Electronics and Telecommunications Research Institute

Lg Chem, Ltd

Jung Hak Kim

Kwang Joo Lee

Hee Jung Kim

Se Ra Kim

Young Kook Kim

Seung Hee Nam

Jung Ho Jo

Jin Woo Hong

Young Ho Jeong

Bum Suk Choi

Soon Choul Kim

Jeoung Lak Ha

Tae Whan Yoo

Seung Chul Kim

Hoon Ki Lee

Yong Tae Lee

Bong Tae Kim

Do Young Kim

Yool Kwon

Hun Sik Kang

Eui Suk Jung

Jung Sik Kim

Eun Jung Kwon

Jae Ho Lee

Ji Ho Han

Ju Hyeon Kim

Hyun Ho Park

Sung Won Byon

Jeong Jin Lee

Yoon Sun Jang

Eun Bum Kim

Hyun Woo Lee

Won Geun Ryu

Young Soo Park

Song In Choi

Jae Geun Kim

Seoung Chul Kim

The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.

Semiconductor adhesive composition and semiconductor adhesive film comprising cured product thereof

Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction towards the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

Apparatus for separating semiconductor chip and method for separating semiconductor by using same

The present invention relates to an adhesive film having a thixotropic index at 110&#xb0; C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

Adhesive film, preparation method of semiconductor device, and semiconductor device

The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

Semiconductor device and method for manufacturing semiconductor device

The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.

Semiconductor device

The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

Adhesive film for semiconductor

The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of &#x2212;10&#xb0; C. to 20&#xb0; C.; a curing agent containing a phenol resin having a softening point of 70&#xb0; C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film

There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Composition for forming adhesive layer of dicing film, and dicing film

The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less; a curing agent including a phenol resin having a softening point of 100&#xb0; C. or higher; and an epoxy resin, wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40% by weight, an adhesive film for a semiconductor including the above adhesive resin composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive film for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Adhesive resin composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film

The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of: applying a voltage to the polymer film at a temperature of 5&#xb0; C. to 250&#xb0; C., while one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer film

The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of applying a voltage to the polymer film, while at least one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.

Semiconductor device and method for manufacturing the same using an adhesive

A network management apparatus and method for remotely controlling a state of an IT device in order to use WOL to change a remote device from an inactive state to an active state over an IP network. The network management apparatus includes a detection pattern generator, a remote state controller, and a wake-up cause analyzer. By activating an inactivated PC connected over an IP network and positioned at a remote site using WOL to control a state of another IT device interoperating through the IP network as well as a state of the PC, it is possible to inactivate the device without unnecessarily having to leave the device on and then control the device as necessary, thereby reducing power consumption of the device and extending a lifetime of the device.

Network management apparatus and method for remotely controlling state of IT device

The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70&#xb0; C.; and a phenol resin having a softening point of more than 105&#xb0; C., wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.

Growing community of inventors

Daejeon, South Korea

Jung Hak Kim