Samsung Electronics Co., Ltd.

Jungho Park

Youngju Lee

Dohyuk Ha

Kwanghyun Baek

Juneseok Lee

Seokhyun Lee

Jinsu Heo

Yeonho Jang

Jongyoun Kim

Dahye Kim

Jaegwon Jang

Jungyub Lee

Jiyoung Kang

Sanghoon Park

Youngsub Kim

Yunsu Lee

Mirae Jeong

Jinwoo Park

Minjun Bae

Taeho Hwang

Sangho Lee

Dongkyu Kim

Kyunghwan Lee

Jaeyong Jeong

Gwangjae Jeon

Sejin Kwak

Beomkyu Shin

Jaehun Lee

Kyoungho Jeong

Soohyung Kim

Junhyuk Lee

Young-Jun Cho

Byungman Lim

Sejeong Kwon

Bomyoung Kim

Hyonsok Lee

Wuseong Lee

Insu Kim

Yul Kim

Wonsuk Yang

A 5th Generation (5G) or pre-5G communication system for supporting a data transfer rate higher than that of a post-4th Generation (4G) communication system such as Long Term Evolution (LTE) is provided. The radio unit (RU) device includes a first printed circuit board (PCB) on which a plurality of antenna elements are disposed, a second PCB on which a radio frequency integrated circuit (RFIC) is disposed, and a third PCB configured to electrically connect each of the plurality of antenna elements and the RFIC between the first PCB and the second PCB, a first surface of the third PCB is coupled to a first surface of the first PCB through a grid array, and positions of feeding ports on the first surface of the third PCB correspond to positions in which ports of the plurality of antenna elements are disposed on a second surface opposite the first surface of the first PCB.

Electronic device including interposing board for antenna

An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.

Antenna assembly and electronic device including same

Provided are an artificial intelligence (AI) system using a machine learning algorithm and an application of the AI system. A device for providing content based on a knowledge graph includes: a memory storing instructions; and a processor configured to execute the instructions to: obtain context information related to the device; obtain a first device knowledge graph of a user of the device by inputting the obtained context information to a first AI model for determining a relation between entities related to the user of the device; request, from a server, a server knowledge graph generated by the server; receive the server knowledge graph; obtain a second device knowledge graph of the user by inputting the obtained first device knowledge graph and the received server knowledge graph to a second AI model for extending the first device knowledge graph; and provide content based on the obtained second device knowledge graph.

System and method for providing content based on knowledge graph

According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.

Antenna device and electronic device including the same

The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.

Separable antenna and electronic device comprising same

The disclosure relates to a pre-5-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.

Antenna module and device including same

An electronic device is disclosed. The electronic device comprises: a memory including at least one command; and a processor connected to the memory to control the electronic device, wherein by executing the at least one command, the processor obtains an image according to a user's interaction with the electronic device, obtains information about the user's intention according to information about an object obtained from the image and context information obtained during the interaction, and obtains information concerning the obtained object from a knowledge base stored in the memory, according to the information about the user's intention, wherein the knowledge base includes device information about a plurality of electronic devices used during the user's activity, object information about a plurality of objects obtained according to the activity, and intention information corresponding to correlative information, and the processor obtains, from the knowledge base, information concerning the obtained object according to the intention information corresponding to the obtained object.

Electronic device and control method therefor

An electronic apparatus is provided. The electronic apparatus includes a communication interface, a memory storing log data with respect to external devices connected to the electronic apparatus, and a processor configured to identify a plurality of external devices having a history of being connected to the same internet protocol (IP) based on the log data, acquire, based on the log data, a first feature vector with respect to a relationship between the plurality of external devices and a second feature vector with respect to each of the plurality of external devices, acquire a graph of the relationship between the plurality of external devices based on the first feature vector and the second feature vector, and define at least one group configured by the plurality of external devices based on the graph.

Electronic apparatus and method for controlling thereof

A display module package includes a semiconductor chip, a wiring member disposed on the semiconductor chip, including an insulating layer and a wiring layer, and contacting at least a portion of the semiconductor chip, a light emitting device array disposed on the wiring member and including a plurality of light emitting devices disposed on one surface, wherein the wiring member is between the semiconductor chip and the light emitting device, and a molding member disposed on the wiring member, sealing part of the light emitting device array, and having an opening for exposing the plurality of light emitting devices.

Display module package

A semiconductor package includes a semiconductor chip; a redistribution insulating layer including a first opening; an external connection bump including a first part in the first opening; a lower bump pad including a first surface in physical contact with the first part of the external connection bump and a second surface opposite to the first surface, wherein the first surface and the redistribution insulating layer partially overlap; and a redistribution pattern that electrically connects the lower bump pad to the semiconductor chip.

Semiconductor package and method of manufacturing the same

Provided are a wafer level package and a method of manufacturing the same, wherein an underfill sufficiently fills a space between a redistribution substrate and a semiconductor chip, thereby reducing warpage. The wafer level package includes a redistribution substrate including at least one redistribution layer (RDL), a semiconductor chip on the redistribution substrate, and an underfill filling a space between the redistribution substrate and the semiconductor chip. The underfill covers side surfaces of the semiconductor chip. The redistribution substrate includes a trench having a line shape and extending in a first direction along a first side surface of the semiconductor chip.

Wafer level package

A content recommendation is provided based on a knowledge graph using, for example, a processor and memory of a device. In some embodiments, sensors are used. The content recommendation efficiently makes user of the processor, memory and/or sensors. A knowledge graph is maintained at the device and another knowledge graph may be maintained at a server. The knowledge graph at the device is generated, for example, by obtaining log history information, generating a device knowledge graph, generating a pattern knowledge graph associated with a behavior pattern of a user, and/or updating the device knowledge graph by adding the pattern knowledge graph to the device knowledge graph. In some examples, the knowledge graph at the server is generated by a server, based on the pattern knowledge graph.

Method and apparatus for providing content based on knowledge graph

A semiconductor package includes a redistribution structure including a redistribution insulating layer and a redistribution pattern, a semiconductor chip provided on a first surface of the redistribution insulation layer and electrically connected to the redistribution pattern, and a lower electrode pad provided on a second surface opposite to the first surface of the redistribution insulating layer, the lower electrode pad including a first portion embedded in the redistribution insulating layer and a second portion protruding from the second surface of the redistribution insulating layer, wherein a thickness of the first portion of the lower electrode pad is greater than a thickness of the second portion of the lower electrode pad.

Growing community of inventors

Cheonan-si, South Korea

Jungho Park