Samsung Electronics Co., Ltd.

Junhong Min

Taeyeong Kim

Hyungjun Jeon

Hoechul Kim

Sukjune Yoon

Kyungshik Roh

Sohee Lee

Minyong Choi

A bonding method for bonding a first substrate to a second substrate includes fixing the first substrate to a first surface of a first bonding chuck and fixing the second substrate to a second surface of a second bonding chuck, the second surface facing the first surface; aligning the second bonding chuck above the first bonding chuck in a vertical direction or in a horizontal direction; bonding the first substrate to the second substrate to make a bonded substrate; and wherein, in the bonding the first substrate to the second substrate, injecting a process gas between the first substrate and the second substrate using a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view and injecting an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate using an air curtain generator are performed in combination.

Method of manufacturing semiconductor device

A robot device according to various embodiments comprises a camera, a robot arm, and a control device electrically connected to the camera and the robot arm, wherein the control device can be configured to collect a robot arm control record about a random operation, acquire, from the camera, a camera image in which a working space of the robot arm is photographed, implement an augmented reality model by rendering a virtual object corresponding to an object related to objective work in the camera image, and update a control policy for the objective work by performing image-based policy learning on the basis of the augmented reality model and the control record.

Robot control apparatus and method for learning task skill of the robot

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck configured to fix the first substrate to a first surface of the first bonding chuck; a second bonding chuck configured to fix the second substrate to a second surface of the second bonding chuck, the second surface facing the first surface; a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view, the process gas injector configured to inject a process gas between the first substrate and the second substrate when respectively disposed on the first bonding chuck and the second bonding chuck; and an air curtain generator disposed at an outside of the process gas injector in the plan view, the air curtain generator configured to inject an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate.

Substrate bonding apparatus

Growing community of inventors

Ulsan, South Korea

Junhong Min