Samsung Display Co., Ltd.

Myongji University Industry and Academia Cooperation Foundation

Junhyup Lee

Intae Son

Jeongho Hwang

Jongdeok Park

Byungwook Ahn

Sanggu Lee

Hoyun Byun

Younghye Son

Onnuri Kim

Byungsun Lee

Yoongook Park

Seungchan Lee

Sukwon Jung

Kikyung Youk

A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.

Curable composition, method of preparing curable composition, cured material of curable composition, method of preparing cured material, and electronic device including cured material

A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.

Thermally releasable adhesive member and display apparatus including the same

A thermally releasable adhesive member including a base resin and microcapsules dispersed and disposed in the base resin. The microcapsule includes a core part, a shell part wrapping the core part, and an organic solvent disposed in the core part, and an average diameter of the microcapsules is in a range from about 50 nm to about 500 nm. The adhesive member may maintain high optical transmittance and may be easily detached at a high temperature.

Growing community of inventors

Seongnam-si, South Korea

Junhyup Lee