Lg Display Co., Ltd.

Samsung Electronics Co., Ltd.

Sun Bio, Inc.

Lg Electronics Inc.

Samsung Sdi Co., Inc.

Seoul National University

Junghoon Lee

Guensik Lee

Kyoseop Choo

ManHyeop Han

Seungman Ryu

Kunmo Chu

Yongkyun Choi

In Gun Kim

Manhyeop Han

Byonggwon Song

Ara Yoon

Moo Ho Lee

Moon Il Jung

In Su Lee

Hye Jeong Lee

Jiho Cho

Song Won Hyun

Nam Yong Gong

Changmin Hyun

Jaehyun Kim

Hyangmyoung Gwon

Hwanjin Jung

Myunghun Im

Kyungchul Woo

Hyundong Kim

Jaeduk Lee

Yong Joo Lee

Younghoon Lee

KiDuk Kim

Srinivas Chinthalapudi

Jaeseung Kim

NamYong Gong

Boreum Jeong

Youngjae Park

Junghwan Son

Deuk Kyu Moon

Chulhwan Lee

Myungsup Jung

Jong-hyun Shin

Woonbae Kim

Sejun Park

Ginam Kim

Kedar Santosh Kumar Aalla

Kwang Nho

Seungwon Jung

Chaehag Yi

Junghyun Lee

Thejeswara Reddy Pocha

Jeo Young Shim

Won Seok Chung

JungIm Han

Yoonsup Kim

Sungkyu Hwang

Sooyong Kim

JiHo Cho

Jaya Prakash Sivapuram

Howon Lee

Taeho Lee

Dongku Han

Chulho Bae

Jiyoung Yu

Bora Hyun

Ji-Ho Cho

Kyu Tae Yoo

Jieun Ban

Taeyun An

Jaesang Lim

Jinsu Jeong

Minjung Ahn

Wukang Kim

Minwook Jin

Hyoje Bang

Cheolsoo Kim

GuenSik Lee

Shrihari Shridhar Hegde

Min Jung Ahn

Yoon-suk Kang

Jonghyun Ha

Intae Kang

Ahra Cho

Misun Cha

Provided is a metal particle for adhesive paste. The metal particle may include a core including at least one metal; and a shell on at least one surface of the core and including at least one metal and nanoparticles. The metal particle may be a transient liquid phase particle and the at least one metal of the core may have a higher melting point than a melting point of the at least one metal of the shell. In addition, provided are a method of preparing the metal particle for adhesive paste, a composite bonding structure formed from the metal particle for adhesive paste, and a semiconductor device including the composite bonding structure.

Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure

A wireless communication method supporting a Rich Communication Suite (RCS) service, the method including performing an RCS provision operation corresponding to an Original Equipment Manufacturer (OEM) application in response to an RCS service request of the OEM application, transmitting an RCS function connection request to a Session Initiation Protocol (SIP) transport layer after the RCS provision operation is completed, controlling a session for an RCS function based on the RCS function connection request to obtain a dedicated bearer, and exchanging RCS media data with a network through the dedicated bearer.

Wireless communication apparatus supporting rich communication suite (RCS) and wireless communication method thereof

A display device and a mobile information terminal including the same are disclosed. The display device includes a display panel on which a fingerprint is touched, and a fingerprint sensor coupled to the display panel configured to sense light reflected from the fingerprint on a display area of the display panel. The fingerprint sensor is attached obliquely on the display panel at a predetermined angle to a reference line parallel to a long axis of the display panel.

Display device and mobile information terminal including the same

Provided are a hybrid bonding structure, a solder paste composition, a semiconductor device, and a method of manufacturing the semiconductor device. The hybrid bonding structure includes a solder ball and a solder paste bonded to the solder ball. The solder paste includes a transient liquid phase. The transient liquid phase includes a core and a shell on a surface of the core. A melting point of the shell may be lower than a melting point of the core. The core and the shell are configured to form an intermetallic compound in response to the transient liquid phase at least partially being at a temperature that is within a temperature range of about 20° C. to about 190° C.

Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices

A display apparatus includes a display panel including a pixel area in which a plurality of pixels is disposed and a peripheral area outside the pixel area; a transmissive light source disposed in a first area of the pixel area; and a timing controller which controls the transmissive light source not to emit light when pixels disposed corresponding to the first area of the pixel area among the plurality of pixels are present in at least one of an image data input period and a pixel light emission period.

Display apparatus including transmissive light source

Disclosed are a novel monofunctional polyethylene glycol (PEG) and derivatives thereof. More particularly, one terminal of each of the monofunctional polyethylene glycol and derivatives thereof is modified with a siloxy group. The novel monofunctional polyethylene glycol (PEG) offers an alternative to methoxy polyethylene glycol.

