of an electronic component,from a reference surface is detected with the use of a three-dimensional imaging device,, and the distance the suction nozzle,of the mounting head,is lowered is accurately determined with respect to each of electronic components that vary in thickness.

Electronic component installation method

Electronic part mounting method

When an image of an object is recognized, a template having a size smaller than the object is used. First, operation reference points C.sub.s (X.sub.m, Y.sub.n) are set at steps smaller than lengths along the X and Y directions of an image of an object to be recognized, and a template T(x.sub.i, y.sub.i) is set at the operation reference points C.sub.s (X.sub.m, Y.sub.n). Then, an equation, ##EQU1## is operated based on the template T(x.sub.i, y.sub.i) and the image data P(X, Y). Next, candidate points are determined as points having M(X.sub.m, Y.sub.n) larger than a reference value. Then, a position of the image of the object is determined according to the candidate points. Even if an image to be recognized is inclined, the position and the slope of the image can be detected at a fast speed even for image data with noise.

Pattern detection method

The front end position of the leads of a leaded part can be accurately detected even from image data having a noise signal mixed therein. A method including a step for defining, with respect to an electronic part having a plurality of leads to be packaged on a board by an electronic parts packaging plant, a two-dimensional test window having a rectangular coordinate system with the X-axis extending parallel with the direction in which the leads are juxtaposed and the Y-axis perpendicular to the X-axis; a lead emphasizing step for emphasizing the light intensity of the lead regions of image data obtained by photographing the electronic part in the test window; a data producing step for producing one-dimensional histogram data which indicates the distribution of light intensity along the Y-axis on the basis of the image data after having the light intensity of its lead regions emphasized; and a positioning step for calculating the Y-coordinate of the lead position in the test window on the basis of the histogram data thereon.

Parts identifying method

It is intended to accurately detect the centerline or center of electronic component by relieving effects of brightness or darkness or the like caused by the shape or color of the component, irregularity on the surface or how illuminance is projected on the component through statistical processing. To this end, the present invention comprises a first step for determining edge points of opposing sides of said component, a second step for determining two-dimensional coordinate axes which are established to make a deflection angle of said component zero, a third step for projecting the center position of two edge points in total each of which is arbitrarily selected from each side to a coordinate axis of said two-dimensional coordinate axes orthogonal to said opposing sides, and creating a histogram on said coordinate axis by projecting and adding the positions of center repeatedly obtained onto said coordinate axis, and a fourth step for detecting the peak position of the histogram obtained from the result of processing of said third step, and determining a line passing through the peak position and parallel to said opposing sides as the centerline of component.

Component detection method

In a component detecting method and apparatus, intensity data stored in an intensity data storing device are rearranged in order of increasing intensity data. An intensity data quadratic differential table is formed by quadratically differentiating the intensity data of an intensity profile with respect to a data number of the intensity data. The data number at a zero-crossing point at which a quadratic differential data obtained by quadratically differentiating the intensity data is changed between positive and negative through zero from the intensity data quadratic differential table is detected. A threshold value is determined according to the intensity data of the intensity profile corresponding to the data number at the zero-crossing point. So, the component detect method and apparatus can detecting an image of the component from a background with the appropriate threshold value even when the component to be recognized is dirty or the intensity of the background fluctuates

Method and apparatus using a zero-point crossing of quadratically

An apparatus for converting image signals into binary signals is disclosed. The apparatus comprises: a binarizing section for binarizing image signals; a connectivity distribution section for obtaining connectivities between pixels from binary signals and for producing a connectivity distribution; and a judging section for, from connectivity distributions obtained with different binary levels, judging the level at which the frequencies of maximum and minimum connectivities are highest and the sum of the frequencies of intermediate connectivities is minimal.

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Fukuoka, Japan

Junichi Hada