Samsung Electronics Co., Ltd.

JungChak Ahn

Yitae Kim

Bumsuk Kim

Younggu Jin

Kyungho Lee

Jongeun Park

Youngwoo Jung

Min Hee Jang

Eunsub Shim

Jae-kyu Lee

Jung Bin Yun

Seungwook Lee

Hyuk Soon Choi

Junsung Park

Donghyuk Park

Min-Woong Seo

Changyong Um

Wook Su Lee

Jae Ho Kim

Jaekyu Lee

Kwanghee Lee

Dongchan Kim

Minwoong Seo

Heegeun Jeong

Hisanori Ihara

Uihui Kwon

Doowon Kwon

Minho Jang

Taechan Kim

Han Soo Lee

Byungjun Park

Dongmo Im

Moosup Lim

Youngsun Oh

SeungSik Kim

Minseok Oh

Sangjun Choi

Kyungrae Byun

Yujung Choi

Seungwon Cha

Dongseok Cho

Bokwon Kim

Dongyoung Jang

Cheolju Kang

Haekyung Kong

Euiyoung Song

Hyunyoung Yeo

An image sensor device includes a digital pixel that includes a photo detector, a comparator, and a memory circuit, a pixel driver that controls the digital pixel, and a digital logic circuit that performs a digital signal processing operation on a digital signal output from the digital pixel. The photo detector and a first portion of the comparator are formed in a first semiconductor die, a second portion of the comparator, the memory circuit, and the pixel driver are formed in a second semiconductor die under the first semiconductor die, and the digital logic circuit is formed in a third semiconductor die under the second semiconductor die.

Image sensor device

An image sensor is provided. The image sensor includes a semiconductor substrate including a first surface and a second surface opposite to each other. A semiconductor pattern is disposed on the first surface of the semiconductor substrate and it extends in a first direction perpendicular to the first surface. A buried transmission gate electrode is disposed in a transmission gate trench extending from the first surface of the semiconductor substrate to an interior of the semiconductor substrate. A first gate electrode at least partially surrounds a side wall of the semiconductor pattern and has a ring-shaped horizontal cross-section. A color filter is disposed on the second surface of the semiconductor substrate.

Image sensor having a gate electrode on a semiconductor pattern side wall

An image sensor includes a device isolation layer disposed in a substrate and defining pixel regions, and a grid pattern on a surface of the substrate. The grid pattern overlaps the device isolation layer between adjacent pixel regions in a direction perpendicular to the surface. The grid pattern has a width less than a width of the device isolation layer.

Image sensors

An image sensor chip includes a lower chip, an upper chip stacked on the lower chip and including a photoelectric element, a via hole penetrating through the upper chip and penetrating through at least a portion of the lower chip, and a conductive connection layer electrically connecting the lower chip and the upper chip to each other in the via hole. The upper chip includes an upper substrate, an upper isolation layer and an upper element on the upper substrate, a connection contact plug, and a multilayer interconnection line electrically connected to the connection contact plug. A distance between an upper surface of the connection contact plug and an upper surface of the upper isolation layer is greater than a distance between an upper surface of an upper gate electrode of the upper element and an upper surface of the upper isolation layer.

Image sensor chip

An image sensor may include a semiconductor substrate having a light receiving surface thereon and a plurality of spaced-apart semiconductor photoelectric conversion regions at adjacent locations therein. A grating structure is provided on the light receiving surface. This grating structure extends opposite each of the plurality of spaced-apart photoelectric conversion regions. An optically-transparent layer is provided on the grating structure. This grating structure includes a plurality of spaced-apart grating patterns, which can have the same height and the same width. In addition, the grating patterns may be spaced apart from each other by a uniform distance. The grating structure is configured to selectively produce &#xb1;1 or higher order diffraction lights to the photoelectric conversion regions, in response to light incident thereon.

Image sensors having grating structures therein that provide enhanced diffraction of incident light

An image sensor includes a pixel array having a plurality of pixels; a row driver providing the pixel array with a boosting signal; and a read-out circuit configured to read out pixel signals output from pixels of a row line selected by the row driver. Each of the plurality of pixels includes: a first photodiode; a transmission transistor connected to the first photodiode; a first floating diffusion node, a second floating diffusion node, and a third floating diffusion node, which are connected to the transmission transistor to accumulate charges generated by the first photodiode; an LCG capacitor connected to the third floating diffusion node to accumulate the charges generated by the first photodiode; an MCG transistor connected between the first floating diffusion node and the second floating diffusion node; and an LCG transistor connected to the third floating diffusion node.

Image sensor including DRAM capacitor and operating method thereof

The inventive concepts provide an auto-focus image sensor and a digital image processing device including the same. The auto-focus image sensor includes a substrate including at least one first pixel used for detecting a phase difference and at least one second pixel used for detecting an image, a deep device isolation portion disposed in the substrate to isolate the first pixel from the second pixel, and a light shielding pattern disposed on the substrate of at least the first pixel. The amount of light incident on the first pixel is smaller than the amount of light incident on the second pixel by the light shielding pattern.

Auto-focus image sensor and digital image processing device including the same

A method of driving an image sensor includes integrating an overflowed charge from a photodiode in the floating diffusion area and a dynamic range capacitor. The dynamic range capacitor is formed between the floating diffusion area and a power supply voltage. The method further includes sampling a first voltage formed in the floating diffusion area by the integrated overflowed charge, resetting the photodiode, the floating diffusion area, and the dynamic range capacitor, sampling a reset level of the reset floating diffusion area, transferring a charge accumulated in the photodiode to the floating diffusion area, and sampling a second voltage formed in the floating diffusion area.

Image sensor and driving method thereof

An image sensor includes a substrate including unit pixels. Each of the unit pixels includes photoelectric conversion elements and storage diodes.

A complementary metal oxide semiconductor (CMOS) image sensor is provided that includes a substrate including a first surface, a second surface facing the first surface, and a first recess region that is recessed from the first surface toward the second surface. The CMOS image sensor further includes a transfer gate on the substrate, and a source follower gate on the first recess region. The source follower gate is within the first recess region and partially covers a portion of the first surface of the substrate.

CMOS image sensors including a vertical source follower gate

Growing community of inventors

Yongin-si, South Korea

JungChak Ahn