Industrial Technology Research Institute

Taiwan Semiconductor Manufacturing Comp. Ltd.

Jung-Yu Li

Yi-Ping Lin

Shih-Pu Chen

Guan-Yu Chen

Lian-Yi Cho

Jin-Han Wu

Sheng-Chen Wang

Wei-Chih Lin

Cheng-Chang Chen

Ming-Chung Liu

Cheng-Hung Li

Feng-Inn Wu

ChunHung Chen

Po-Hung Wang

Shih-Sian Huang

Yen-I Chou

Shu-Bin Hsu

Ren-Guei Lin

Li-Ling Lee

Ching-Sung Hsiao

Ta-Wei Chien

Jung-Ya Hsieh

Huei-Jhen Siao

A method includes supplying slurry onto a polishing pad; holding a wafer against the polishing pad with a piezoelectric layer interposed vertically between a pressure unit and the wafer; exerting a force on the piezoelectric layer using the pressure unit to make the piezoelectric layer directly press the wafer; generating, using the piezoelectric layer, a first voltage corresponding to a first portion of the wafer and a second voltage corresponding to a second portion of the wafer; tuning the force exerted on the piezoelectric layer according to the first voltage and the second voltage; and polishing, using the polishing pad, the wafer.

Polishing head, chemical-mechanical polishing system and method for polishing substrate

A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.

Method of using polishing pad

A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves, a first material property of the first region varies in a thickness direction of the polishing pad, each of the plurality of first grooves extends through at least two variations in the first material property, and the first material property comprises porosity, specific gravity or absorbance. The method further includes spreading the slurry across a second region of the polishing pad at a second rate different from the first rate, wherein the second region comprises a plurality of second grooves.

A method includes supplying slurry onto a polishing pad. A wafer is held against the polishing pad with a first piezoelectric layer interposed between a pressure unit and the wafer. A first voltage generated by the first piezoelectric layer is detected. The wafer is pressed, using the pressure unit, against the polishing pad according to the detected first voltage generated by the first piezoelectric layer. The wafer is polished using the polishing pad.

A polishing pad includes a first region having a first geometric property and a first material property. The polishing pad further includes a second region having a second geometric property and a second material property, wherein the second region is closer to an edge of the polishing pad than the first region. The first geometric property is different from the second geometric property; or the first material property is different from the second material property.

Polishing pad and method of using

A polishing head includes a carrier head and a plurality of pressure units arranged on the carrier head. At least two of the pressure units are located on the same circumferential line relative to a center axis of the carrier head.

A panoramic vision system includes a processor configured to convert received images into images in a spherical coordinate; a memory coupled to the processor and configured to store the images in the spherical coordinate; and a spherical display coupled to the processor, wherein the spherical display has a sphere center, the spherical display comprises a plurality of light-emitting-diode pixels being arranged according to the spherical coordinate, there is a same radial distance between each light-emitting-diode pixel of the plurality of light-emitting-diode pixels and the sphere center, in the plurality of light-emitting-diode pixels, there is a same azimuth spacing between adjacent two of the plurality of light-emitting-diode pixels at a zenith angle, and there is a same zenith spacing between adjacent two of the plurality of light-emitting-diode pixels at an azimuth angle.

Panoramic vision system

A light emitting device is disclosed, including a first electrode layer, a second electrode layer, and an organic light emitting layer sandwiched between the first and second electrode layers. The second electrode layer is patterned to form a plurality of electrode patterns arranged with different densities. The organic light emitting layer is subjected to a color separation process to form a plurality of monochromatic blocks that correspond to the electrode patterns, respectively. The electrode patterns are divided into a plurality of electrode pattern groups arranged in an alternate manner. The electrode pattern groups display a same image, and a same voltage is applied to the electrode pattern groups at a same time. Alternatively, the electrode pattern groups display different images, and a same or different voltages are applied to the electrode pattern groups at different times. As such, the light emitting device generates grayscale, full-color, three-dimensional or dynamic images.

