Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Other

Hanmi Pharm. Co., Ltd.

Jung Hyun Cho

Yong Ho Baek

Young Sik Hur

Won Wook So

Jae Hoon Choi

Doo Il Kim

Moon Hee Yi

Byoung Chan Kim

Kyung Hwan Ko

Seung Eun Lee

Young Kwan Lee

Tae Hee Han

Chang Soo Woo

Joo Hwan Jung

Min Keun Kim

Sang Heon Lee

Jae Hyun Park

Hyung Joon Kim

Yong Il Kim

Sang Shin Lee

Young Gwan Ko

Jun Sik Hwang

Jung Hyun Park

Jin Won Lee

Yun Tae Lee

Jeong Yun Lee

Yong Duk Lee

Jong Soo Woo

Ho Kwon Yoon

Joon Sung Kim

Chul Jun Choi

Jae Han Park

Chi Won Hwang

Joo Ho Jung

Kyeong Soo Kim

Kyung Yub Jeon

Jun Oh Hwang

Vasily Pashkovskiy

Woo Seok Yang

Dae Kwon Jung

Eung Suek Lee

Hea Sung Kim

Young Keun Choi

Jin Cheul Kim

Bang Chul Ko

Koo Woong Jeong

Il Jong Seo

Sang Jean Jeon

Soon Cheol Jung

Seung Jun Lee

Gopal Garg

Byung Kuk Kang

Jong Rok Kim

Jin Wook Tak

Hyung Seo Kim

A printed circuit board includes a substrate structure including a first insulating material, a plurality of first wiring layers disposed on or in the first insulating material, and a plurality of first via layers disposed in the first insulating material; and an interconnect structure including a second insulating material, a plurality of second wiring layers disposed on or in the second insulating material, and one or more second via layers disposed in the second insulating material. The interconnect structure is disposed on an upper side of the substrate structure. The interconnect structure includes first and second connection regions. The first and second connection regions are spaced apart from each other.

Printed circuit board and a semiconductor package including the same

A printed circuit board includes: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate.

Printed circuit board

A printed circuit board includes: a core portion including a cavity in one surface thereof; first and second penetration holes disposed in a bottom surface of the cavity and penetrating through the core portion; an electronic component disposed in the cavity; and an insulating material filling the cavity and each of the first and second penetration holes, wherein a sidewall of the cavity is higher than the electronic component.

A bridge embedded interposer and a package substrate and a semiconductor package including the same includes: a connection structure including one or more redistribution layers, a first bridge disposed on the connection structure and including one or more first circuit layers electrically connected to the one or more redistribution layers, a frame disposed around the first bridge on the connection structure and including one or more wiring layers electrically connected to the one or more redistribution layers, and an encapsulant disposed on the connection structure and covering at least a portion of each of the first bridge and the frame.

Bridge embedded interposer, and package substrate and semiconductor package comprising the same

An electronic component-embedded substrate includes a first core layer having a first through-hole, a first passive component disposed in the first through-hole, a second core layer disposed on the first core layer and having a second through-hole, a second passive component disposed in the second through-hole, an insulating material covering at least a portion of each of the first passive component and the second passive component and disposed in at least a portion of each of the first through-hole and the second through-hole, and a first wiring layer disposed on a level between the first passive component and the second passive component such that at least a portion of the first wiring layer is covered with the insulating material. The first passive component and the second passive component are connected to each other by the first wiring layer.

Electronic component-embedded substrate

A printed circuit board includes a printed circuit board includes a substrate portion having a recess portion and including a first circuit layer, abridge disposed in the recess portion and including an insulating layer and a bridge circuit layer, an insulating material disposed in at least a portion of the recess portion and covering at least a portion of the bridge, a second circuit layer disposed on the insulating material, and a first via penetrating through the insulating material and a portion of the bridge and connecting the second circuit layer and the bridge circuit layer to each other.

Printed circuit board and method of manufacturing the same

An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the connection member; and an antenna package including a plurality of antenna members and a plurality of feed vias, and disposed on a second surface of the connection member, wherein the IC package includes: an IC having an active surface electrically connected to at least one wiring layer and an inactive surface opposing the active surface, and generating the RF signal; a heat sink member disposed on the inactive surface of the IC; and an encapsulant encapsulating at least portions of the IC and the heat sink member.

Antenna module

There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having athrough-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, andan optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Fan-out sensor package and optical fingerprint sensor module including the same

A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.

Board with embedded passive component

A semiconductor package includes: a core structure having first and second surfaces and having first and second through-holes; a first semiconductor chip embedded in the core structure and having first and second contacts disposed on two opposing surfaces thereof, respectively; a first wiring layer on the surface of the core structure and connected to the first contact; a second wiring layer on the second surface of the core structure and connected to the second contact; a chip antenna disposed in the first through-hole; a second semiconductor chip in the second through-hole and having a connection pad; a first redistribution layer on the first surface of the core structure and connected to the connection terminal, the connection pad, and the first wiring layer; an encapsulant encapsulating the chip antenna and the second semiconductor chip; and a second redistribution layer on the encapsulant connecting to the second wiring layer.

Semiconductor package

A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole and including an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, a second connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the semiconductor chip, and an encapsulant encapsulating the semiconductor chip and having a cavity disposed above the inactive surface of the semiconductor chip.

Fan-out semiconductor package

There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Antenna Module

A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semiconductor chip, and a connection member including a redistribution layer electrically connected to connection pads; and an antenna substrate including an antenna member including antenna patterns, ground patterns, and feed lines, and a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines.

Composite antenna substrate and semiconductor package module

A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include first redistribution layers and second redistribution layers electrically connected to the connection pads and formed of one or more layers, at least one of the first redistribution layers is disposed between a plurality of insulating layers of the first connection member, and at least one of the second redistribution layers includes sensor patterns recognizing a fingerprint.

Growing community of inventors

Suwon-si, South Korea

Jung Hyun Cho