Samsung Electronics Co., Ltd.

Jung-Ki Kim

Young-Bee Chu

Jeong-Seok Oh

Baik-soon Choi

Young-Jae Lee

Jae-Chang Choi

Dong-Cheol Kim

Tae-Gil Kang

Yong-Seok Kwak

Jung-il An

Yong-Il Kim

Jin-Sung Kim

Hae-Chun Lee

Jin-sung Kim

Jae-hwan Chun

Jae-Sang Lee

Sang-Hyeok Lee

Kyu-Hun Shim

Kyung-su Kim

Jeong-Ki Kim

Hyun-Su Park

Ki-Hwan Baek

Sang-kuen Oh

Dong-ha Lim

Yeon-sang Hwang

Sung-kyu Han

Jung-su Lim

Joong-il An

Provided are a lamp socket structured to realize a slimmer display device, and a display device having the lamp socket. The lamp socket includes: a body portion; a connection terminal for connection of the lamp socket to a terminal of a lamp; a compliant portion which connects the body portion and the connection terminal and includes a first portion connected to the connection terminal and a second portion connected to the body portion; and one or more fixing portions which extend from the body portion, wherein the first portion and the second portion at least partially overlap each other.

Lamp socket and display device having the same

A lamp socket constructed to achieve an ultrathin display device and minimize friction sound due to thermal expansion and shrinkage, and a display device having the lamp socket are provided. The lamp socket includes a first body part, a connection terminal that is connected to the first body part and is electrically connected to a lead of a lamp, a second body part that is spaced apart from the first body part, an elastic part that connects the first body part with the second body part and expands or shrinks in a lengthwise direction of the lamp, and a fixing part that extends from the second body part.

Disclosed is a liquid crystal display apparatus in which a liquid crystal display module and cases are tightly combined. At least one protuberance formed on a top chassis of the liquid crystal display module combines at least one fixing portion formed on a portion of a rear case corresponding to the at least one protuberance. Also, a fixing protuberance formed on a portion of a front case is inserted into between the liquid crystal display module and the rear case, thereby preventing the liquid crystal display module from being moved. Therefore, the liquid crystal display module and the cases are tightly combined, and productivity of the liquid crystal display apparatus can increase by reducing the number of parts demanded for fabrication of the liquid crystal display module and the cases.

Liquid crystal display apparatus having particular fixing grooves and fixing protuberances in rear case

Liquid crystal display apparatus having particular protruding portions and fixing grooves

Liquid crystal display apparatus

An LCD module having a lamp cover with an improved structure, includes a lamp; a lamp cover which is bent once so as to define an upper plate and a side plate thereof, and which covers an upper portion and side portion of the lamp with a lower portion of the lamp being opened, the lamp cover being arranged to reflect a light produced from the lamp; a light guide plate having an upper surface and a side surface thereof corresponding to the upper and side plates of the lamp cover, respectively, the light guide plate being arranged to a side of the lamp cover, the light guide plate receiving a light produced from the lamp through the side surface thereof and transmitting the light toward the upper surface thereof; and a rear reflector plate arranged at a lower surface of the light guide plate and which is extended toward the lower portion of the lamp, the rear reflector plate directing toward the upper surface of the light guide plate a light being leaked through the lower surface of the light guide plate.

Liquid crystal display module

A backlight assembly, an LCD assembly having the same and an assembly method thereof are disclosed to reduce the assembly time and to improve the efficiency. The backlight assembly comprises: a mold frame having an inner lower surface and side walls normal to the inner lower surface; a reflector plate mounted on the inner lower surface of the mold frame; a light guiding plate disposed on the reflecting plate; a lamp assembly accommodated between one side portion of the light guiding plate and the side wall of the mold frame facing the one side portion of the light guiding plate; a series of diffusion sheets disposed on the light guiding plate; and a pair of fixing frames facing each other, covering an edge of the light guiding plate corresponding to a portion where the lamp assembly is accommodated and the side walls of the mold frame, pressing and fixing the light guiding plate, and being detachably coupled to the mold frame.

