Samsung Electronics Co., Ltd.

Jung-Kuk Lee

Young-Man Ahn

You-Keun Han

Seung-Jin Seo

Seung-Man Shin

Seung-Hee Lee

Hui-chong Shin

Jong-Cheol Seo

Byung-Se So

Byoung-sul Kim

Hee-joo Choi

Ho-Suk Lee

Soon-Deok Jang

Seung-Hee Mun

A main board according to example embodiments may include a substrate and at least one socket. The at least one socket may directly connect a memory module to the substrate in a direction parallel to the substrate. A memory mounting test system including the main board may occupy a smaller space, because the memory module is connected to the main board in a direction parallel to the main board.

Main board and system for memory mounting test

Provided is a test system conducting a parallel bit test. The test system, conducting a parallel bit test on a plurality of memory modules mounted on a socket, comprises a plurality of counters and a comparator. Each of the counters counts the number of data output signals in the same logic state, among the data output signals outputted from each memory of the memory modules, and outputs a count signal. The comparator compares the count signal outputted from each of the counters and outputs a comparison signal corresponding to a defect of the memory modules. According to the test system, defects in a memory module can be accurately detected and a possibility of an error in the detection can be reduced when a plurality of memory modules are tested, as compared to conventional test systems.

Test system for conducting parallel bit test

A memory module packaging test system may include a plurality of test slots into which a plurality of memory modules may be installed so that the system may simultaneously test the memory modules. The memory module packaging test system may use a server system for a registered dual in-line memory module (RDIMM) or a fully buffered dual in-line memory module (FBDIMM) so that the system may test an unbuffered dual in-line memory module (UDIMM).

Memory module packaging test system

A memory module, a memory unit, and a hub with a non-periodic clock and methods for using the same. An example memory module may include a phased locked loop, receiving an external, periodic clock and generating one or more internal periodic clocks and a plurality of memory units, receiving one of the internal periodic clocks or a non-periodic clock from an external source.

Memory module, memory unit, and hub with non-periodic clock and methods of using the same

A memory module testing apparatus and method include a test slot adapted to receive a target memory module, wherein the target memory module includes a first memory unit to store information related to the target memory module. The memory module testing apparatus further includes a second memory unit adapted to store information related to a memory module, and a first switching unit adapted to selectively provide a driving signal to at least one of the first memory unit and the second memory unit.

Memory module testing apparatus and method of testing memory modules

A memory module and related method are disclosed. The memory module comprises a clock generator configured to generate first and second internal clock signals in relation to an external clock signal, and a register configured to receive the first and second internal clock signals. The register stores an external control/address signal in response to the first internal clock signal and transmits an internal control/address signal derived from the external control/address in response to the second internal control/address signal.

Memory system with registered memory module and control method

A test board for a high-frequency system level test: The test board includes a main board having through holes filled with a conductive material. These holes may be located at a portion of the main board from which an existing module socket has been removed. An interface board has surface mounted device (SMD) pads on front and rear surfaces. The SMD pads on the front surface of the interface board are connected with the SMD pads on the rear surface thereof through cross connection wiring within the interface board for a pin swap. The through holes of the main board are connected with the SMD pads on the rear surface of the interface board via iron cores fixed at a guide. A test module socket is mounted on surfaces of the SMD pads on the front surface of the interface board.

Growing community of inventors

Yongin-si, South Korea

Jung-Kuk Lee