Lg Innotek Co., Ltd.

Other

Kookmin University

Suzhou Lekin Semiconductor Co., Ltd.

Jung Hun Oh

Ki Cheol Kim

Ki Man Kang

Kwang Ki Choi

Jung Woo Lee

Ha Na Kim

Hyun Jung Lee

Hyung Jo Park

Hyun Don Song

Hiroshi Kodaira

Eun Dk Lee

Baek Jun Kim

Hyun Woo Bark

Eun Ju Hong

Jong Chan Baek

Kyeoung An Jung

An embodiment provides a semiconductor device package and a light emitting device comprising same, the semiconductor device package comprising: a body including a first cavity; and a semiconductor device disposed within the first cavity, wherein: the first cavity includes a first surface inclined such that the area of the cavity gradually increases as going away from the semiconductor device, and a plurality of second surfaces perpendicular to the upper surface of the semiconductor device; the body includes a first outer surface and a third outer surface that are opposite to each other, a second outer surface and a fourth surface that are opposite to each other, a first corner portion disposed in a region where the first and second outer surfaces meet each other, a second corner portion disposed in a region where the second and third outer surfaces meet each other, a third corner portion disposed in a region where the third and fourth outer surfaces meet each other, and a fourth corner portion disposed in a region where the fourth and first outer surfaces meet each other; and the plurality of second surfaces are disposed between the first and second corner portions, between the second and third corner portions, between the third and fourth corner portions, and between the fourth and first corner portions, respectively.

Semiconductor device package and light emitting device comprising same

An embodiment discloses a semiconductor device package comprising: a substrate; an electrode disposed on the substrate; a semiconductor device and a protective device which are disposed on the electrode; a dummy electrode disposed on the substrate and spaced apart from the electrode along the edge of the substrate; a reflective member disposed on the dummy electrode and having an outer surface, an inner surface surrounding the semiconductor device and forming a cavity, and a bottom surface facing the substrate; and a light-transmitting member disposed on the reflective member and covering the cavity, wherein the inner surface includes a first surface adjacent to the substrate and a second surface extending from the first surface to the light-transmitting member and having a parabolic shape, and the bottom surface of the reflective member has a first recess disposed on the protective device between the dummy electrode and the inner surface.

Semiconductor device package and light irradiation device comprising the same

Disclosed herein are a flexible thermoelectric module cell for a touch sensor, a touch sensor including the same, and a method of manufacturing the flexible thermoelectric module cell for a touch sensor. The flexible thermoelectric module cell is applicable to cells for touch sensors of various designs, without the need for a person to go directly to an industrially dangerous place.

Flexible thermoelectric module cell for touch sensor, touch sensor including the same, and method of manufacturing the flexible thermoelectric module cell for touch sensor

A semiconductor device of an embodiment includes first and second semiconductor layers having different conductivity types; a third semiconductor layer interposed between the first and second semiconductor layers; and a fourth semiconductor layer interposed between the second and third semiconductor layers, having a lower doping concentration than that of the first semiconductor layer and the same conductivity type as the first semiconductor layer, wherein the difference in doping concentration between the first semiconductor layer and the fourth semiconductor layer may be greater than 4&#xd7;E18 atoms/cm.

Semiconductor device

A semiconductor device includes a substrate; first and second semiconductor layers arranged on the substrate and having different conductive types; a third semiconductor layer arranged between the first semiconductor layer and the second semiconductor layer; a first electrode arranged on the first semiconductor layer so as to be electrically connected to the first semiconductor layer; a second electrode arranged on the second semiconductor layer so as to be electrically connected to the second semiconductor layer; and a first insulating layer arranged, between the first electrode and the second electrode, on the exposed first, second and third semiconductor layers, wherein a first end part, close to the second electrode, among both end parts of the first electrode, and/or a second end part, which is both end parts of the second electrode, has an electric field dispersion part.

Semiconductor device with electric field distribution part

A light emitting device package may include a package body, a light emitting device on the package body, a first molding member that surrounds the light emitting device, and a second molding member having a hemi-spherical structure to surround the first molding member. The molding member includes a viscous material.

