Advanced Semiconductor Engineering, Inc.

Junhong Lee

Kun-A Kang

Hyung Jun Park

Sangbae Park

Hyeongno Kim

Bae Doo Kim

A singulation method comprising: (a) providing a molded product including semiconductor chips attached and electrically coupled to an upper surface of a lead frame wherein a lower surface of the lead frame is exposed from the bottom of the molded product, the lead frame including a plurality of units in an array arrangement and cutting streets between the units, each unit having a die pad and leads arranged at the periphery of the die pad, a first metal layer formed on the entire lower surface of the lead frame except the cutting streets; (b) etching the lower surface of the lead frame with the first metal layer as mask such that the cutting streets are etched away to form a plurality of grooves; and (c) cutting the etched molded product along the grooves to obtain the leadless semiconductor packages.

Growing community of inventors

Kyunggi-do, South Korea

Junhong Lee