Samsung Electronics Co., Ltd.

S-connect Co., Ltd.

Jung Je Bang

Hyun-Tae Jang

Yong Won Lee

Chi Hyun Cho

Kwang Sub Lee

Kyung Ha Koo

Hae Jin Lee

An electronic device according to an embodiment of the present disclosure includes a printed circuit board (PCB), a first component disposed in a first region on the PCB and a second component disposed in a second region on the PCB, and a chamber disposed on the first and second components and having a region including the first and second regions, in which fluid absorbing heat radiating from the first and second components is included in the chamber.

Electronic device including vapor (two phase) chamber for absorbing heat

A fastening structure for a shield can is capable of ensuring easy attachment/detachment of the shield can and prevents deformation caused by excessive impact when the shield can is attached and detached by improving the fastening structure for a shield can fixed to a printed circuit board. The fastening structure for a shield can provided to shield a printed circuit board on which electronic components are mounted and the electronic components from electromagnetic waves includes a frame provided with a fixing part allowing the frame to be fixed to the printed circuit board, a shield cover provided to surround an outer side of the frame, fastening parts provided at the shield cover and the frame, respectively, such that the shield cover and the frame are attached/detached to/from each other. The fastening parts and the fixing part are disposed without overlapping each other.

Fastening structure for shield can

A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.

Printed circuit board assembly and method of manufacturing the same

Growing community of inventors

Gumi-si, South Korea

Jung Je Bang