Samsung Electronics Co., Ltd.

Jung-hwan Woo

Hyun-Ho Kim

Tae-Hyun Kim

Hak-Kyoon Byun

Young-Kyun Sun

Youn-sung Ko

Hyun-jung Song

An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

Apparatus for detaching a semiconductor chip from a tape

Provided are in-line semiconductor chip packaging apparatuses that include a buffer assembly in which a reversing unit rotates a lead frame 180&#xb0; between die attaching and/or wire bonding operations and methods of manufacturing an integrated circuit chip package using such an in-line integrated circuit chip packaging apparatus. Between packaging process operations, the lead frame, which includes first and second surfaces may be rotated, thereby reversing the orientation of the first and second surfaces. The apparatuses will include one or more processing units for attaching semiconductor chips to the leadframe, or a previously mounted semiconductor chip, or for forming wire bonds between the attached semiconductor chip(s) and the corresponding lead fingers of the lead frame, attached to and/or separated by an in-line buffer assembly that includes a reversing unit.

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Growing community of inventors

Cheonan-si, South Korea

Jung-hwan Woo