Delta Electronics, Inc.

Jung-Sung Shih

Yu-Hung Huang

Chin-Ming Chen

Wei-Fang Wu

The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.

Heat dissipation module

A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.

Growing community of inventors

Taoyuan Hsien, Taiwan

Jung-Sung Shih