Samsung Electronics Co., Ltd.

Jung-Do Lee

Sang-Uk Han

Su-Min Park

Jongkook Kim

Hohyeuk Im

Hak-Kyoon Byun

Jaesik Lee

Donghan Kim

Taehoon Kim

Tae-Hun Kim

Seok Won Lee

Dae-Young Choi

SeokWon Lee

Tae-woo Kang

Jang-Woo Lee

Yang-Hoon Ahn

Seonhyang You

Seon-Hyang You

JongKook Kim

A semiconductor package includes a first package board, a first semiconductor chip arranged on the first package board, a heat transfer layer arranged on the first semiconductor chip, a heat spreader arranged on the heat transfer layer, and a housing having a molding part arranged on the first package board and directly surrounding side surfaces of the first semiconductor chip and a guide wall arranged on the molding part, with the guide wall spaced apart from the heat spreader and surrounding side surfaces of the heat spreader.

Semiconductor packages having a guide wall and related systems and methods

Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.

Semiconductor chips having guard rings and methods of fabricating the same

Provided is a semiconductor package and a method for fabricating the semiconductor package. The semiconductor package may include a first package having a first semiconductor chip mounted on a first substrate and a second package having a second semiconductor chip mounted on a second substrate, the second substrate being bent to cover a side of the first package to contact the first substrate such that the first and second packages are connected electrically.

Semiconductor package and method for manufacturing the same

An electronic device includes a lower electronic part including a lower substrate, a lower chip structure disposed on the lower substrate, and a lower molding layer covering the lower chip structure and having a recessed region in an upper surface of the lower molding layer, and an upper electronic part including an upper substrate disposed on the lower electronic part, and an upper chip structure projecting from the upper substrate, wherein the recessed region of the lower molding layer receives the upper chip structure.

Electronic device having stack-type semiconductor package and method of forming the same

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Uiwang-si, South Korea

Jung-Do Lee