Samsung Electronics Co., Ltd.

Knu-lndustry Cooperation Foundation

Junhyung Kim

Dongkeon Kong

Sehoon Kim

Kiheung Kim

Jaiick Chun

Sungchul Park

Hyojin Jung

Kyeongbin Lim

Sangho Lee

Sung-Hoon Kim

Sunghoon Kim

Kangjin Yoon

Yumi Sohn

Sanguhn Cha

Kyungjae Kim

Minsoo Han

Kwanwoo Song

Kyungsoo Ha

Dusan Baek

Minwoo Rhee

Hyukjoong Kwon

Kijun Lee

Myungkyu Lee

Sunghye Cho

Kyung-Soo Ha

Sangha Park

Sungrae Kim

Sunghyup Kim

Yesin Ryu

Youngkyu Kim

Deepraj Prabhakar Patkar

Soonhyung Gwon

Yonggwon Lee

JongWoo Lee

Jewon Lee

Eunhui Bae

Changyong Lee

Bonhyun Koo

Hyungi Kim

HeeDong Kim

Inbae Chang

Gwanghee Jo

Seungdae Seok

Joongha Lee

Jinyoung Hong

Taewon Ahn

Kyounghan Park

DongYun Hwang

Chihong Cho

Hyeonjun Yun

Hangyun Jung

Daeho Min

Mngu Lee

Seungeok Choi

A substrate transfer apparatus includes a body portion having a holding region on a surface thereof corresponding to a substrate. The body portion moves so that the surface thereof approaches the substrate up to at least a first distance. A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate disposed at the first distance. At least some of the plurality of vacuum holes are disposed at equal intervals at an edge of the holding region and have the same width. A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.

Substrate transfer apparatus

A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.

Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus

A method and apparatus are provided for connecting a user equipment to electronic devices. The method includes receiving, for a connection to an electronic device, a first broadcast message transmitted by the electronic device according to a first communication mode, wherein the first broadcast message includes information indicating whether the electronic device supports a connection to the electronic device according to at least one of the first communication mode or a second communication mode that is different from the first communication mode; determining whether the electronic device supports the connection to the electronic device according to at least one of the first communication mode or the second communication mode based on the information; and establishing the connection to the electronic device according to the first communication mode or the second communication mode based on a result of the determining.

Connection method for smart home device and apparatus thereof

A semiconductor memory device includes a memory cell array, an error correction code (ECC) circuit, a fault address register, a scrubbing control circuit and a control logic circuit. The memory cell array includes memory cell rows. The scrubbing control circuit generates scrubbing addresses based on refresh operations performed on the memory cell array. The control logic circuit controls the ECC circuit such that the ECC circuit performs an error detection operation on a plurality of sub-pages in a first memory cell row to count a number of error occurrences, and determines whether to correct a codeword in which an error is detected based on the number of error occurrences. An uncorrected or corrected codeword is written back, and a row address of the first memory cell row may be stored in the fault address register as a row fault address based on the number of error occurrences.

Semiconductor memory devices and methods of operating semiconductor memory devices

A semiconductor memory device includes a memory cell array, an error correction code (ECC) circuit, a fault address register and a control logic circuit. The memory cell array includes a plurality of memory cell rows. The scrubbing control circuit generates scrubbing addresses for performing a scrubbing operation on a first memory cell row based on refresh row addresses for refreshing the memory cell rows. The control logic circuit controls the ECC circuit such that the ECC circuit performs an error detection and correction operation on a plurality of sub-pages in the first memory cell row to count a number of error occurrences during a first interval and determines a sub operation in a second interval in the scrubbing operation based on the number of error occurrences in the first memory cell row.

A memory system includes a memory module having a plurality of memory devices therein. A memory controller is configured to transmit commands and addresses to the memory module in synchronization with a clock, input/output data to and from the memory module in synchronization with a data transfer clock, and perform system error correction operations on data read from the memory module. The plurality of memory devices perform on-die error correction operations, which are different from each other according to a physical location of the stored read data.

Memory systems having memory devices therein with enhanced error correction capability and methods of operating same

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

Substrate bonding apparatus

A server is provided. The server includes a communicator and a processor configured to receive driving information of a plurality air conditioning devices through the communicator, identify an opening and closing cycle of a valve included in a pipe connected to each indoor unit of the plurality of air conditioning devices to control flow of a refrigerant, based on the driving information, group each indoor unit of the plurality of air conditioning devices into a plurality of groups based on the opening and closing cycle of the valve, based on a power consumed by the plurality of the air conditioning devices reaching a reference power amount, identify at least one group among the plurality of groups based on information about a control priority, and transmit a signal for driving control to at least one indoor unit included in the at least one group through the communicator.