Light emitting device free of TFT and chiplet

A light emitting device includes an electrode layer, a first metal layer, an organic material layer and a second metal layer stacked sequentially. The first metal layer includes a first metal portion and a second metal portion separated from the first metal portion at a first lateral distance, and the first metal portion and the second metal portion have a first period. The organic material layer includes a first emitting region separating the first metal portion and the second metal portion. The first lateral distance and the first period enable a lateral plasma coupling generated between the first metal portion and the second metal portion, such that light generated by the organic material layer at the first emitting region has a gain in a first waveband, or a peak wavelength of the light generated by the first emitting region shifts to the first waveband.

Light emitting device

A light emitting device includes a substrate layer, first and second metal layers sequentially formed on the substrate layer, and an organic material layer formed between the first and second metal layers. The first metal layer has a uniform thickness or has metal portions or further has an open portion exposing a portion of the surface of the substrate layer. The organic material layer includes a hole transport material and an electron transport material in contact with one another. An interaction between the hole transport material and the electron transport material generates exciplexes capable of emitting light having a peak wavelength in a first range, and a coupling is generated between the first and second metal layers. By adjusting the distance between the first and second metal layers or the thickness of the first metal layer, the peak wavelength of the light is shifted to a second range and/or a third range.

A light emitting element is provided, including a first electrode layer, a second electrode layer, and an organic light emitting layer sandwiched between the first electrode layer and the second electrode layer. The organic light emitting layer is patterned to include a plurality of light emitting blocks with different densities. In an embodiment, the light emitting blocks are divided into a plurality of light emitting block groups that are arranged in an alternate manner. In another embodiment, a light emitting element includes a first electrode layer, a first organic light emitting layer, a charge generating layer, a second organic light emitting layer, and a second electrode layer sequentially stacked on one another. The first and second organic light emitting layer are patterned to form a plurality of first and second light emitting blocks with different densities, respectively. Thus, the light emitting element generates full-color, gray-scale, three-dimensional, or dynamic images.

Light emitting element

A light emitting element is disclosed, including a substrate layer, a first metal layer and a second metal layer stacked sequentially on the substrate layer, and an organic material layer disposed between the first metal layer and the second metal layer. The first metal layer includes a first metal portion and a second metal portion that cover a surface of the substrate layer, and an opening portion disposed between the first metal portion and the second metal portion and exposes a portion of the surface. The organic material layer emits light having a wavelength within a first range. A first coupling generated between the first metal portion and the second metal layer shifts the light from the first range to a second range. A second coupling generated between the second metal portion and the second metal layer shifts the light from the first range to a third range.

A light emitting device includes a substrate, a coupling unit and an organic light emitting unit. The coupling unit includes a first conductive layer, a first light emitting layer and a second conductive layer. The first conductive layer is located on the substrate. The first light emitting layer is located between the first conductive layer and the second conductive layer. The organic light emitting unit is located adjacent to the second conductive layer.

A blue light emitting device includes an electrode layer, a first metal layer, a second metal layer formed between the electrode layer and the first metal layer, and an organic material layer formed between the first metal layer and the second metal layer and including a blue shift light emitting sub-layer. A peak of a first light-emitting spectrum of the blue shift light emitting sub-layer, which ranges within 490-550 nm, is shifted to a peak of a second light-emitting spectrum, which is less than 510 nm, by the surface plasmon coupling between the first metal layer and the second metal layer. A light emitting device is further provided, which is sequentially stacked with a first metal layer, an organic material layer having a blue shift light emitting sub-layer, a second metal layer having a metal portion and an opening portion, an electrode layer, and a light emitting layer doped with a dopant material, to emit white light.

Blue light emitting device and light emitting device

An organic light emitting diode (OLED) light source device is provided, including a lower substrate, a plurality of OLED modules disposed on the lower substrate and arranged in a matrix, a bus circuit surrounding the OLED modules to form a mesh structure and connecting the OLED modules in parallel, and an upper substrate disposed on the OLED modules and the bus circuit. The bus circuit connects the OLED modules in parallel. Therefore, the OLED light source device can be arbitrarily cut into different shapes, and its service life and light emitting performance are not affected by the cutting.

Growing community of inventors

Hsinchu, Taiwan

Jung-Yu Li