Skhynix Inc.

Jung Shik Jang

Dong Hun Lee

Jung Dal Choi

Mi Seong Park

Won Geun Choi

In Su Park

Jang Won Kim

Ki Hong Lee

Jeong Hwan Kim

Dong Sun Sheen

Jin Kook Kim

Sung Yong Chung

Se Young Oh

Sung Hoon Lee

Yun Sik Choi

Hee Youl Lee

Hoon Moo Choi

Jae Woong Kim

Ji Hyun Seo

Tae Gyun Kim

Se Hoon Kim

Woo Pyo Jeong

Seok Min Choi

Rho Gyu Kwak

A semiconductor device includes a first gate structure including a plurality of first conductive layers and a plurality of first insulating layers that are alternately stacked; an isolation insulating layer located in the first gate structure, the isolation insulating layer including a first line portion extending in a first direction, a plurality of first protrusions protruding from the first line portion towards one side of the first line portion in a second direction, and a plurality of second protrusions protruding from the first line portion towards another side of the first line portion in an opposite direction to the first protrusions, wherein the second direction is orthogonal to the first direction; a plurality of first memory patterns, wherein one of the plurality of first memory patterns surrounds one of the plurality of first protrusions; and a plurality of first passivation patterns, wherein one of the plurality of first passivation patterns is located between the first line portion and one of the plurality of first memory patterns.

Semiconductor device and manufacturing method of semiconductor device

A semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device including a stacked body including conductive patterns and insulating patterns that are alternately stacked, a filling layer configured to pass through the stacked body, a first channel layer configured to pass through the stacked body and coupled to the filling layer, a second channel layer configured to pass through the stacked body and coupled to the filling layer, a first interposed layer configured to pass through the stacked body and disposed between the first channel layer and the filling layer, a second interposed layer configured to pass through the stacked body and disposed between the second channel layer and the filling layer, and a memory layer surrounding the filling layer, the first and second channel layers, and the first and second interposed layers.

Semiconductor device and method of manufacturing the semiconductor device

A semiconductor device includes a gate structure including conductive layers and insulating layers alternately stacked with each other, channel structures passing through the gate structure and arranged in a first direction, a cutting structure extending in the first direction and passing through the channel structures, and a first slit structure passing through the gate structure and extending in a second direction crossing the first direction.

Semiconductor device with improved cell density and manufacturing method of the semiconductor device

The present technology includes a semiconductor memory device and a method of manufacturing the semiconductor memory device. The semiconductor memory device includes a first stack structure over a lower structure in which a cell region and a slimming region are defined, including a plurality of first gate lines, a first interlayer insulating structure over the first stack structure, a second stack structure over the first interlayer insulating structure, and a plurality of vertical plugs passing through the first stack structure, the first interlayer insulating structure and the second stack structure in the cell region.

Three-dimensional NAND semiconductor memory device with intervening plug and method of manufacturing the semiconductor memory device

A semiconductor memory device and a method of manufacturing the semiconductor memory device are provided. The semiconductor memory device includes a gate stacked structure with a cell array region and a contact region with a stepped shape, and a roughness of a first sidewall of the cell array region is greater than that of a second sidewall of the contact region.

Three-dimensional semiconductor memory device

A semiconductor memory device includes a first conductive pattern, a second conductive pattern configured to overlap a first line component of the first conductive pattern and to leave exposed a first pad component of the first conductive pattern. The semiconductor memory device also includes an interlayer insulating layer between the first conductive pattern and the second conductive pattern. The semiconductor memory device further includes a first conductive contact and a first insulating pillar extending from the first pad component of the first conductive pattern in opposite directions.

Semiconductor memory device and method of manufacturing the semiconductor memory device

The present technology includes a semiconductor memory device. The semiconductor memory device includes a first channel pattern and a second channel pattern each extending in a vertical direction and facing each other, a channel separation pattern formed between the first channel pattern and the second channel pattern and extending in the vertical direction, a stack including conductive patterns each surrounding the first channel pattern, the second channel pattern, and the channel separation pattern and stacked apart from each other in the vertical direction, a first memory pattern disposed between each of the conductive patterns and the first channel pattern, and a second memory pattern disposed between each of the conductive patterns and the second channel pattern.

Semiconductor memory device

There are provided a memory device and a manufacturing method of the memory device. The memory device includes: a first gate stack structure and a second gate stack structure, disposed on a substrate; and a slit disposed between the first gate stack structure and the second gate stack structure to electrically isolate the first gate stack structure and the second gate stack structure from each other.

Memory device and manufacturing method of the memory device

The present technology relates to a semiconductor memory device and a method of operating the semiconductor memory device. The semiconductor memory device includes a memory block including a plurality of memory cells programmed to an erase state and a plurality of program states, a voltage generation circuit configured to generate a read voltage to be applied to word lines of the memory block during a read operation, and a read and write circuit connected to bit lines of the memory block and configured to latch data by sensing a potential level of a sensing node based on a cell current of the memory cells in a predetermined time unit during the read operation, wherein the read voltage is applied to the word lines consecutively in a predetermined period and gradually increases according to a time in the predetermined period.

Semiconductor memory device and method of perfomring a multi-level sensing operation

The present discloses provides a memory device and a method of operating the memory device. The memory device includes first main plugs formed in a vertical direction over a substrate and arranged in a first direction, second main plugs, third main plugs arranged between the first and second main plugs, the third main plugs adjacent to the first and second main plugs, and bit lines above the first to third main plugs, wherein each of the first to third main plugs includes first and second sub-plugs facing each other, wherein portions of the first and second sub-plugs included in each of the first and third main plugs are coupled to different select lines, and wherein portions of the first and second sub-plugs included in each of the second and third main plugs are coupled to different select lines.

Memory device storing logical page data and operating method of the memory device

A method of manufacturing a semiconductor device is provided. The method may include forming a stack, forming a preliminary stepped structure by patterning the stack, forming a first stepped structure, a second stepped structure, and an opening located between the first stepped structure and the second stepped structure by etching the preliminary stepped structure, forming a passivation layer that fills the opening and covers the first stepped structure, and forming a third stepped structure by etching the second stepped structure using the passivation layer as an etching barrier.

Method of manufacturing semiconductor device

There are provided a memory device and a manufacturing method of the memory device. The memory device includes: a peripheral circuit disposed on a substrate; and a gate stack structure overlapping with the peripheral circuit. The gate stack structure includes a plurality of first cell plugs having substantially a cylindrical structure and a plurality of second cell plugs having substantially a hexagonal prism structure.

A memory device includes a plurality of memory cells, a peripheral circuit, and control logic. The peripheral circuit is configured to perform an incremental step pulse program (ISPP) on the plurality of memory cells. The control logic is configured to control the peripheral circuit to perform the ISPP using bit line voltages set based on different bit line step voltages according to a target program state of each of the plurality of memory cells among a plurality of program states.

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Icheon-si, South Korea

Jung Shik Jang