Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Jung Hyuk Jung

Woon Chul Choi

Hye Min Bang

Ji Hye Oh

Myung Jun Park

Hye Yeon Cha

Han Wool Ryu

Sung Hee Kim

Young Sun Kim

Jun Ah

Dong Hwan Lee

Tae Young Kim

Chan Young Yoon

Woo Jin Lee

Myung Sam Kang

Woon Chui Choi

Ki Young Yoo

Jong Min Lee

Dong Min Kim

Il Jin Park

Ji Young Park

Yu Jong Kim

Sung Min Moon

Jin Ho Ku

Dong Seob Lee

Hyo Chan Oh

Tae Hui Im

Yoon Hee Kim

Yu Jung Park

A coil component includes a body having a first surface and a second surface opposing each other and a plurality of wall surfaces connecting the first surface to the second surface, and including insulating resin and magnetic metal powder particles; an insulating substrate disposed in the body; a coil portion disposed on the insulating substrate and including a lead-out pattern exposed to a first wall surface of the plurality of wall surfaces of the body; and an external electrode disposed on the body and connected to the lead-out pattern. Some of the magnetic metal powder particles are exposed to each of the plurality of wall surfaces of the body. The magnetic metal powder particles exposed to the first wall surface of the body have a cut-out surface. The magnetic metal powder particles exposed to a second wall surface connected to the first wall surface of the plurality of wall surfaces of the body do not have a cut-out surface.

Coil component

A coil component includes: a support substrate; first and second coil portions disposed on the support substrate to be spaced apart from each other; a body surrounding the support substrate and the first and second coil portions; and a plurality of external electrodes disposed on a surface of the body, wherein each of the first and second coil portions includes a coil pattern and a lead pattern connected to the coil pattern and exposed from the surface of the body, and a width of an exposed portion of the lead pattern exposed from the surface of the body is greater than a width of each of the coil pattern and the plurality of external electrodes.

A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 μm or more.

Coil electronic component and method of manufacturing the same

A coil electronic component includes a body, a coil portion disposed in the body and including a support substrate and a coil pattern disposed on at least one surface of the support substrate and forming at least one turn, and first and second external electrodes disposed on external surfaces of the body and connected to both ends of the coil pattern, respectively. The first and second external electrodes include a first plating layer disposed on an end surface of the body and a conductive resin layer covering the first plating layer and extending to a main surface of the body, to be connected to the coil pattern. An aspect ratio of the coil pattern is less than 1 and a width W1 of the coil pattern satisfies 0.8W2≤W1≤W2 as compared with a width W2 of the first and second external electrodes.

Coil electronic component

A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, and a lead-out pattern disposed on at least one surface of the support substrate and connected to the coil pattern. An encapsulant encapsulates at least portions of the support substrate, the coil pattern, and the lead-out pattern, and at least one protrusion protrudes from one side surface of the coil pattern. External electrodes are disposed externally on the encapsulant and connected to the lead-out pattern. The lead-out pattern is configured to extend in a thickness direction of the support substrate and to cover a side surface of the support substrate.

A coil component includes a body, a support substrate embedded in the body, a first coil portion and a second coil portion disposed on the support substrate, a first external electrode and a second external electrode disposed on one end surface of the body to be spaced apart from each other, a third external electrode and a fourth external electrode disposed on the other end surface of the body to be spaced apart from each other, a surface insulating layer disposed on one surface of the body connecting the one end surface and the other end surface of the body to each other, and an edge protection layer disposed between the first and second external electrodes and between the third and fourth external electrodes in the one end surface and the other end surface of the body, and having one end portion extending upwardly of the surface insulating layer.

Coil component having dual insulating structure

A coil component includes a support substrate, a first coil and a second coil disposed on the support substrate to be spaced apart from each other, and a body including a first core and a second core penetrating through the first coil portion and the second coil portion and spaced apart from each other. The first coil portion has a first winding portion, forming at least one turn about the first core, and a first extension portion extending from one end portion of the first winding portion to surround the first core and the second core. The second coil has a second winding portion, forming at least one turn about the second core, and a second extension portion extending from one end portion of the second winding portion to surround the first core and the second core. A separation distance between a given turn of the first coil portion and an adjacent turn of the second coil portion is different from a separation distance between adjacent turns of the first coil portion.

A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.

Multilayer seed pattern inductor and manufacturing method thereof

A coil component includes coil portions spaced apart from each other; and a body having a first core and a second core, spaced apart from the first core, wherein the coil portions include a first coiled portion and a second coiled portion that form at least one turn about the first and second cores, respectively, and a first extension portion and a second extension portion extending from the first and second coiled portions, respectively, and each surround the first and second cores. The body further comprises spacing portions, facing each other, defined between the coiled portions and spaced apart from the first and second cores. In the first and second extension portions, a line width of each of adjacent regions adjacent to the spacing portions is greater than a line width of a region except the adjacent regions.

A coil component includes a body having a first surface and a second surface, both side surfaces, and both end surfaces connecting the first surface to the second surface and opposing each other, a plurality of coil portions embedded in the body and spaced apart from each other, first to fourth side electrodes connected to the plurality of coil portions and exposed to the both side surfaces, respectively, and first to fourth external electrodes disposed on the first surface and connected to the first to fourth side electrodes, respectively. A length of an edge of each of the first to fourth external electrodes, contacting the first surface and one of the both side surfaces, is greater than a length of an edge of a respective one of the first to fourth side electrodes, contacting the first surface and one of the both side surfaces.

A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.

Multilayer seed pattern inductor, manufacturing method thereof, and board having the same

A coil component includes a body including a magnetic material; a support member disposed in the body; and a coil pattern on the support member in the body. The coil pattern may include a first conductor layer formed on the support member and having a planar spiral shape; a second conductor layer formed on the first conductor layer and having a volume of a lower portion greater than a volume of an upper portion; and a third conductor layer formed to cover the second conductor layer from the outside of the second conductor layer.

Coil component and method for manufacturing the same

A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.

A thin film type inductor includes a body and external electrodes disposed on an external surface of the body. The body includes a support member and an internal coil supported by the support member, the internal coil includes an upper coil disposed on one surface of the support member and a lower coil disposed on the other surface thereof, and the upper and lower coils are connected to each other by a via electrode. Heights of a plurality of coil patterns arranged along a first virtual line are substantially equal to each other, and heights of a plurality of coil patterns arranged along a second virtual line increase toward the external surface of the body, where the first virtual line radiates from a center of a core of the body toward the via electrode and the second virtual line radiates in the opposite direction.

Thin film type inductor

A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 &#x3bc;m or more.

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Suwon-si, South Korea

Jung Hyuk Jung