Hynix Semiconductor Inc.

Jung Tae Jeong

Tae Yong Lee

Ki Bum Kim

Bok Gyu Min

Jae Myun Kim

Da Un Nah

A spiral staircase shaped stacked semiconductor package is presented. The package includes a semiconductor chip module, a substrate and connection members. The semiconductor chip module includes at least two semiconductor chips which have chip selection pads and through-electrodes. The semiconductor chips are stacked such that the chip selection pads are exposed and the through-electrodes of the stacked semiconductor chips are electrically connected to one another. The substrate has the semiconductor chip module mounted thereto and has connection pads. The connection members electrically connect the chip selection pads to respective connection pads.

Growing community of inventors

Gyeonggi-do, South Korea

Jung Tae Jeong