Samsung Electronics Co., Ltd.

Jung-hye Kim

Young-bu Kim

Ho-chul Ji

Keun-yeong Cho

Jin-Mo Jang

Dong-hyun Kim

Kyoung-ho Ha

Sang-moon Lee

Dong-jae Shin

Seong-gu Kim

Beom-suk Lee

Kwan-Sik Cho

Hyun-il Byun

Jung-ho Cha

Jin-kwon Bok

Yong-hwack Shin

An integrated circuit (IC) device includes an optical IC substrate, a local trench inside the optical IC substrate, and a photoelectronic element including a photoelectric conversion layer buried inside the local trench. The photoelectric conversion layer is buried inside the local trench in the optical IC substrate to form the photoelectronic element. Thus, the IC device may inhibit warpage of the optical IC substrate.

Integrated circuit device including photoelectronic element

An optical device includes a substrate; a trench in a portion of the substrate; a clad layer arranged in the trench; a first structure arranged on the clad layer to have a first depth; and a second structure arranged on the clad layer to have a second depth different from the first depth.

Optical device and method of manufacturing the same

A semiconductor substrate having a reference semiconductor chip and a method of assembling semiconductor chips using the same are provided. According to the method, a semiconductor substrate having a plurality of semiconductor chips is provided. An identification mark is made on a reference semiconductor chip among the semiconductor chips. The semiconductor substrate is aligned with reference to the reference semiconductor chip, so that an electrical die sorting test can be performed on the semiconductor chips on the semiconductor substrate.

Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the same

A digital test apparatus for testing an analog semiconductor device includes a low pass filter which passes only a low frequency analog signal from among analog signals output from the analog semiconductor device, a rectifying unit connected to the low pass filter for converting the analog signal output from the low pass filter into a DC voltage, a high pass filter which passes only a high frequency analog signal from among analog signals output from the analog semiconductor device, a high frequency power detecting unit connected to the high pass filter for converting the analog signal output from the high pass filter into a DC voltage, and a digital measuring unit which is connected to the rectifying unit and the high frequency power detecting unit and measures the DC voltages to determine whether the analog signals output from the analog semiconductor device are desirable.

Digital test apparatus for testing analog semiconductor device(s)

An apparatus for generating a current source test stimulus signal having a constant current regardless of an internal impedance value of a device under test includes a voltage source generation unit and a voltage to current (V/I) converter. The voltage source generation unit converts source data stored in internal memory into analog signals, and combines the analog signals and a reference signal of D/C voltage level to generate voltage source test stimulus signals. The V/I converter converts the voltage source test stimulus signals into current source test stimulus signals and outputs the current source test stimulus signal to a device under test. The V/I converter maintains the current levels of the current source test stimulus signals at a predetermined value, regardless of the internal impedance of input pins of the device under test. In this manner, the operating efficiency of the device under test can be accurately determined.

Apparatus for generating test stimulus signal having current regardless of internal impedance changes of device under test

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Suwon-si, South Korea

Jung-hye Kim