Samsung Electronics Co., Ltd.

Sungkyunkwan University

Jung-Ho Park

Sang-Kyu Park

Seung-Yup Lee

Soo-Ho Song

Jin-Woo Park

Wan-Jin Choi

Jae Gwon Jang

Jungwoo Lee

Dong-Hwan Kim

Austin Kim

Jae-Ho Lee

Dong Kyu Kim

Joon-Ho Byun

Tae-Seok Oh

Dong-In Ha

Gwangjae Jeon

Seung Hwan Kim

Dongkyu Kim

Seok Pil Lee

Seokhyun Lee

Young-Hoon Park

Mi-Ri Lee

Dong-hwan Kim

Kyung-Wook Kim

Ki-Hong Kim

Seung-Hwan Kim

Seok H Lee

Jae-Ho Song

Soo-Young Jang

Kyung-Jong Lee

Kyung-bae Lee

Jin-Ha Shin

Tae-Yoo Kim

Younglae Cho

Seung-Bin Baeg

Byung-Wook Ahn

Sook-Young Yun

Young-Il Song

Jung-Kab Park

Gwang Jae Jeon

Su-Jeong Seo

Hwa-Jin Son

Da Hye Kim

Jin-U Kim

Jeong-Hoon Bae

Yeonho Jang

Ho-Soo Seo

Jae-joon Choi

Won-je Park

Jun-Kyu Kang

Jong Youn Kim

Ju-Hyung Lee

Kyung-Jae Lee

Won-Je Park

Jin-Hyeong Park

Jong-Kui Park

YoungHoon Ro

Byung-Man Lim

Taig-Jong Yoo

Su-jeong Suh

Young-Hwan Jung

Sung-Hwan Ko

Juh-Hyung Lee

Yeon Ho Jang

Suk-Chan Hong

Hyoun-min Baek

Seonk-Kyeng Kim

Youngil Na

Won-Chan Kim

Krylov Konstantine

Sung-Kyung Kim

Yaejung Yoon

Young-il Na

Changhyoung Lee

Se-Woong Kim

Seon-Kyeng Kim

Jin-Young Bang

Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package comprises a first redistribution substrate and a first semiconductor device on the first redistribution substrate. The first redistribution substrate includes a first dielectric layer that includes a first hole, an under-bump that includes a first bump part in the first hole and a second bump part that protrudes from the first bump part onto the first dielectric layer, an external connection terminal on a bottom surface of the first dielectric layer and connected to the under-bump through the first hole, a wetting layer between the external connection terminal and the under-bump, and a first barrier/seed layer between the under-bump and the first dielectric layer and between the under-bump and the wetting layer.

Semiconductor package

Disclosed is a semiconductor package comprising a redistribution substrate, and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate includes an under-bump pattern, a lower dielectric layer that covers a sidewall of the under-bump pattern, and a first redistribution pattern on the lower dielectric layer. The first redistribution pattern includes a first line part. A width at a top surface of the under-bump pattern is greater than a width at a bottom surface of the under-bump pattern. A thickness of the under-bump pattern is greater than a thickness of the first line part.

Semiconductor package with thick under-bump terminal

A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.

Method for fabricating semiconductor package

A method for fabricating a semiconductor package includes forming a release layer on a first carrier substrate. An etch stop layer is formed on the release layer. A first redistribution layer is formed on the etch stop layer and includes a plurality of first wires and a first insulation layer surrounding the plurality of first wires. A first semiconductor chip is formed on the first redistribution layer. A solder ball is formed between the first redistribution layer and the first semiconductor chip. A second carrier substrate is formed on the first semiconductor chip. The first carrier substrate, the release layer, and the etch stop layer are removed. The second carrier substrate is removed.

Method for fabricating a semiconductor package

A semiconductor package includes a first semiconductor chip and a second semiconductor chip on a substrate, a barrier layer on the first semiconductor chip and the second semiconductor chip, the barrier layer having an opening through which at least a part of the first semiconductor chip is exposed, and a heat transfer part on the barrier layer, the heat transfer part extending along an upper face of the barrier layer and filling the opening.

Methods of fabricating a semiconductor package may include forming a first barrier layer on a first carrier, forming a sacrificial layer, including an opening that exposes at least a portion of the first barrier layer, on the first barrier layer, and forming a second barrier layer on the first barrier layer and on the sacrificial layer. The second barrier layer may include a portion formed on the sacrificial layer. The methods may also include forming a first insulating layer in the opening and protruding beyond a top surface of the portion of the second barrier layer on the sacrificial layer, a top surface of the first insulating layer being farther from the first barrier layer than the top surface of the portion of the second barrier layer, forming a redistribution structure including a redistribution layer and a second insulating layer on the first insulating layer and on the second barrier layer, mounting a semiconductor chip on the redistribution structure, attaching a second carrier onto the semiconductor chip and removing the first carrier, removing the first barrier layer, the sacrificial layer, and the second barrier layer to expose portions of the redistribution structure, and forming solder balls, respectively, on the portions of the redistribution structure.

