Samsung Display Co., Ltd.

Jung Yun Jo

Jeong Do Yang

Ji Hye Han

Jeong Ho Hwang

Byoung Yong Kim

Su Bin Bae

Eun Jeong Cho

Seung-soo Ryu

Seung-Hwa Ha

Sung Hoon Yang

Ki Seong Seo

Chul Min Bae

Sang Hyeon Song

Kwang Hyun Kim

Yun Jong Yeo

Ki Kyung Youk

Young In Hwang

Seung Hwa Ha

Chung-Seok Lee

Yung Bin Chung

Chang Ok Kim

Jin Suk Lee

Jang-Kyum Kim

Cheol Geun An

Eun Jin Kwak

Chui Min Bae

Chul-Hyun Baek

Provided is a display device. The display device comprises a first substrate, a barrier layer disposed on the first substrate and having amorphous carbon, a first pad part disposed on the barrier layer, a second substrate disposed on the first pad part, a display layer disposed on the second substrate, and a second pad part disposed on a bottom surface of the first substrate and inserted into a first contact hole formed in the first substrate and the barrier layer.

Display device having a pad part disposed on a barrier layer, method of manufacturing the same and tiled display device including the same

A display device includes a buffer layer disposed on a substrate and comprising a first buffer film, and a second buffer film, wherein the first buffer film and the second buffer film are sequentially stacked in a thickness direction of the display device; a semiconductor pattern disposed on the buffer layer; a gate insulating layer disposed on the semiconductor pattern; and a gate electrode disposed on the gate insulating layer, wherein the first buffer film and the second buffer film comprise a same material, and a density of the first buffer film is greater than a density of the second buffer film.

Display device

A display device includes a substrate including pixels; a buffer layer disposed on the substrate; an etch stopper layer disposed between the substrate and the buffer layer; and at least one penetrating-hole penetrating the substrate, the buffer layer, and the etch stopper layer, wherein the etch stopper layer includes amorphous carbon.

Display device and manufacturing method thereof

A display device includes a substrate; a first circuit part and a second circuit part on the substrate and spaced from each other in a first direction; and an emission part between the first circuit part and the second circuit part, the emission part being located between the first circuit part and the second circuit part in a direction parallel to the substrate, wherein the first circuit part includes a first electrode extending to the emission part, wherein the second circuit part includes a second electrode extending to the emission part, and wherein the emission part includes a light emitting element located between the first electrode and the second electrode.

A display device and a method of manufacturing the same are provided. The display device, comprises a first base substrate, a first barrier layer disposed on the first base substrate, a second base substrate disposed on the first barrier layer, at least one transistor disposed on the second base substrate, and an organic light emitting diode disposed on the at least one transistor, wherein the first barrier layer includes a silicon oxide, and has an adhesion force of 200 gf/inch or more to the second base substrate.

Display device of reducing the occurrence of optical afterimages and method of manufacturing the same

Display device including an amorphous carbon layer and manufacturing method thereof

Display device and method of fabricating the same

An electronic device includes a substrate; and a pad area on the substrate, the pad area including: a first pad part including a first pad terminal; a second pad part on a side of the first pad part in a first direction and including a second pad terminal; and a third pad part on the other side of the first pad part in the first direction and including a third pad terminal, each of the first pad terminal, the second pad terminal and the third pad terminal including a first long side, a second long side facing the first long side, and at least one bridge extending from the first long side to the second long side, the first long side of the first pad terminal extending in a second direction intersecting the first direction.

A liquid crystal display includes: a lower display panel including a lower polarizing plate disposed between a lower transparent substrate and a passivation layer of the lower display panel; and an upper display panel including an upper polarizing plate disposed between an upper transparent substrate and a passivation layer of the upper display panel, wherein at least one of the lower polarizing plate and the upper polarizing plate is a reflection type polarizing plate and includes a plurality of linear patterns arranged so as to be extended in one direction and a hydrophobic layer covering at least portion of side wall portions of the linear patterns.

Liquid crystal display and manufacturing method thereof

A semiconductor chip includes: a base substrate; a conductive pad on one surface of the base substrate; an insulating layer on the one surface of the base substrate and having an opening exposing a portion of the conductive pad; and a bump on the exposed portion of the conductive pad and on the insulating layer around the opening. The bump includes a plurality of concave portions corresponding to the opening and is arranged in a longitudinal direction of the bump.

Semiconductor chip, electronic device including the same, and method of connecting the semiconductor chip to the electronic device

A display device includes: a substrate; a pad portion in a non-display area of the substrate and including a plurality of pads; a driver arranged at the pad portion to contact the pads; an interlayer insulating layer on the substrate; and an auxiliary layer in the non-display area, and each of the pads includes a first pad electrode, a second pad electrode, and a third pad electrode, which are sequentially arranged on the substrate, a width of the third pad electrode is greater than a width of the second pad electrode and a width of the first pad electrode, and a thickness of the auxiliary layer between the third pad electrode and the interlayer insulating layer is thicker than a thickness of the auxiliary layer between the third pad electrode and the second pad electrode.

A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.

A circuit board, a display device including the same, and a method of manufacturing a circuit board are provided. A circuit board includes a base substrate, a wiring line provided on the base substrate, a passivation layer provided on the wiring line, an elastic bump provided on the passivation layer, and a conductive layer provided on the elastic bump. The passivation layer includes a first opening and a second opening that expose a partial region of the wiring line, and the second opening is arranged in a region adjacent to the first opening.

Circuit board, display device including the same, and method of manufacturing the circuit board

A display device includes: a flexible substrate having a display area for displaying an image and a peripheral area outside the display area; a first pad electrode in the peripheral area of the flexible substrate; and a driver connected to the first pad electrode. The driver includes: a circuit board including a driving circuit; a second pad electrode on one side of the circuit board and facing the first pad electrode; a convex structure on one side of the second pad electrode and having an oval cross-section; and a bump electrode on one side of the convex structure and connected to the first pad electrode. The bump electrode includes a column covering the convex structure and a convex portion extending from one side of the column and protruding to the first pad electrode.

An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the pad electrode through a contact hole. The passivation layer includes an insulating portion having a first thickness and covering an adjacent edge region of the pad electrode and the substrate, and a bump portion having a second thickness, that is greater than the first thickness, and covering a center portion of the pad electrode.

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Namyangju-si, South Korea

Jung Yun Jo