Lg Electronics Inc.

Samsung Electronics Co., Ltd.

Lg Chem, Ltd

Other

Seoul National University

Industry-university Cooperation Foundation Hanyang University

Doosan Heavy Industries & Construction Co., Ltd

Lg Magna E-powertrain Co., Ltd.

Junghwan Kim

Sangmyung Lee

Hyuk Sang Kwon

Minho Lee

Wonkeun Yang

Sungjin Kim

Dongki Noh

Sunggil Kim

Seulye Kim

Ikkyu Lee

Chanuk Kang

Seungmin Baek

Jeongwoo Ju

Heejae Jung

Jung Min Ko

Juhyeon Lee

Seungmin Lee

Jaewon Kim

Sanghun Kim

Junyoung Choi

Kyungtae Kim

Sunghun Lee

Won Jong Kwon

Jaedeok Lim

Sunghyup Kim

Jihoon Choi

Injae Lee

Jeonggil Kim

Jinwook Jung

Junyoung Lim

Chanhyoung Kim

Ohkug Kwon

Dongkyeng Han

Sangcheon Park

Dongkyum Kim

Hyein Park

Chan Yeup Chung

Seungdo Han

Yongjae Lee

Taejeong Kim

Jinho Ahn

Taejung Kwon

Byounggyu Park

Chanyeup Chung

HoSun Yoo

Ho Rim Lee

Seongchul Hong

Taewon Lee

Jungsik Kim

Taegu Kang

Tae-hyun Han

Youngduk Suh

Garam Lee

MoonSoo Kim

Dongwhan Lee

Yongchan Kim

Junbo Yun

Hoseop Jung

Hyunji Kim

Manshik Park

Heeseok Jeong

Yongsoo Kang

Jangseong Kim

Yunsung Kim

Seunghyun Jeong

Ingap Jang

Kilho Moon

Youngboong Kim

Byunggoo Kong

Ouiserg Kim

Seungha Yoon

Daerim Choi

Horim Lee

Seungjae Won

Jungyup Han

Sangbeom Park

Junghoon In

Insu Jang

Hyeonhwa Jang

Ghilgeun Oh

Jungho Seo

Kukbin Choi

Jaeuk Lee

Kilbock Lee

Sungsoo Lee

Suyoung Yun

Woonyong Choi

Shuang Liu

Jonghoon Park

Wonjong Kwon

A refrigerator includes a cabinet, a door opening/closing the cabinet and having an opening that is penetrated in a front/rear direction, a transparent panel assembly mounted to cover the opening and through which the inside of the refrigerant is seen, and a lighting member provided in the door or the cabinet to brighten a rear side of the transparent panel assembly. The transparent panel assembly includes a front panel defining an outer appearance of a front surface, a rear panel defining an outer appearance of a rear surface, a spacer made of a metal material and disposed between the front panel and the rear panel to define a periphery of the transparent panel assembly. A heater mounting part on which a heater is mounted is disposed on the spacer, and when the heater generates heat, one side of the front panel, which comes into contact with the spacer, is heated.

Refrigerator

A semiconductor fabrication apparatus comprising a light source configured to emit light, a substrate stage arranged to receive a substrate exposed to the emitted light, a reticle arranged between the substrate stage and the light source, and a reticle stage arranged to receive the reticle. The reticle stage including a lower plate, an upper plate arranged above the lower plate, an actuator connected to the lower plate configured to move in a direction parallel to the upper plate, a first cable slab arranged between the upper plate and the lower plate and connected to one side of the actuator, and a first cable cover that surrounds an outer periphery of the first cable slab and contacts the lower plate when the first cable slab becomes bent.

Semiconductor fabrication apparatus

An electronic device for performing wireless communication includes: a feeding line; a first antenna; a second antenna connected to the first antenna through the feeding line; a grip sensor disposed adjacent to and connected to the first antenna; at least one capacitor configured to match the first antenna and the second antenna; and an inductor electrically connecting the first antenna and the second antenna to each other.

Electronic device including grip sensor and antenna

An electronic device comprises housings including a first housing and a second housing configured to accommodate at least a portion of the first housing and guide sliding of the first housing, a flexible display including a first display area and a second display area extending from the first display area, and a monolithic support structure configured to support at least a portion of the second display area. The support structure includes a plate part and a plurality of bar-shaped parts protruding side by side from the plate part and disposed parallel to the plate part. The plate part and the plurality of bar-shaped parts are formed from a single monolithic structure. Each of the plurality of bar-shaped parts includes a second portion extending from the plate part and a first portion extending from the second portion, and a first width of the first portion is greater than a second width of the second portion. The plate part includes a plurality of openings located between adjacent ones of the bar-shaped parts.

Electronic device including support structure

In a moving robot and a control method according to the present disclosure, an obstacle is detected using structured light irradiated in a predetermined type of light pattern in a traveling direction while traveling, and a specified operation is performed in response to the obstacle. Moreover, a dangerous obstacle is recognized by extracting changes over time using a plurality of images for an obstacle or a low obstacle that is difficult to determine as detected data, and thus, it is possible to improve accuracy according to the determination of the obstacle, improve a corresponding operation according to the obstacle, minimize the uncleaned area while preventing restraint due to the obstacle, and improve the cleaning performance.

