Lg Electronics Inc.

Samsung Electronics Co., Ltd.

Jungmin Ko

Kietak Hyun

Soohan Eo

Sangchul Lee

Youngjoo Lee

Inkyu Hwang

Hyeongmun Kang

Hyeonjun Song

Seungduk Baek

Changhwa Sun

Jonguk Her

Kwonsang Seo

Seungbo Shim

Seungyeop Lee

Taehyeong Kim

Sangki Nam

Yunrae Cho

Eunkyul Oh

Byungjo Kim

Insup Shin

Younghyun Jo

Jinyeol Yang

Bohyun Nam

Sehwan Bae

Jinwoo Lee

Jungkyu Son

Tae-Hyun Kim

Jaeyong Park

Jonghyun Seo

Sungho Jang

Hyukjin Ahn

Sang Ki Nam

Jihyun Lim

Nam Kyun Kim

Kuihyun Yoon

Kangmin Jeon

Sangsick Park

Hyungsoon Lee

Hwanyoung Choi

Seunghan Baek

Dongki Choi

Youngwoo Lim

Jungmo Yang

Seungbin Ahn

Changheon Lee

Suhan Eo

Disclosed is a cleaner. A cleaner according to an embodiment of the present invention comprises: a brush; and a removal member that is positioned adjacent to the brush. The brush is rotated to collect garbage, such as hair, located on a floor surface. The collected garbage, such as hair, may be pushed by the removal member and separated from the brush. The garbage, such as hair, separated from the brush may pass through a nozzle housing and may then be collected in a dust bin. Therefore, the garbage, such as hair, attached to the brush can be easily separated and collected without a separate removal process. Accordingly, user convenience can be improved.

Cleaner nozzle with brush and removal member

A plasma confinement ring includes a lower ring, an upper ring on the lower ring, and a connection ring extended to connect the lower ring to the upper ring. The lower ring includes a lower center hole vertically penetrating the lower ring at a center of the lower ring and at least one slit penetrating the lower ring in a region outside the lower center hole. The slit is structured to pass a more amount of air or gas at a first portion closer to the center of the lower ring than at a second portion farther from the center of the lower ring.

Plasma confinement ring, semiconductor manufacturing apparatus including the same, and method of manufacturing a semiconductor device using the same

A nozzle part and a robot cleaner including same are disclosed. A nozzle part according to various embodiments of the present invention comprises: a brush for collecting waste such as hair; and a removing member for removing the waste, such as hair, that is stuck to the brush. The removing member more quickly rotates than the brush in the same direction to remove the waste, such as hair, that is stuck to the brush. Therefore, the waste such as hair can be easily collected, removed and captured. Thus, user convenience can be improved.

Nozzle part and robot cleaner including same

A semiconductor package includes a base chip; semiconductor chips stacked on the base chip; bumps, a lowermost bump of the bumps disposed between the base chip and a lowermost semiconductor chip of the semiconductor chips, and each of the bumps except the lowermost bump respectively disposed between the semiconductor chips; organic material layers, a lowermost organic material layer of the organic material layers disposed between the base chip and the lowermost semiconductor chip, and each of organic material layers except the lowermost organic material layer respectively disposed between the plurality of semiconductor chips; underfill layers respectively surrounding the plurality of bumps, the underfill layers extending between the base chip and the lowermost semiconductor chip and between the semiconductor chips; and an encapsulant covering the base chip, the semiconductor chips, and the underfill layers.

Semiconductor package including a plurality of semiconductor chips

The present disclosure relates to a cleaner capable of easily separating a filter module from a main body of the cleaner and separating and assembling the separated filter module again. Disclosed is a cleaner including: a main body; a suction motor disposed in the main body and configured to generate a suction force so as to suction air; a dust separator separating dust from air by generating a cyclone flow in air introduced by the suction motor; and a filter module having a filter for filtering air discharged from the suction motor and being detachable from the main body. Here, the filter module is configured to be easily separated from the main body of the cleaner and assembled, such that the filter disposed inside the filter module may be easily cleaned or replaced.

Cleaner

An integrated circuit device includes a wiring structure, first and second inter-wiring insulating layers, redistributions patterns and a cover insulating layer. The wiring structure includes wiring layers having a multilayer wiring structure and via plugs. The first inter-wiring insulating layer that surrounds the wiring structure on a substrate. The second inter-wiring insulating layer is on the first inter-wiring insulating layer, and redistribution via plugs are connected to the wiring structure through the second inter-wiring insulating layer. The redistribution patterns includes pad patterns and dummy patterns on the second inter-wiring insulating layer. Each patterns has a thickness greater than a thickness of each wiring layer. The cover insulating layer covers some of the redistribution patterns. The dummy patterns are in the form of lines that extend in a horizontal direction parallel to the substrate.