Backlight assembly and an assembling method thereof

There is provided a method of optimizing recipe of in-situ cleaning process for process chamber after a specific process on semiconductor wafers by using Residual Gas Analyzer Quadrupole Mass Spectrometer (RGA-QMS) According to the present invention, a Chemical Vapor Deposition (CVD) apparatus for manufacturing semiconductor devices comprises: a process chamber; process gas supply line for supplying process gas into the process chamber; a waste-gas exhaust line for removing the waste-gas from the process chamber after process; a supply line for supplying a ClF gas into the process chamber; a sampling manifold for sampling the gas inside process chamber by using pressure difference; and RGA-QMS for analyzing the sampling gas, and the optimization of the end points according to gas flow, pressure, and temperature of the cleaning process for the process chamber is achieved through the analysis by above RGA-QMS.

Chemical vapor deposition method for manufacturing semiconductor devices

Stack type backlight assembly, LCD having the same and assembly method thereof

There is provided a method of optimizing recipe of in-situ cleaning process for process chamber after a specific process on semiconductor wafers by using Residual Gas Analyzer Quadrupole Mass Spectrometer (RGA-QMS). According to the present invention, a Chemical Vapor Deposition (CVD) apparatus for manufacturing semiconductor devices comprises: a process chamber; process gas supply line for supplying process gas into the process chamber; a waste-gas exhaust line for removing the waste-gas from the process chamber after process; a supply line for supplying a ClF gas into the process chamber; a sampling manifold for sampling the gas inside process chamber by using pressure difference; and RGA-QMS for analyzing the sampling gas, and the optimization of the end points according to gas flow, pressure, and temperature of the cleaning process for the process chamber is achieved through the analysis by above RGA-QMS.

Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method, and method of optimizing recipe of cleaning process for process chamber

There is provided a method of optimizing recipe of in-situ cleaning process for process chamber after a specific process on semiconductor wafers by using Residual Gas Analyzer Quadrupole Mass Spectrometer (RGA-QMS). According to the present invention, a Chemical Vapor Deposition (CVD) apparatus for manufacturing semiconductor devices comprises: a process chamber; process gas supply line for supplying process gas into the process chamber; a waste-gas exhaust line for removing the waste-gas from the process chamber after process; a supply line for supplying a CiF,gas into the process chamber; a sampling manifold for sampling the gas inside process chamber by using pressure difference; and RGA-QMS for analyzing the sampling gas, and the optimization of the end points according to gas flow, pressure, and temperature of the cleaning process for the process chamber is achieved through the analysis by above RGA-QMS.

Chemical vapor deposition apparatus for manufacturing semiconductor devices

A semiconductor device is manufactured by forming a thin layer over a semiconductor substrate, coating photoresist on the thin layer, forming a photoresist pattern over the semiconductor substrate, injecting ions into the photoresist pattern so as to harden the photoresist pattern, and etching the thin layer by using the hardened photoresist pattern as an etch mask. The hardened photoresist pattern has an increased etch selectivity with respect to an underlying layer, allowing the use of thinner photoresist layers and improved etching.

Method of manufacturing semiconductor devices

A method for stripping a film from a wafer substrate includes the steps of inserting a boat holding the wafer into a processing chamber of a CVD apparatus, and injecting gas into the chamber, to thereby strip the wafer of its film. A typical film requiring stripping is a polysilicon film grown on an underlying oxide layer of the substrate. In this case, CIF.sub.3 is used to strip the polysilicon film without damaging the oxide layer. Accordingly, this method is applicable to the quality testing of semiconductor wafer films using a test wafer. In such quality testing a film is formed on a test wafer substrate at the same time the semiconductor wafer film is formed. The film of the test wafer is tested to evaluate the quality of the formation of the semiconductor wafer film. The test wafer can then be stripped within the chemical vapor deposition apparatus and thus can be reused soon thereafter.

Method of stripping a wafer of its film with gas injected into a CVD

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Seoul, South Korea

Jung-Ki Kim