Electronics and Telecommunications Research Institute

Jungyun Kwon

Seung Min Lee

Jaewoo Lee

Seungeon Moon

Solyee Im

Junsoo Kim

The present disclosure herein relates to a device for measuring a thermoelectric performance. The device for measuring a thermoelectric performance of a thermoelectric material, which includes a support module configured to generate temperature difference between both ends of the thermoelectric material, a fixing module detachably coupled to the support module to support the thermoelectric material, a temperature measuring unit electrically connected to the fixing module to measure temperature of each of the both ends of the thermoelectric material, and an electromotive force measuring unit electrically connected to the fixing module to measure thermoelectromotive force generated between the both ends of the thermoelectric material. Here, the fixing module includes a first heat sink part and a second heat sink part, which respectively support the both ends of the thermoelectric material.

Device for measuring thermoelectric performance

Provided is a cooling device including a valve structure including a temperature-responsive material that changes in volume in response to changes in temperature, a supporting structure, which is joined to the valve structure and supports the valve structure, and a solvent which contacts the valve structure, wherein a portion of the solvent contacts the valve structure and another portion of the solvent is externally exposed, the valve structure changes in volume in response to changes in temperature and thereby regulating the externally exposed surface area of the solvent.

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Daejeon, South Korea

Jungyun Kwon