Lg Innotek Co., Ltd.

Other

Jung Ha Hwang

Kyoung Woo Jo

Tae Young Choi

Sung Ho Kim

Dong Nyung Lim

Seung Yeon Lee

Won Jin Son

Cheon Joo Kim

Kwang Choon Kim

Jong Kuk Lee

Hee Sung Cha

Hey Zoo Hwang

Moon Han Kim

Yong Seon Song

Hyeong Seon Yun

Seoung Yeon Lee

Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device (LED) comprises an LED chip, a barrier over the LED chip, and an encapsulating material containing a phosphor, wherein the encapsulating material is disposed inside the barrier over the LED chip.

Light emitting device with encapsulant formed with barriers and light emitting device package having the same

A lighting device comprises: a heat sink which comprises one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and comprises a substrate and a plurality of light sources disposed on the substrate, wherein the substrate has a first hole disposed at the center thereof and a second hole; a power controller which is electrically connected to the light emitting module through the second hole of the substrate and is disposed in the receiving recess of the heat sink, wherein the light emitting module comprises a first light emitting module comprising a first substrate and a first light source, and a second light emitting module comprising a second substrate and a second light source, wherein the first substrate and the second substrate are disposed adjacent to each other.

Lighting device

A light emitting device (LED) package includes a submount and a light emitting chip. The submount has a chip region and a supporting region over which the chip is mounted, and an encapsulating material and fluorescent material are formed over the chip. The coverage area of encapsulating and fluorescent materials is substantially coextensive with the chip or chip region, and a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.

Light emitting device package and lighting system

A lighting device may be provided that includes a heat sink which includes one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and includes a substrate and a plurality of light sources disposed on the substrate, wherein the substrate includes a hole and a plurality of via-holes; a power controller which includes an electrode pin electrically connected to the light emitting module through the via hole; and aninsulating inner case which receives the power controller therein and is disposed in the receiving recess of the heat sink, wherein the light sources include an lighting emitting diode.

Provided are a light emitting device package and a lighting system. The light emitting device package includes a light emitting device chip, at least one wire, and an encapsulating material. The light emitting device chip includes a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and second conductive type semiconductor layers. The wire is on the light emitting device chip. The encapsulating material is on the light emitting device chip out of the wire, and includes a phosphor. The wire is perpendicular to an upper surface of the light emitting device chip, at least up to a height of the encapsulating material.

Light emitting device package

Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure on the substrate, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and second conductive type semiconductor layers; a first electrode on the light emitting structure; and a patterned phosphor layer on the light emitting structure, wherein the patterned phosphor layer converts light generated from the light emitting structure into light having a wavelength longer than that of the light generated from the light emitting structure, and wherein the pattern of the phosphor layer exposes the first electrode.

Light emitting device, light emitting device package, and lighting system

The activated kaolin powder compound is prepared from naturally-existing kaolin (hereinafter &ldquo;natural kaolin&rdquo;). The activated kaolin powder compound is prepared by heating natural kaolin to 480&deg; C. within at most one hour, calcinating the heated natural kaolin at high temperature by heating in the range of 800&tilde;950&deg; C. over at least 15 minutes, quenching the calcinated kaolin with water or air, and pulverizing the quenched activated kaolin to give powder having particle sizes of 2 &mgr;m or less, wherein the natural kaolin is primarily composed of halloysite (Al,O,.2SiO,.4H,O). The activated kaolin powder compound is employed in an amount of about 5 to 15% by weight of cement for preparing mortar or cement. The cement composition containing the activated kaolin powder compound can provide a mortar or concrete having excellent properties in compressive strength, flexural strength and water permeability.

Activated koalin powder compound for mixing with cement and method of preparing the same

The activated kaolin powder compound is prepared from naturally-existing kaolin (hereinafter 'natural kaolin'). The activated kaolin powder compound is prepared by heating natural kaolin to 480.degree. C. within at most one hour, calcinating the heated kaolin at high temperature by heating to 980.degree. C. over at least one hour, quenching the calcinated kaolin with water or air, and pulverizing the quenched kaolin to give particle sizes of 2 .mu.m or less. The activated kaolin powder compound is employed in an amount of about 5 to 15% by weight of cement for preparing mortar or cement. The cement composition containing the activated kaolin powder compound can provide a mortar or concrete having superior properties in compressive strength, flexural strength and water permeability.

Growing community of inventors

Seoul, South Korea

Jung Ha Hwang