Samsung Electronics Co., Ltd.

Samsung Aerospace Industries, Ltd.

Jung-ho Park

Kyung-bae Lee

Jae Gwon Jang

Dong Kyu Kim

Jin-woo Park

Jong Youn Kim

Jin-young Bang

Gwang Jae Jeon

Yeon Ho Jang

Methods of fabricating a semiconductor package may include forming a first barrier layer on a first carrier, forming a sacrificial layer, including an opening that exposes at least a portion of the first barrier layer, on the first barrier layer, and forming a second barrier layer on the first barrier layer and on the sacrificial layer. The second barrier layer may include a portion formed on the sacrificial layer. The methods may also include forming a first insulating layer in the opening and protruding beyond a top surface of the portion of the second barrier layer on the sacrificial layer, a top surface of the first insulating layer being farther from the first barrier layer than the top surface of the portion of the second barrier layer, forming a redistribution structure including a redistribution layer and a second insulating layer on the first insulating layer and on the second barrier layer, mounting a semiconductor chip on the redistribution structure, attaching a second carrier onto the semiconductor chip and removing the first carrier, removing the first barrier layer, the sacrificial layer, and the second barrier layer to expose portions of the redistribution structure, and forming solder balls, respectively, on the portions of the redistribution structure.

Methods of fabricating semiconductor package

A semiconductor package includes a first semiconductor chip and a second semiconductor chip on a substrate, a barrier layer on the first semiconductor chip and the second semiconductor chip, the barrier layer having an opening through which at least a part of the first semiconductor chip is exposed, and a heat transfer part on the barrier layer, the heat transfer part extending along an upper face of the barrier layer and filling the opening.

Semiconductor package

An optical adjusting apparatus having an optical adjusting lens to perform image stabilization and auto focusing includes a base supporting a lens barrel on which the optical adjusting lens is mounted, a first driver to move the lens barrel in a first direction, a plurality of first ball bearings disposed between the base and the first driver, a second driver to move the lens barrel in a second direction that is perpendicular to the first direction, and a plurality of second ball bearings disposed between the first driver and the second driver.

Optical adjusting apparatus

A light amount adjusting device including a support plate comprising a first through hole through which light passes; a first slider that comprises a second through hole corresponding to the first through hole, and linearly moves with respect to the support plate along a first direction; a first driver for generating a driving force for moving the first slider with respect to the supporting plate; and a light amount adjuster installed on the first slider and for adjusting an amount of light passing through the light amount adjuster. By using such a simple and compact light amount adjusting device, a two-dimensional (2D) photographing or a three-dimensional photographing is conveniently selected and performed.

Light amount adjusting device, and photographing apparatus and method

An apparatus and a method for preventing the deviation of a focal plane shutter are disclosed. The apparatus has a back cover switch, a control unit and a shutter driver. The apparatus and method prevents the deviation of the focal plane shutter blade by opening the focal plane shutter when a back cover opens. The focal plane shutter is restored to an initial focal plane shutter state after the back cover is closed.

Growing community of inventors

Changwon-si, South Korea

Jung-ho Park