Samsung Electro-mechanics Co., Ltd.

Jung Won Park

Hye Won Kim

Chae Dong Lee

Og Soon Kim

Byung Jun Jeon

Chul Seung Lee

Yoo Jeong Lee

Won Kuen Oh

Woo Kyung Sung

Hyung Jong Choi

Kwang Yeun Won

So Jung An

A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.

Multilayer electronic component

A multilayer electronic component includes: a body and an external electrode disposed on the body, wherein the external electrode includes a conductive resin layer containing a bisphenol A-based resin and a biphenyl-based resin with a specific mixing ratio (e.g., a ratio of a content of the biphenyl-based resin with respect to a total content is 10 wt % or more and 50 wt % or less). Such a resin mixing ratio between the bisphenol A-based resin and the biphenyl-based resin can lead to 0.337≤2*C/A≤0.367 or 0.048≤B/A≤0.14, with an aromatic ring peak intensity (A), a carbonyl peak intensity (B), and an alcohol peak intensity (C) in a Fourier transform infrared spectroscopy (FT-IR) analysis. The multilayer electronic component showing such peak intensity characteristics can suppress oxidation of a conductive resin layer while also securing excellent adhesive strength of the conductive resin layer.

A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.

A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.

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Suwon-si, South Korea

Jung Won Park