Integrated circuit device having redistribution pattern

A vacuum cleaner including: a suctioning unit; a main body including a cyclone part for separating dust from suctioned air and a dust container for storing the separated dust, and a body cover for opening and closing the lower side of the body; a filter unit, disposed in the body, for filtering air separated from the dust; an actuating unit capable of moving in the body between the outside of the filter unit and the inner circumference surface of the body; an operating unit disposed outside the body which operates in order to move the actuating unit; a transmission unit penetrating the body and connecting the actuating unit with the operating unit; and an elastic member disposed outside the body which elastically supports the operating unit.

Vacuum cleaner

A cleaner includes a suction unit, a main body including a cyclone unit for separating dust from air suctioned through the suction unit, and a dust container that stores dust separated in the cyclone unit below the cyclone unit. A filter unit is disposed inside the cyclone unit for filtering the air, and a movable unit disposed inside the cyclone unit includes a cleaning part for cleaning the outer circumference of the filter unit. An operation unit disposed outside the main body moves the movable unit and the cleaning part to remove dust from the outer surface of the filter unit.

Filter and vacuum canister cleaner

An upper electrode used for a substrate processing apparatus using plasma is provided. The upper electrode includes a bottom surface including a center region and an edge region having a ring shape and surrounding the center region, a first protrusion portion protruding toward plasma from the edge region and having a ring shape, wherein the first protrusion portion includes a first apex corresponding to a radial local maximum point toward the plasma, and a first distance, which is a radial-direction distance between the first apex and a center axis of the upper electrode, is greater than a radius of a substrate.

Upper electrode and substrate processing apparatus including the same

A chip-stacked semiconductor package includes: a base chip having a base through via; a first chip stacked on the base chip in an offset form, wherein the first chip has a first exposed surface and a first through via electrically connected to the base through via; a first molding layer positioned on the base chip and covering a first non-exposed surface, facing the first exposed surface, of the first chip; a second chip stacked on the first chip in an offset form, wherein the second chip has a second exposed surface and a second through via electrically connected to the first through via; and a second molding layer formed on the first chip and covering a second non-exposed surface, facing the second exposed surface, of the second chip.

Chip-stacked semiconductor package with increased package reliability

A semiconductor package includes a substrate, a plurality of semiconductor devices stacked on the substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the substrate and the plurality of semiconductor devices, and molding resin surrounding the plurality of semiconductor devices. At least one of the underfill fillets is exposed from side surfaces of the molding resin.

Semiconductor package and method of manufacturing the same

A vacuum cleaner includes a suctioning unit, a main body including a cyclone unit for separating dust from the air suctioned through the suctioning unit, a body forming a dust container for storing the dust separated by the cyclone unit, and a body cover for opening and closing the lower side of the body. A filter unit is arranged in the body for filtering air. An actuating unit is configured to move in the body along a space between the outside of the filter unit and the inner circumferential surface of the body.

A cleaner of the present disclosure comprises: a suction part; a main body comprising a body and a body cover for opening and closing the lower side of the body, the body comprising a cyclone part for separating dust from dust masses suctioned through the suction part and a dust container for storing the dust separated by the cyclone part; a handle part coupled to the main body; a filter part disposed inside the body, and filtering air, separated from the dust in the cyclone part; a movable part capable of moving inside the body along a space between the outside of the filter part and the inner circumferential surface of the body; an operation part disposed at the outside of the main body to move the movable part; and a delivery part penetrating through the main body, and connecting the movable part to the operation part.

A semiconductor package may include a package substrate, semiconductor chips, signal bumps, and first and second heat dissipation bumps. The semiconductor chips may be stacked on an upper surface of the package substrate, have first and second regions having different heat dissipation efficiencies. The second temperature may be higher than the first temperature. The signal bumps may be arranged between the semiconductor chips. The first heat dissipation bumps may be arranged between the semiconductor chips in the first region by a first pitch. The second heat dissipation bumps may be arranged between the semiconductor chips in the second region by a second pitch narrower than the first pitch. Heat generated from the second region of the semiconductor chips may be dissipated through the second heat dissipation bumps, which may be relatively closely arranged with each other.

Growing community of inventors

Seoul, South Korea

Jungmin Ko