Methods of fabricating semiconductor package

An electronic device is provided that includes a wireless communication device configured to connect with wireless external devices. The electronic device obtains information regarding the wireless external devices. Before and after a call connection event, it is determined whether each of the wireless external devices includes a microphone based on the information. In response to receiving the call connection event, when it is determined that only one of the wireless external devices includes a microphone, an audio input is obtained from the one of the wireless external devices that includes the microphone. In response to receiving the call connection event, when it is determined that at least two of the wireless external devices each include a respective microphone, an audio input is selectively obtained from a microphone of one of the at least two of the plurality of wireless external devices.

Apparatus and method for controlling built-in microphone of portable terminal

A semiconductor package having a redistribution structure including a first face and a second face and a first semiconductor chip mounted on the first face. The semiconductor package may further include a first redistribution pad exposed from the second face of the redistribution structure and a second redistribution pad exposed from the second face of the redistribution structure. The semiconductor package may further include a first solder ball being in contact with the first redistribution pad and a second solder ball being in contact with the second redistribution pad. In some embodiments, a first distance of the first redistribution pad is smaller than a second distance of the second redistribution pad, the first and second distances are measured with respect to a reference plane that intersects a lower portion of the first solder ball and a lower portion of the second solder ball.

An electronic device is provided that includes a wireless communication circuitry, and a controller operatively connected with the wireless communication circuitry. The controller is configured to obtain, from at least one of wireless external devices, information indicating whether each of the wireless external devices includes a microphone. In response to receiving a call connection event while the wireless communication circuitry is wirelessly connected with the at least one of the wireless external devices: when the obtained information indicates that only one of the wireless external devices includes a microphone, an audio input is obtained from the one of the wireless external devices that includes the microphone; and when the obtained information indicates that at least two of the wireless external devices each include a respective microphone, an audio input is selectively obtained from a microphone of one of the at least two wireless external devices.

A mobile phone is provided that is configured to obtain information of one or more external wireless devices operatively coupled with the mobile phone. In response to a call connection event, when the mobile phone is operatively coupled with one external wireless device among the one or more external wireless devices, and if obtained information regarding the one external wireless device indicates that the one external wireless device does not include a microphone, an audio input is obtained via the built-in microphone. In response to a call connection event, when the mobile phone is operatively coupled with one external wireless device among the one or more external wireless devices, and if obtained information regarding the one external wireless device indicates that the one external wireless device includes a microphone, an audio input is obtained via the microphone of the one external wireless device.

There is provided an electrode for a lithium secondary battery. The electrode include a current collector; nanoparticles distributed on a surface of the current collector, each of the nanoparticles including a transition metal or an oxide of the transition metal; and an active material layer disposed on a surface of the current collector having the nanoparticles distributed thereon. This electrode may be employed as a negative electrode for the lithium second battery, to improve a capacity of the lithium second battery.

Electrode structure for lithium secondary battery and lithium secondary battery having the electrode structure

An electronic device and method are provided. The electronic device includes a built-in microphone; a Bluetooth communication module configured to wirelessly connect to a first wireless external device including a speaker and a second wireless external device including a speaker; and a controller configured to detect a call establishment, if the call establishment is detected while one of the first and second wireless external devices is connected to the electronic device, operate the built-in microphone to receive sound based on information regarding the connected one of the first and second wireless external devices, and if the call establishment is detected while both of the first and second wireless external devices are connected to the electronic device, select one of the first and second wireless external devices and provide an incoming call audio signal received via the call establishment to the selected one of the first and second wireless external devices.

Disclosed is a multi-layer capacitor package comprising: a multi-layer capacitor; connection electrodes coupled to capacitor electrodes respectively, wherein the connection electrodes in each group of the connection electrodes vertically overlap with each other, and first and second groups of the connection electrodes are horizontally spaced from each other; a package housing configured to receive therein the multi-layer capacitor; and first and second internal electrodes received in the housing to be coupled to the first and second groups of the connection electrodes respectively, wherein the first and second internal electrodes are horizontally spaced from each other.

Multi-layer capacitor package and package housing

A re-reconfigurable built-in antenna of a portable terminal is provided. The antenna includes an antenna radiator having a feeding pad electrically connected to a feeding portion of a main board of the terminal and at least one ground pad disposed in a position different from that of the feeding pad for selectively establishing an electrical connection to a ground portion of the terminal, and a switching element, commonly connected to the at least one ground pad of the antenna radiator, for selectively establishing an electrical connection to the ground portion by a switching operation. The antenna radiator changes a shape of the antenna radiator by using the selective electrical connection of the ground portion so as to have various operational frequency bands and radiation properties.

Re-configurable built-in antenna for portable terminal

Growing community of inventors

Seoul, South Korea

Jung-Ho Park