Samsung Electronics Co., Ltd.

Jung-Je Bang

Jae-Heung Ye

Jeong-Ung Kim

Ki-Youn Jang

Min Jae Park

Yong-Won Lee

Sang-Hyun An

Chi-Hyun Cho

Jung-Sik Park

Joon Young Heo

Jun-Young Kim

Jun-Hui Lee

Young-Min Baik

Hyun-Tae Jang

Jeong-Hyun Oh

Min Sang Park

Oh-Hyuck Kwon

Kyung-Ha Koo

Kun-Tak Kim

Beom-Ju Kim

Keun-Deok Park

Sang-Seob Kim

Mi-Jin Kim

Jae-Deok Lim

Yong-won Lee

Soon-Jae Kim

Won-II Jeong

Chang-Tae Kim

Sae-Bom Lee

Hae-Jin Lee

Hyun-Joo Han

Jae-deok Lim

Hye-in Park

Chan-beom Jeong

Sae-bom Lee

Jun-Yeong Kim

Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

Electronic device

An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

Shield can assembly and electronic device including the same

Disclosed are various embodiments relating to an electronic device that includes a shield structure. According to an example embodiment, the electronic device may include: a housing that includes a first surface directed in a first direction and a second surface directed in a second direction that is opposite to the first direction; a printed circuit board included in the housing, wherein the printed circuit board includes a first surface directed in the first direction and a second surface directed in the second direction; at least one electronic component disposed on the first surface of the printed circuit board; and at least one shield structure configured to electro-magnetically shield the at least one electronic component, and the shield structure may include: a flexible sheet that includes a first sheet that covers the at least one electronic component and a second sheet that at least partially covers the space between the first sheet and the first surface of the printed circuit board, when viewed from above the first surface of the printed circuit board; and at least one frame structure that supports the first and second sheets.

Electronic device including shield structure

An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.

Electronic device with electromagnetic shielding member

A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Method of manufacturing printed-circuit board assembly

A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.

Shield can device for shielding electromagnetic wave

According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

Electronic device and manufacturing method of the same

A portable terminal including a module, in which one or more storage members are disposed, and a method for manufacturing the portable terminal are provided. The portable terminal includes a first assembly that includes a shield can and a flexible circuit board attached to a surface of the shield can. The portable terminal also includes at least one socket unit mounted to an upper side of the first assembly. The socket unit is mounted to an upper side of the flexible circuit board while the first assembly is positioned on a jig.

Portable terminal and method of manufacturing a module thereof

A method for fabricating silica glass is disclosed. The method includes the steps of (a) hydrolyzing silicon alkoxide; (b) hydrolyzing heterometal alkoxide containing Bi and Ti components; (c) mixing a solution containing hydrolyzed products of the silicon alkoxide and a solution containing hydrolyzed products of the heterometal alkoxide, thus forming a mixed solution; (d) molding gel by pouring the mixed solution into a forming mold; (e) drying the molded gel; and (e) performing heat-treatment of the dried gel so as to vitrify the gel.

Method for fabricating silica glass containing Bi and Ti using a sol-gel process

The present invention discloses a method for fabricating silica glass using a sol-gel process, which includes a sol forming step for forming a sol by mixing a starting material, deionized water and an additive together; gelation step for gelatinizing the sol after filling a circular mold with the gel produced; gel drying step for separating the gel from the circular mold and drying the gel; setting step for placing the gel inside of a heat chamber and injecting helium gas into the heat chamber; and low heat treatment step for pressurizing and depressurizing an internal pressure of the heat chamber repeatedly for several times.

Method for fabricating silica glass using sol-gel process

Growing community of inventors

Gyeonggi-do, South Korea

Jung-Je Bang