Pixtronix, Incorporated

Sharp Corporation, Sharp Kabushiki Kaisha

Junghun Chae

Asahi Yamato

Jasper Lodewyk Steyn

Takeshi Hara

Teruo Sasagawa

This disclosure provides systems, methods and apparatus including devices that include layers of passivation material covering at least a portion of an exterior surface of a thin film component within a microelectromechanical device. The thin film component may include an electrically conductive layer that connects via an anchor to a conductive surface on a substrate. The disclosure further provides processes for providing a first layer of passivation material on an exterior surface of a thin film component and for electrically connecting that thin film component to a conductive surface on a substrate. The disclosure further provides processes for providing a second layer of passivation material on any exposed surfaces of the thin film component after release of the microelectromechanical device.

Growing community of inventors

Newton, MA, United States of America

Junghun Chae