Samsung Electronics Co., Ltd.

Electronics and Telecommunications Research Institute

Junghyung Pyo

Kyungho Lee

Gyungock Kim

Duk Jun Kim

Seungjoon Lee

Bumsuk Kim

Jong Moo Lee

In Gyoo Kim

Jungbin Yun

Jeong Woo Park

Jihun Kim

Ki Seok Jang

Taesub Jung

Duk-Jun Kim

Jung Bin Yun

Sang Gi Kim

Gyung-Ock Kim

Sanghoon Kim

Sahnggi Park

Jung-Ho Song

Wooseok Choi

Dongwoo Suh

JiHo Joo

Jong-Moo Lee

Do Won Kim

Kap-Joong Kim

In-Gyoo Kim

Jongbum You

Dae Seo Park

Seungki Jung

Ki Seok Chang

Seungki Baek

An image sensor is provided. The image sensor includes: a pixel array including first and second pixel groups, each of which includes unit pixels arranged in 4×4 array, each of the unit pixels including a photodiode provided, and the first and second pixel groups being alternately disposed in multiple directions; a logic circuit configured to acquire pixel signals from the unit pixels; first microlenses provided on corresponding unit pixels in the first pixel groups; and second microlenses provided on four corresponding unit pixels of the unit pixels included in the second pixel groups. Each of the first and second pixel groups includes a device isolation layer provided between the unit pixels, and a color filter provided on the first surface, and each of the second pixel groups includes an overflow region configured to move electrical charges between adjacent photodiodes.

Image sensor comprising a pixel array including first pixel groups and second pixel groups with corresponding microlenses of different sizes for autofocusing

Disclosed is an image sensor comprising a semiconductor substrate that includes first through fourth pixel regions, each including first through fourth photoelectric conversion sections, and a pixel separation structure disposed in the semiconductor substrate and separating the first through fourth pixel regions from each other. The second pixel region is spaced apart in a first direction from the first pixel region. The fourth pixel region is spaced apart in a second direction from the first pixel region. The second direction intersects the first direction. The semiconductor substrate includes first impurity sections disposed on corresponding central portions of the first through fourth pixel regions, and a second impurity section disposed between the second and fourth pixel regions. Impurities doped in the first impurity sections have a conductivity type different from that of impurities doped in the second impurity section.

Image sensor with pixel separation structure

An image sensor may include a pixel isolation structure disposed in a semiconductor substrate to define a first pixel region, first and second photoelectric conversion regions disposed in the first pixel region, and a separation structure disposed in the first pixel region, between the first and second photoelectric conversion regions. The pixel isolation structure may include first pixel isolation portions, which are spaced apart from each other in a second direction and extend lengthwise in a first direction, and second pixel isolation portions, which are spaced apart from each other in the first direction and extend lengthwise in the second direction to connect to the first pixel isolation portions. The separation structure may be spaced apart from the pixel isolation structure in the first direction and the second direction, and is at least partly at the same level as the first and second photoelectric conversion regions in a third direction perpendicular to the first direction and the second direction.

Image sensor

An image sensor includes a pixel array with pixels arranged in a first direction and a second direction, intersecting the first direction. Each of the pixels includes a photodiode, a pixel circuit below the photodiode, and a color filter on or above the photodiode. A logic circuit acquires a pixel signal from the pixels through a plurality of column lines extending in the second direction. The pixels include color pixels and white pixels, the number of white pixels being greater than the number of color pixels. The pixel circuit includes a floating diffusion in which charges of the photodiode are accumulated and transistors outputting a voltage corresponding to amounts of charges in the floating diffusion. Each of the color pixels shares the floating diffusion with at least one neighboring white pixel, adjacent thereto in the second direction, among the white pixels.

An image sensor includes a pixel array including a plurality of pixel groups, each of the plurality of pixel groups including a plurality of unit pixels and sharing a single microlens, the plurality of unit pixels in each of the plurality of pixel groups including color filters of the same color, and a control logic configured to group the plurality of unit pixels of each of the plurality of pixel groups into a plurality of subgroups and to drive the pixel array for each subgroup. The plurality of subgroups include a first subgroup and a second subgroup. The control logic may be configured to obtain first image data corresponding to the first subgroup and second image data corresponding to the second subgroup, and the first subgroup and the second subgroup are provided with at least one unit pixel therebetween in the first direction or the second direction.

Image sensors

Provided is an image sensor including a pixel array including a plurality of auto focus (AF) pixels and a plurality of normal pixels, wherein each of the plurality of AF pixels comprises two sub-pixels, a light blocking member provided between the two sub-pixels, and a lens corresponding to the two sub-pixels, and wherein the light blocking member is shifted from an intermediate point of the two sub-pixels.

Image sensor including auto focus pixel

An image sensor is disclosed. The image sensor may include a semiconductor substrate including a first pixel group region and a second pixel group region, the first pixel group region including first pixel regions to sense a first light, the second pixel group region including second pixel regions to sense a second light, each of the first and second pixel regions arranged in n columns and m rows, a pixel isolation structure disposed in the semiconductor substrate to separate the first and second pixel regions from each other, first and second photoelectric conversion regions disposed in each of the first and second pixel regions of the semiconductor substrate, and a first separation structure disposed in each of the first pixel regions and in the semiconductor substrate between the first and second photoelectric conversion regions. The first separation structure may be spaced apart from the pixel isolation structure.

Image sensors are provided. An image sensor includes a semiconductor substrate including a pixel region. The image sensor includes first and second photoelectric conversion elements in the pixel region. The image sensor includes an isolation region between the first and second photoelectric conversion elements. The isolation region is off-center with respect to the pixel region.

Image sensors including shifted isolation structures

Provided is an electro-optic modulating device. The electro-optic modulating device includes an optical waveguide with a vertical structure and sidewalls of the vertical structure are used to configure a junction.

Electro-optic modulating device

Provided is an optical device, which includes a substrate, a first cladding disposed on the substrate, a first optical waveguide extended in a first direction on the first cladding, and having a first refractive index, a side grating formed in at least one side of the first optical waveguide, a second optical waveguide filling a space of the side grating, extended in a second direction across the first direction on the first cladding, and having a second refractive index, and a second cladding disposed on the second optical waveguide, and having a third refractive index, wherein the first refractive index is greater than the second refractive index, and the second refractive index is greater than the third refractive index.

Optical device

Provided are a waveguide structure and an arrayed waveguide grating structure. The arrayed waveguide grating structure includes an input star coupler, an output star coupler, and a plurality of arrayed waveguides optically connecting the input star coupler and the output star coupler. Each of the arrayed waveguides includes at least one section having a high confinement factor and at least two sections having a relatively low confinement factor. The sections of the arrayed waveguides having a high confinement factor have the same structure.

Waveguide structure and arrayed waveguide grating structure

Provided is a silicon array waveguide grating (AWG) device comprising a silicon array waveguide in which a plurality of optical waveguides formed of a lower cladding layer, a silicon core, and an upper cladding layer are arranged, wherein the variation of the refractive index of the silicon core is positive, and the upper cladding layer is formed of polymer, the variation of refractive index of which according to temperature is negative, which is opposite to the silicon core, and the cross-section of the silicon core varies between different areas to adjust the variation of the effective refractive index of the optical waveguide according to temperature.

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Seoul, South Korea

Junghyung Pyo