Siloxy polyethylene glycol and derivatives thereof

A semiconductor device including a stack structure including gate layers and interlayer insulating layers spaced apart in a vertical direction, a channel hole penetrating the stack structure in the vertical direction, a core region extending within the channel hole, a channel layer disposed on a side surface of the core region, a first dielectric layer, a data storage layer and a second dielectric layer, which are disposed between the channel layer and the gate layers, and a pad pattern disposed on the core region, in the channel hole, and in contact with the channel layer. A first horizontal distance between a side surface of a first portion of an uppermost gate layer and an outer side surface of the channel layer is greater than a second horizontal distance between a side surface of a second portion of the uppermost gate layer and an outer side surface of the pad pattern.

Semiconductor device

A laundry treating apparatus includes a first nozzle water supply conduit which is disposed, on the gasket, in the one side with respect to the vertical line and guides water discharged through the first circulation port to the pair of first nozzles; and a second nozzle water supply conduit which is disposed, on the gasket, in the other side with respect to the vertical line and guides water discharged through the second circulation port to the pair of second nozzles.

Laundry treating apparatus having a nozzle

A display apparatus comprises a display panel including a pixel area in which a plurality of pixels is disposed and a peripheral area outside the pixel area; a transmissive light source disposed in a first area of the pixel area; and a timing controller which controls the transmissive light source not to emit light when pixels disposed corresponding to the first area of the pixel area among the plurality of pixels are present in at least one of an image data input period and a pixel light emission period.

A hybrid bonding structure and a semiconductor including the hybrid bonding structure are provided. The hybrid bonding structure includes a solder ball and a solder paste bonded to the solder ball. The solder paste may include solder particles including at least one of In, Zn, SnBiAg alloy, or SnBi alloy, and ceramic particles. The solder paste may include a flux. The solder particles may include Sn(42.0 wt %)-Ag(0.4 wt %)-Bi(57.5&#x2212;X) wt %, and the ceramic particles include CeO(X) wt %, where 0.05&#x2264;X&#x2264;0.1.

Hybrid bonding structures and semiconductor devices including the same

According to an aspect of the present disclosure, a display device includes a display panel in which a plurality of sub-pixels is disposed. Also, the display device includes a data driver configured to supply a plurality of data voltages to the plurality of sub-pixels through a plurality of data lines. Further, the display device includes a gate driver configured to supply a plurality of gate signals to the plurality of sub-pixels through a plurality of gate lines. Each of the plurality of sub-pixels includes a light emitting diode, a driving transistor, and a variable resistance circuit disposed in series between a low-potential voltage terminal and a high-potential voltage terminal. When each of the plurality of sub-pixels implements a low grayscale, the variable resistance circuit increases a resistance between the high-potential voltage terminal and the driving transistor. Thus, a low grayscale can be normally implemented.

Display device

A compressor control apparatus includes a rectifier configured to rectify AC power to DC power; an inverter including a plurality of switching elements, configured to convert the DC power into a three-phase voltage according to a pulse width modulation (PWM) signal applied to the plurality of switching elements; a motor configured to receive a three-phase current based on the three-phase voltage; a current detector configured to detect a sum of a first phase current, a second phase current, and a third phase current supplied to the motor; and a controller configured to differently determine a duty ratio of the PWM signal applied to each of the plurality of switching elements, and to determine the first phase current, the second phase current, and the third phase current, respectively, based on the determined duty ratio and the sum of the currents detected from the current detector.

Apparatus and method of controlling compressor, and air conditioner including the same

The present disclosure relates to a flat panel display embedding an optical imaging sensor such as a fingerprint image sensor. The present disclosure provides a flat panel display embedding an image sensor comprising: a display panel including a display area and a non-display area; and a directional optical unit having a length and a width corresponding to the display panel and a thickness, and attached on a top surface of the display panel, wherein the directional optical unit includes: a first cover plate and a second cover plate having a size corresponding to the length and the width and joining each other by a first low refractive layer between the first cover plate and the second cover plate; a light radiating film corresponding to the display area under the second cover plate; a light incident film disposed outside of the display area at one lateral side of the light radiating film, under the second cover plate; a second low refractive layer disposed under the light radiating film and the light incident film, and attached on the top surface of the display panel; and a light source disposed at the lateral side of the display panel as facing with the light incident film.

Flat panel display embedding optical imaging sensor

A display apparatus including a large-area fingerprint sensor includes a display panel displaying an image; a touch panel sensing a touch of a finger; a fingerprint sensor including a plurality of fingerprint pixels and recognizing a fingerprint of the finger; a fingerprint sensor driver driving the fingerprint sensor and including a driver driving the fingerprint sensor and a fingerprint recognizer recognizing a fingerprint by using sensing signals received from the fingerprint sensor; and a touch driver driving the touch panel, wherein the driver of the fingerprint sensor driver provides a sensing gate signal to sensing gate lines included in a first touch block determined being touched by touch position information received from the touch driver, among m (where m being an integer of 2 or greater) number of sensing gate lines included in the fingerprint sensor.

Display apparatus including large-area fingerprint sensor

Growing community of inventors

Incheon, South Korea

Junghoon Lee