Light emitting device package and light system including the same

A light emitting device includes a body having a cavity and a step difference structure around the cavity, a plurality of electrodes in the cavity, a light emitting chip in the cavity, a transparent window having an outer portion provided on the step difference structure to cover the cavity, and an adhesive member between the transparent window and the body. The adhesive member includes a first adhesive member between an outer bottom surface of the transparent window and a bottom of the step difference structure and a second adhesive member between the outer portion of the transparent window and the body.

Light emitting device with packaging having an adhesive in a groove for attaching a transparent cover

Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer and a second conductive semiconductor layer on the active layer; a first electrode pad on the first conductive semiconductor layer; a second electrode pad on the second conductive semiconductor layer; and a current blocking pattern overlapping an edge of at least one of the first and second electrode pads.

Light emitting device and light emitting device package

Embodiments provide a light emitting device including a substrate, a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, a sub-mount, first and second metal pads disposed on the sub-mount and electrically spaced apart from one another, a one first bump disposed between the first conductive semiconductor layer and the first metal pad and a second bump located between the second conductive semiconductor layer and the second metal pad. A plurality of active areas in which The first semiconductor layer and the active layer are disposed are spaced apart from one another when viewed in plan.

Light emitting device, light emitting device package including the device and lighting apparatus including the package

A light emitting device package includes a package body, and a light emitting device chip provided on a chip mount area of the package body. A molding member is provided on the package body. The package body includes a central area having the chip mount area and a chip non-mount area adjacent to the chip mount area. An upper surface of the light emitting device chip is higher than an upper surface of the package body in the chip non-mount area and an upper surface of the package body in the peripheral area.

Light emitting device package and lighting apparatus including the package

A power semiconductor device is disclosed. The power semiconductor device includes a substrate, a first semiconductor layer disposed on the substrate, a second semiconductor layer disposed on the first semiconductor layer, a third semiconductor layer disposed on the second semiconductor layer and exposing a portion of the second semiconductor layer, a gate electrode disposed on the portion of the second semiconductor layer exposed via the third semiconductor layer, and a source electrode and a drain electrode disposed on the third semiconductor layer at both sides of the gate electrode to be spaced apart from each other. An electrical segregation region is formed in the third semiconductor layer between the gate electrode and the drain electrode.

Power semiconductor device

A fastening device and method for securely attaching objects, which objects can be relatively large in size, to a front side of a panel having the other side closed or hidden, which panel can be relatively thin in thickness, uses an elongated auxiliary member which is insertable lengthwise through an insertion hole formed in the panel. The auxiliary member is positionable on the back side of the panel to extend along a significant linear distance on the back side of the panel. The object is attached to the panel and the auxiliary member by a plurality of fasteners. Each fastener extends through aligned openings formed in the object, the panel, and the auxiliary member. Each of the set of aligned openings is separate and spaced from the insertion hole to thereby provide a plurality of attachment forces. Each attachment force is separate and spaced from the location of the insertion hole. Relatively large and/or heavy objects can be securely attached to a panel which can be relatively thin in thickness by a plurality of points of attachment which are separate and spaced from the insertion hole.

Apparatus for attaching objects to a panel

A fastener comprised of longitudinally divided bolt pieces (1,2,3) inserted into the hole, with trailing tips of the bolt pieces connected to a string (5), which is pulled out of a hole into which the bolt pieces are inserted so that the divided bolt pieces are recoupled, with head portions of the divided bolt pieces halted at the other side of the hole. The forwardly exposed shank of the recoupled bolt is fastened by means of a nut or by applying a riveting.

Divided bolt fastening device

A fastening bolt set is disclosed which is used for attaching an object to a structure, and which comprises an ordinary bolt with a hexagonal or circular head, an internal washer having a long shape and having an annular projection, an external washer having an annular projection, and an ordinary nut for final tightening, all of the above components being connected by a string. This device is used where the back side of the structure is unreachable by hand or by means of a tool, and the working method is such that the bolt and the internal washer are sequentially inserted through the fastening hole, and the string connected to the bolt and the washer is pulled out of the fastening hole. Then the head of the bolt and the internal washer are combined together, the body of the bolt is passed through the fastening hole, and the head of the bolt and the internal washer are halted at the back side of the fastening hole. Then the external washer and the nut are put to the outwardly extended bolt body to finish the fastening by tightening the nut.

Growing community of inventors

Seoul, South Korea

Jung Hun Oh