Lg Chem, Ltd

Jung Ok Moon

Hyun Jee Yoo

Hyun Suk Kim

Se Woo Yang

Seung Min Lee

Suk Ky Chang

Ban Seok Choi

Jung Woo Lee

Kyung Yul Bae

Yoon Gyung Cho

Jung Sup Shim

Seung Heon Lee

Yong Goo Son

Kun Seok Lee

Kiseok Lee

Yeong Bong Mok

Min Soo Park

Jae Jin Kim

Hyoung Sook Park

Hyun Hee Son

Dae Han Seo

Min Soo Song

An encapsulation film, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same, and the encapsulation film which forms a structure capable of blocking moisture or oxygen penetrating from the outside into the organic electronic device, effectively releases the heat accumulated in the organic electronic device, realizes endurance reliability under severe conditions of high temperature and high humidity, and prevents deterioration of the organic electronic device.

Encapsulation film

An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa·s to 10Pa·s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

Organic electronic device including encapsulation layer

A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70&#xb0; C. to 100&#xb0; C.; and completely curing the bonding layer.

Embedded-type transparent electrode substrate and method for manufacturing same

The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can prevent occurrence of bright spots of the organic electronic device.

A method of manufacturing a transparent electrode substrate according to an exemplary embodiment includes: a) forming a structure including a transparent base, a bonding layer on a surface of the transparent base, and a metal foil on a surface of the bonding layer opposite the transparent base; b) forming a metal foil pattern by patterning the metal foil; c) heat-treating the structure resulting from b) at a temperature of 70&#xb0; C. to 100&#xb0; C.; and d) completely curing the bonding layer. Also, a transparent electrode substrate is disclosed.

Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.

Encapsulation film and method for encapsulating organic electronic device using same

The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.

The present application relates to an encapsulation film, a method for manufacturing the same, a method for manufacturing an organic electronic device using the same, and an organic electronic device comprising the same, and provides an encapsulation film which allows forming a structure capable of effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, and has excellent handleability and processability, and excellent bonding property between the encapsulation layer and the panel of the organic electronic device and endurance reliability.

The present application relates to an encapsulating film, a reliability assessment therefor, an organic electronic apparatus comprising the encapsulating film, and a method for producing an organic electronic apparatus which has used the encapsulating film, and provides: a reliability assessment method which can predict the reliability of the encapsulating film before same is applied to the organic electronic apparatus, the encapsulating film blocking moisture or oxygen from the outside entering the organic electronic apparatus; and the encapsulating film which can block moisture with high reliability.

Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

Encapsulation film and organic electronic device including the same

Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. Particularly, the encapsulation film, which effectively blocks moisture or oxygen entering the organic electronic device from the outside, and has excellent mechanical properties such as handleability and processability, and the organic electronic device including the same are provided.

Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.

Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns

The present application relates to a display device. The present application can provide a display device in which reflection of external light is reduced to improve a contrast ratio. Such a display device can be applied to not only OLED, a self-luminous display device, but also various display devices including LCD, a non-self-luminous display device, and the like, and can be also implemented as a flexible display device.

Growing community of inventors

Daejeon, South Korea

Jung Ok Moon