Moving robot and control method thereof

A refrigerator includes a door with a transparent display assembly that includes a front panel defining at least a portion of a front surface of the door, a touch sensor disposed on a rear surface of the front panel to recognize touch manipulation, a rear panel defining at least a portion of a rear surface of the door, an insulation coating layer provided on a surface of the rear panel by a metal oxide to block heat from the outside, an outer spacer disposed between the front panel and the rear panel to provide a sealed space between the front panel and the rear panel, a display disposed in the sealed space, a light guide plate spaced apart from the display to brighten up the display, and a spacer supporting the light guide plate and maintaining a distance between the display and the light guide plate.

Provided is a method of detecting a defective layer. A method, performed by a computing system, of detecting a defective layer of a semiconductor device including a plurality of layers includes obtaining candidate defective layer information regarding a plurality of candidate defective layers and obtaining physical structure information regarding the candidate defective layers, dividing each of wires in the candidate defective layers into virtual micro areas based on the candidate defective layer information and based on the physical structure information, and identifying a defective layer from among the candidate defective layers according to a number of the virtual micro areas.

Method of detecting defective layer of semiconductor device and computing system for performing the same

A robot cleaner according to an embodiment of the present invention comprises: a travelling part for moving a body; a memory for storing travel state information of the traveling part, which is recorded while a cleaning operation is performed on the basis of a first map; and a control part for discriminately detecting a first area and a second area divided from a plurality of cleaning areas corresponding to the first map, on the basis of the stored travel state information. Moreover, the control part may generate a second map by removing one of the first area and the second area from the first map, and then control the travelling part to perform a cleaning operation in a changed cleaning mode on the basis of the generated second map.

Robot cleaner and method for operating same

A silicon-based molten composition according to an exemplary embodiment is used in a solution growing method for forming a silicon carbide single crystal, includes silicon (Si), yttrium (Y), and iron (Fe), and is expressed in Formula 1.SiYFe  [Formula 1]

Silicon based melting composition and manufacturing method for silicon carbide single crystal using the same

A semiconductor package includes a first, second, third and fourth semiconductor chips sequentially stacked on one another. The second semiconductor chip includes a second substrate and a second substrate recess formed in an edge of a backside surface of the second substrate. The third semiconductor chip includes a third substrate and a first metal residual material provided in a peripheral region of a front surface of the third substrate. When the second semiconductor chip and the third semiconductor chip are bonded to each other such that the front surface of the third substrate and the backside surface of the second substrate face each other, the first metal residual material is located in the second substrate recess. A first bonding pad on the backside surface of the second substrate and a second bonding pad on the front surface of the third substrate are bonded to each other.

Semiconductor package and method of manufacturing the semiconductor package

A three-dimensional semiconductor device including a conductive layer disposed on a substrate and including a first conductivity-type impurity; an insulating base layer disposed on the conductive layer; a stack structure including a lower insulating film disposed on the insulating base layer, and a plurality of gate electrodes and a plurality of mold insulating layers alternately stacked on the lower insulating film, wherein the insulating base layer includes a high dielectric material; a vertical structure including a vertical channel layer penetrating through the stack structure and a vertical insulating layer disposed between the vertical channel layer and the plurality of gate electrodes, the vertical structure having an extended area extending in a width direction in the insulating base layer; and an isolation structure penetrating through the stack structure, the insulating base layer and the conductive layer, and extending in a direction parallel to an upper surface of the substrate, wherein the conductive layer has an extension portion extending along a surface of the vertical channel layer in the extended area of the vertical structure.

Three-dimensional semiconductor devices and methods of fabricating the same

An extreme ultraviolet (EUV) light generating apparatus includes a vessel including a first end and a second end opposite to each other and providing an internal space extending from the first end to the second end, a concave mirror adjacent to the first end of the vessel, a droplet generator supplying a droplet to the internal space of the vessel, a laser light source irradiating a laser beam to cause the droplet to emit EUV light, and a gas jet receiving a flow control gas and spraying the received flow control gas into the internal space of the vessel. The gas jet includes a ring-shaped main body including nozzles spaced apart from one another in a circumferential direction. The nozzles spray the received flow control gas in a downward direction.

Apparatus for generating extreme ultraviolet light and lithography apparatus including the same

The present disclosure provides a method for controlling a robot cleaner including a travel operation in which the robot cleaner travels, a recognition operation in which when the robot cleaner contacts an obstacle during the travel, the robot cleaner determines whether the obstacle is pushed by the robot cleaner and slides, and an obstacle bypass operation in which upon determination that the obstacle is the pushed-and-sliding obstacle, the robot cleaner stops the travel and then bypasses the pushed-and-sliding obstacle.

Robot cleaner and method for controlling the same

Growing community of inventors

Seoul, South Korea

Junghwan Kim