Server and control method thereof for a multi-air conditioning system including grouping of indoor units

A server and a controlling method of a server are provided. The server includes a communication interface, a memory configured to store priorities of each of a plurality of spaces, and a processor configured to control a plurality of air conditioners arranged in the plurality of spaces, and the processor may, based on a total power usage of the plurality of air conditioners exceeding a first threshold value, control the plurality of air conditioners to operate in a power peak control mode to reduce the total power usage, and based on the total power usage being less than a second threshold value while operating in the power peak control mode, control the plurality of air conditioners to sequentially switch to a general mode according to the priority.

Server and method for controlling multiple air conditioning units

A semiconductor memory device includes a memory cell array, a sense amplifier circuit and a random code generator. The memory cell array is divided into a plurality of sub array blocks arranged in a first direction and a second direction crossing the first direction. The sense amplifier circuit is arranged in the second direction with respect to the memory cell array, and includes a plurality of input/output (I/O) sense amplifiers. The random code generator generates a random code which is randomly determined based on a power stabilizing signal and an anti-fuse flag signal. A second group of I/O sense amplifiers selected from among a first group of I/O sense amplifiers performs a data I/O operation by data scrambling data bits of main data. The first group of I/O sense amplifiers correspond to a first group of sub array blocks accessed by an access address.

Semiconductor memory device and a method of operating the semiconductor memory device

A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, a scrubbing control circuit and a control logic circuit. The memory cell array includes memory cell rows, and each of the memory cell rows including volatile memory cells. The scrubbing control circuit generates scrubbing addresses for performing a normal scrubbing operation on the memory cell rows with a first period based on refresh row addresses for refreshing the memory cell rows. The control logic circuit controls the ECC engine the scrubbing control circuit to distribute a scrubbing operation on weak codewords dynamically within the refresh operation such that a dynamic allocated scrubbing (DAS) operation is performed with a second period smaller than the first period. An error bit is detected in each of the weak codewords during the normal scrubbing operation or normal read operation on at least one of the memory cell rows.

A wafer bonding apparatus includes lower and upper stages, lower and upper push rods, a position detection sensor, and processing circuitry. The stages may vacuum suction respective wafers on respective surfaces of the stages based on a vacuum pressure being supplied to respective suction holes in the respective surfaces from a vacuum pump. The push rods are movable through respective center holes in the stages to apply pressure to respective middle regions of the respective wafers. The position detection sensor may generate information indicating a bonding propagation position of the wafers based on detecting at least one wafer through a detection hole in at least one stage. The processing circuitry may process the information to detect the bonding propagation position and cause a change of at least one of a ratio of protruding lengths of the push rods, or a ratio of suction areas of the stages.

Wafer to wafer bonding apparatuses

A connection method and apparatus are provided for smart home devices. A method for connecting a user equipment to smart home devices includes identifying, when a connection request for a smart home device is detected, reception of a first broadcast message transmitted by the smart home device according to a first communication mode; determining whether the smart home device permits communication mode negotiation based on information included in the first broadcast message; and establishing a connection to the smart home device according to the first communication mode or a second communication mode based on a result of the determining.

The present disclosure relates to a method and apparatus for determining a representative sensor using sensor data collected from a plurality of sensors and processing the sensor data using sensor data of the determined representative sensor. The present disclosure relates to a sensor network, Machine Type Communication (MTC), Machine-to-Machine (M2M) communication, and technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the above technologies, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services.

Method and apparatus for processing sensor information

The present invention relates to a method and a device for searching for and controlling controllees in a smart home system. The method for searching for and controlling controllees existing on two or more networks from controllers in a smart home system, according to one embodiment of the present invention, comprises the steps of: requesting a list of the controllees and receiving the list of the controllees from a server; transmitting a response request signal for requesting a response to the controllees existing in the received list of the controllees; and, when a response signal has not been received from one or more controllees, generating a non-response list for controlling, by the server, the controllees from which the response signal has not been received.

Method and device for searching for and controlling controllees in smart home system

Growing community of inventors

Yongin-si, South Korea

Junhyung Kim