Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Wellysis Corp.

Inka Entworks, Inc.

Samsung Display Co., Ltd.

Skhynix Inc.

Korea University Research and Business Foundation

Samsung Medison Co., Ltd.

Moohan Co., Ltd.

Industry-University Cooperation Foundation Hanyang University

Quantamatrix Inc.

Jung Soo Kim

Jin Won Lee

Dae Jung Byun

Sang Hyun Sim

Chang Min Ha

Sung Hawn Bae

Jong Woo Kim

Byung Ki Moon

Pyung Hwa Han

Young Juhn

Rick Hongryul Kim

Tae Hong Min

Won Jin Choi

Jun Seok Oh

Jung Geun Park

Byoung Ha Cho

Won Hyung Lee

Yong Il Kim

Jung Hoon Park

Doo Hwan Lee

Jung Wook Lee

Bum Jun Kim

Dek Gin Yang

Mi Sun Hwang

Yeon Kyoung Jung

Jae-Sung Rieh

Chang Hoon Lee

Yu Sin Yang

Joo Namkung

Joong Kyung Park

Hyung Ho Kim

Chung Sam Jun

Myung Gun Chong

Won Woo Cho

Ha Il Kim

Joo Ho Kim

Kyong Il Kim

Jae Min Nam

Cheol Ho Shin

Sang Tae Sim

Jun Ho Hong

Duck Young Maeng

Won Ho Shin

Seung Yeol Lee

Sung Hoan Kim

Do Hyun Kim

Seok Jun Ahn

Heon Chol Kim

Soo Seok Lee

Tae Geun Lim

Young Gun Lee

Ga Hee Park

Soo Ah Lee

Gi Yoon Lee

Sung Chui Hur

Young Seok Hong

Jin Kwan Kim

Dong Young Kim

Soo Yun Kim

Do Yoon Lee

Jae Woo So

Ha Jun Song

Dae Sik Kim

Tae Hyung Kwon

Jin Choul Lee

Hun Hyeon Im

Yeon Ju Kwon

Eun Young Hwang

Woo Seok Jeon

Hyoung Gil Choi

Sang Man Koo

Su Myeong Lee

Seong Chul Shin

Eun Gu Jung

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

Printed circuit board and manufacturing method for the same

A fail data augmentation device may input a plurality of fail data units to a data augmentation model, obtain a plurality of augmented fail data units outputted from the data augmentation model, and delete one or more of the augmented fail data units. The plurality of fail data units and the plurality of augmented fail data units includes a first parameter indicating one of a plurality of banks included in a random access memory, a second parameter indicating one of a plurality of matrices included in the bank corresponding to the first parameter, and a third parameter indicating one of a plurality of hex units included in the matrix corresponding to the second parameter respectively.

Fail data augmentation device and method for random access memory

A printed circuit board includes an insulating layer; an interconnection layer disposed on the insulating layer, and including a plurality of metal pads for mounting a semiconductor chip thereon; and a solder resist layer disposed on the insulating layer and covering the interconnection layer, the solder resist layer having a plurality of openings respectively exposing at least a portion of at least one of the plurality of metal pads. A rectangular region created by substantially connecting outer edges of outermost openings among the plurality of openings in a straight line is substantially equally divided into a plurality of cells, and a ratio of areas of the metal pads disposed in each cell to an area of each cell is calculated, and when a maximum value thereof is Pand a minimum value thereof is P, (P−P)*100≤20.

Printed circuit board

Charger

A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

Attachable biosignal sensing device

A fan-out semiconductor package includes a core member having a through hole, at least one dummy structure disposed in the core member, a semiconductor chip disposed in the through hole and including an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of each of the core member and the semiconductor chip, and filing at least a portion of the through hole, and a connection member disposed on the core member and the active surface of the semiconductor chip, and including a redistribution layer electrically connected to the connection pad.

Fan-out semiconductor package

A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.

Flexible printed circuit board and electronic device including the same

A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.

Printed circuit board and substrate including electronic component embedded therein

A storage device assembly is provided. The storage device assembly includes a latch assembly having a body and a hook mounted on the body, the hook having elasticity and having distal ends thereof bend away from the body; and a storage device to be joined to the latch assembly. The storage device includes a memory module including a memory connector, and a first enclosure and a second enclosure that encase the memory module except for an opening through which the memory connector is accessible. The first enclosure includes fixing holes corresponding to the distal ends of the hook and configured to accommodate the distal ends of the hook in a configuration in which the storage device is joined to the latch assembly.

Storage device, latch assembly and storage device assembly comprising the same

Provided are a system and method for informing of attachment positions of electrocardiogram (ECG) electrodes to improve the quality of ECG data. The system includes a judgment indicator extractor configured to extract a plurality of judgment indicator values from ECG data obtained through ECG electrodes, a reference value setter configured to, in a user-specific reference value setting mode, collect the judgment indicator values for a plurality of pieces of ECG data extracted by the judgment indicator extractor and set user-specific reference values for each judgment indicator, a similarity determiner configured to, in an ECG measurement mode, determine similarity by comparing a plurality of judgment indicator values extracted by the judgment indicator extractor with the user-specific reference values, and an electrode attachment position guide configured to inform a user of attachment positions of the ECG electrodes according to a similarity determination result of each of the judgment indicator values.

System and method for informing of attachment positions of ECG electrodes

A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.

Cable substrate

A vacuum dryer including a chamber configured to provide an interior space, support pins in the interior space proximate to a bottom of the chamber, a power supply configured to supply power to the support pins, and a pump coupled to the interior space in the chamber.

Vacuum dryer

A head-mounted display (HMD) apparatus includes a main body having a first surface facing a user's facial side, at least one connecting part connected to at least one surface of the main body, and a wearing part having a strap form, the wearing part being connected to the at least one connecting part and surrounding a portion of a head of the user such that the main body is held on the user's facial side. The main body includes a first support part extending from a portion of the first surface. The wearing part includes a second support part formed on an inner circumferential surface of a front portion of the wearing part facing a forehead of the user. The first support part and the second support part are supported on the user's forehead, thereby minimizing pressure exerted on zygomatic regions and relieving pressure and weight felt by the user.

Head-mounted display apparatus

Growing community of inventors

Suwon-si, South Korea

Jung Soo Kim