Other

Jungyup Kim

In Kwon Jeong

Yong Bae Kim

Yong Ho Lee

A system and method for cleaning a substrate, such as a semiconductor wafer, utilizes a rotatable wafer supporting assembly with a cylindrical body to provide stability for the substrate being cleaned, even at high rotational speeds. The rotatable wafer supporting assembly may include wafer holding mechanisms with pivotable confining members that are configured to hold the substrate using centrifugal force when the wafer supporting assembly is rotated. In an embodiment, the cleaning system may include a positioning system operatively connected to an acoustic transducer to provide meaningful control of the acoustic energy applied to a surface of the substrate by selectively changing the distance between the acoustic transducer and the substrate surface so that the substrate can be cleaned more effectively.

System and method for wet cleaning a semiconductor wafer

An apparatus and method for treating surfaces of semiconductor wafers with a reactive gas, such as ozone, utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of processing fluid formed on a semiconductor wafer surface to increase the amount of reactive gas that reaches the wafer surface through the boundary layer. The apparatus and method may be used to clean a semiconductor wafer surface and/or grow an oxide layer on the wafer surface by oxidation.

Apparatus and method for treating surfaces of semiconductor wafers using ozone

An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

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San Jose, CA, United States of America

Jungyup Kim