Dongwoo Fine-chem Co., Ltd.

Jungu Lee

Sung Jin Noh

Ki Joon Park

A circuit board includes a base layer, an electrode layer formed on the base layer, a passivation layer formed on the electrode layer while opening a part of the electrode layer, and a surface treatment layer formed on the open surface of the electrode layer. The surface treatment layer may contain 70 to 40% of copper and 30 to 60% of nickel.

Circuit board

A manufacturing method of a touch panel includes steps of sequentially forming a metal layer and a blackening layer on a base layer in a multi-chamber, patterning the metal layer and the blackening layer in a mesh pattern, and etching the metal layer and the blackening layer to form a metal mesh electrode with the blackening layer formed.

Touch panel, laminate having the same, and manufacturing method thereof

A circuit board includes a base layer, a seed layer formed on the base layer, and a first electrode layer formed on the seed layer. The seed layer is formed of a metal oxide with a thickness of 100 to 400 &#x212b;. The circuit board may further include an insulation layer formed on the first electrode layer and a second electrode layer formed on the insulation layer.

A mesh-patterned touch panel includes a base layer, a first transparent oxide layer formed on the base layer, a metal electrode layer formed on the first transparent oxide layer, and a blackening layer formed on the metal electrode layer.

Growing community of inventors

Suwon-si, South Korea

Jungu Lee