Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Junghyun Lee

Junghoon Kang

Youngju Lee

Changhyun Kim

Kihwan Kim

Junho Park

Junghoon Lee

Youngsoo Park

Youngjae Park

Jong-hyun Shin

Changjung Kim

Hyunchul Jung

Changhan Kim

Yoonsup Kim

Taeho Lee

Choonkeun Lee

Soonwan Chung

Bosoo Kang

Myungheon Kang

Yunjeong Kim

Byungmin Yu

Hwanseon Lee

Jieun Ban

Seong-Chan Park

Changhyun Yoon

A method for manufacturing a semiconductor package includes forming a pad pattern including a metal film on a semiconductor chip; forming an insulating layer covering the pad pattern and including an organic insulating material; and forming an opening exposing a surface of the metal film of the pad pattern by performing laser processing on the insulating layer, wherein, in forming the opening, a region to be plastically deformed on the metal film by the laser processing is formed.

Semiconductor package having pad pattern including plastically deformed metal film

A semiconductor package includes: a lower redistribution structure including a lower redistribution insulation layer, a bump pad in the lower redistribution insulation layer, and a lower redistribution pattern electrically connected to the bump pad, wherein the lower redistribution insulation layer includes: one or more sidewalls at least partially defining a cavity extending from a bottom surface of the lower redistribution insulation layer to an upper surface of the lower redistribution insulation layer; a passive component in the cavity of the lower redistribution insulation layer; an insulation filler in the cavity of the lower redistribution insulation layer, the insulation filler covering sidewalls of the passive component; a first semiconductor chip on the lower redistribution structure, the first semiconductor chip electrically connected to both the lower redistribution pattern and the passive component; and an external connection bump connected to the bump pad via a pad opening of the lower redistribution insulation layer.

Semiconductor package and method of manufacturing the same

An electronic device, according to various embodiments of the present disclosure, may comprise: a housing including a seating groove therein; a battery seated in the seating groove, at least a partial area of which includes a curved surface; and an adhesive member disposed between the battery and the seating groove and formed along at least a portion of an edge of the battery. The adhesive member may be formed having varied predetermined thicknesses, corresponding to a position of the battery.

Battery adhesive structure and electronic device comprising same

A compressor control apparatus includes a rectifier configured to rectify AC power to DC power; an inverter including a plurality of switching elements, configured to convert the DC power into a three-phase voltage according to a pulse width modulation (PWM) signal applied to the plurality of switching elements; a motor configured to receive a three-phase current based on the three-phase voltage; a current detector configured to detect a sum of a first phase current, a second phase current, and a third phase current supplied to the motor; and a controller configured to differently determine a duty ratio of the PWM signal applied to each of the plurality of switching elements, and to determine the first phase current, the second phase current, and the third phase current, respectively, based on the determined duty ratio and the sum of the currents detected from the current detector.

Apparatus and method of controlling compressor, and air conditioner including the same

An insulating film includes an insulating layer and a surface bonding layer disposed on the insulating layer. The surface bonding layer includes a radical generation element and a coordinate bond element. In the surface bonding layer, a/b is 0.05 or more and 0.35 or less, in which 'a' is an atom content of the coordinate bond element and 'b' is an atom content of the radical generation element.

Insulating film and printed circuit board including the same

Provided are a memory device formed using one or more source materials not containing hydrogen as a constituent element and a method of manufacturing the memory device.

Method of manufacturing a memory device

Growing community of inventors

Suwon-si, South Korea

Junghyun Lee