Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Konkuk University Industrial Cooperation Corp

Jung Park

Young Sam Park

Hun Joo Hahm

Young June Jeong

Hyung Suk Kim

Ho Sik Ahn

Seung Hwan Choi

Bum Jin Kim

Seong Yeon Han

Seon Goo Lee

Kyung Taeg Han

Seong Ah Joo

Chae Seok Im

Jeong Joon Yoo

Tae Young Choi

Dae Yeon Kim

Kyung Seob Oh

Chang Wook Kim

Young Geun Jun

Chang Ho Song

Keun Soo Yim

Jung Sung Kim

Yu Dong Kim

Jong Hwan Baek

Jae Ky Roh

Jin Mo Kim

Tae Heon Han

Churl Wung Shin

Chang Su Park

Man Ki Hong

Seung Ick Lee

Seung Won Lee

Shi Hwa Lee

Wan Ho Kim

Won Joon Lee

Jae Don Lee

Hee Seok Kim

Dong-hoon Yoo

Joon Ho Yoon

Dong Yul Lee

Chul Hee Yoo

Kun Yoo Ko

Chang Ho Shin

Young Sik Jeong

Soo Jung Ryu

Jeong Wook Kim

Jae Sung Hyun

Woo Jung Park

Si Young Yang

Seung Hyun Choi

Sung A Choi

Woon Gee Kim

Joong El Kim

Ho Sik Anh

Jung Kyu Kook

Alexander T Kynin

Young Taek Kim

Dae Woon Hong

Jeong Eun Lim

Jan Don Lee

Sung Ho Youn

A semiconductor light emitting device and a method of manufacturing a semiconductor light emitting device, the device including a first conductive semiconductor layer including a plurality of V-shaped recesses; an active layer on the first conductive semiconductor layer along a shape of the plurality of V-shaped recesses; a second conductive semiconductor layer on the active layer; a reflection assisting layer on the second conductive semiconductor layer; and a reflection layer on the reflection assisting layer, wherein a thickness of the second conductive semiconductor layer is 45 nm to 100 nm.

Semiconductor light emitting device and method of manufacturing the same

A semiconductor light emitting device includes: a package body having a cavity, and having a first wiring electrode and a second wiring electrode disposed on a bottom surface of the cavity; a light emitting diode (LED) chip having a first surface with a first electrode and a second electrode thereon, a second surface, and lateral surfaces, the LED chip being mounted in the cavity such that the first surface faces the bottom surface, a wavelength conversion film on the second surface of the LED chip, and including a first wavelength conversion material, and a reflective resin portion in the cavity that surrounds the LED chip.

Semiconductor light emitting device

A light emitting device package includes a package body having a mounting region including a mounting surface for a light emitting device, a groove portion, and a bottom surface lower than the mounting surface, and a lead frame supported by the package body, a portion of the lead frame being disposed on the bottom surface and a portion of the lead frame being exposed by the groove portion. The light emitting device has a first plane on which an electrode pad is disposed, a second plane opposite the first plane, and a third plane disposed between the first plane and the second plane to connect the first plane to the second plane. The light emitting device is to be disposed in the mounting region such that the first plane is in contact with the mounting surface and the electrode pad is in the groove portion.

Light emitting device package and method of manufacturing the same

A method of manufacturing a semiconductor device package includes: forming a based frame provided with an outer frame, a plurality of unit frames spaced apart from the outer frame by separating grooves interposed therebetween, and a first connector and a second connector forming connections between each of the plurality of unit frames and the outer frame; forming a package body in each of the plurality of unit frames to allow a mounting area of each unit frame to be open; removing one of the first connector and second the connector connected to each unit frame; mounting a semiconductor device in the mounting area of the unit frame; and cutting the other of the first connector and second the connector connected to each unit frame and separating, from the base frame, the unit frame in which the package body is formed.

Method of manufacturing semiconductor device package

There is provided a semiconductor light-emitting device which includes a light-emitting diode (LED) chip having a first plane on which first and second electrodes are disposed and a second plane disposed opposite to the first plane, first and second solder bumps disposed in bonding areas of the first and second electrodes, respectively, and a protective device electrically connected to the first and second electrodes and mounted on the first plane of the LED chip. The protective device has the substantially same thickness as each of the first and second solder bumps.

Semiconductor light emitting device and semiconductor light emitting device package including the same

Memory mapping in small units using a segment and subsegments is described, and thus it is possible to control a memory access even using a small amount of hardware, and it is possible to reduce costs incurred by hardware. Additionally, it is possible to prevent a memory from being destroyed due to a task error in the multi-processor system.

Apparatus and method for protecting memory in multi-processor system

Provided is a light emitting diode device. The light emitting diode device includes a light emitting diode chip having a first surface on which first and second electrodes are disposed, and a second surface opposing the first surface, a wavelength conversion portion including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces denote surfaces placed between the first and second surfaces, and first and second electricity connection portions each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion. Accordingly, the light emitting diode device, capable of enhancing luminous efficiency and realizing uniform product characteristics in terms of the emission of white light, is provided. Further, a process for easily and efficiently manufacturing the above light emitting diode device is provided.

Light emitting diode device, light emitting apparatus and method of manufacturing light emitting diode device

A light source module, a backlight unit, a display apparatus, a television set, and an illumination apparatus are provided. The light source module includes: one or more light source units including a light emitting element emitting light when electricity is applied thereto; and an optical sheet disposed above the light source units and exhibiting bidirectional transmittance distribution function characteristics having first and second peaks at radiation angles less than 0&#xb0; and greater than 0&#xb0;.

Light emitting device package, light source module, backlight unit, display apparatus, television set, and illumination apparatus

Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

Light emitting diode package having an LED chip mounted on a phosphor substrate

Light-emitting diode illuminating apparatus

Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.

Light emitting diode package

Light emitting diode package with a phosphor substrate

There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing. Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.

Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same

A method of transmitting data between processors, including: establishing and storing an encoding method for each area of virtual address space of a first processor in a predetermined storage device; determining an area of virtual address space corresponding to data to be transmitted to a second processor; and determining the encoding method corresponding to the determined area of the virtual address space with reference to the storage device and transmitting the data to the second processor by using the determined encoding method.

Method, system, and medium for providing interprocessor data communication

Growing community of inventors

Seoul, South Korea

Jung Park