Semes Co., Ltd.

Samsung Electronics Co., Ltd.

Jung Keun Cho

Kyo-Woog Koo

Ju Won Kim

Bo Ram Chan Sung

Sol Kim

Hyun-Jong Kim

Ki Hoon Choi

Soon Hwan Kwon

Myeong Gi Jeong

Jung Bong Choi

Kyo Woog Koo

Yi Jung Kim

Kyung Jin Seo

Hyun Mi Kwak

Chang Ro Yoon

Hyun Jong Kim

An electronic device and method are provided guiding image capturing based on property information of an external light source. The electronic device includes a camera, a display, and a processor. The processor is configured to obtain an image using the camera; identify a face included in the image; determine a first brightness value for a first region of the identified face and a second brightness value for a second region of the identified face; determine property information of an external light source for the identified face, based on the first brightness value and the second brightness value; and provide, through the display, guide information corresponding to the property information of the external light source for the identified face.

Electronic device for providing property information of external light source for interest object

The present invention is directed to a substrate dryer, a substrate treating apparatus including the substrate dryer, and a substrate treating method. The substrate dryer includes a chamber, a process chamber constituting one part of the chamber and provided for supplying supercritical fluid to a substrate to dry the substrate, and a high-pressure chamber constituting the other part of the chamber and provided for boosting the process chamber above a critical pressure. According to the present invention, the substrate drying chamber is boosted fast by the high-pressure chamber to change to a supercritical state and thus a substrate dry treatment is performed using supercritical fluid.

Substrate dryer using supercritical fluid, apparatus including the same, and method for treating substrate

A substrate treating apparatus for stripping photoresist on a substrate includes a support part for supporting the substrate, a dry-type treating part for stripping the photoresist on the substrate, and a wet-type treating part for stripping the photoresist on the substrate. While the substrate is supported by the support part, the photoresist on the substrate is primarily stripped by means of the dry-type treating part and secondarily stripped by means of the wet-type treating part. The dry-type treating part includes a plasma supply unit configured to supply plasma onto the substrate and a moving unit configured to vary a relative position of the plasma supply unit and the substrate.

Apparatus and method for treating substrates

A chucking member configured to chuck the edge of a substrate includes a chucking pin which is eccentric from the rotation center. The chucking pin has a streamline shape and includes a first front-end portion disposed at the front end relative to the flow of an air current generated by the rotation of the substrate and a first back-end portion disposed at the back end relative to the flow of the air current. The first front-end portion includes a first tip, and the first front-end portion has a round shape.

Chucking member and spin head and method for chucking substrate using the chucking member

An apparatus is provided for supplying a plurality of chemicals or gases to the surface of a substrate to clean and dry the substrate. The apparatus includes a substrate support unit with a chuck on which a substrate is loaded, a bottom chamber having an open top and configured to surround the circumference of the chuck, a top chamber configured to open or close the top of the bottom chamber such that a drying treatment for the substrate is performed while the substrate is isolated from the outside, and an indirect injection nozzle installed at the edge of the top chamber and configured to inject drying fluid toward the center of the top chamber such that the drying fluid is indirectly injected to the substrate. According to the apparatus, it is possible to enhance a substrate drying efficiency, suppress external contamination, and prevent the formation of an oxide layer.

Apparatus and method for treating substrate

A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.

Spin head, method of operating the spin head and apparatus for treating substrates with the spin head

A spin head includes a rotatable plate, first chucking pins and second chucking pins for supporting a edge portion of a substrate loaded on the plate, and a driving unit for selectively driving the first and second chucking pins. The driving unit includes a first magnet connected to the first chucking pin and disposed at a first height, a second magnet connected to the second chucking pin and disposed at a second height, and a driving magnet for driving the first and second magnets. The driving magnet is elevated by means of an elevating member to selectively apply a magnetic force to the first or second magnet and moves in the radius outside direction of the first or second chucking pin due to a magnetic force.

Spin head and substrate treating method using the same

A substrate treating apparatus includes a substrate support unit with a chuck on which a substrate is loaded; a bottom chamber having an open top and configured to surround the circumference of the chuck; a top chamber configured to open or close the top of the bottom chamber such that the substrate is dried while the top chamber is sealed from the outside; and a direct injection nozzle member installed at the top chamber to inject fluid directly to the substrate while the top of the bottom chamber is closed. According to the substrate treating apparatus, drying efficiency of an entire substrate is enhanced, external contaminants are blocked, and generation of an oxide layer is suppressed.

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Seoul, South Korea

Jung Keun Cho