Samsung Electro-mechanics Co., Ltd.

Korea University Research and Business Foundation

Soongsil University

Jung Aun Lee

Myeong Woo Han

Chul Gyun Park

Moonil Kim

Kook Joo Lee

Do Jae Yoo

Seung Ho Choi

Jung Ho Yoon

Kwang Du Lee

Nam Heung Kim

Jeong Hoon Kim

Jae Won Choi

Eung Soo Kim

Chan Yong Jeong

Sang Hoon Hwang

Joun Sup Park

Chul Hun Seo

Chong Min Lee

Dong Woon Chang

Yang Hyun Kim

Du Won Jung

A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.

Semiconductor package including an antenna formed in a groove within a sealing element

There is provided a dipole antenna. The dipole antenna according to embodiments of the present invention includes: a substrate having a predetermined dielectric constant; and an antenna unit including at least one pair of electrodes and feed lines disposed on one surface of the substrate, wherein the electrodes receive current through the feed lines to generate a signal radiated in a direction in parallel with the one surface of the substrate.

Dipole antenna

A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.

Semiconductor device package with integrated antenna for wireless applications

There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.

Dielectric cavity antenna

There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.

Differential mode amplifier driving circuit

Disclosed herein is a display system incorporating wired and wireless charging apparatuses, including: a switching processing unit supplying and processing a power of a power supply unit according to a mode selected through a switch; a wireless charging unit connected to the switching processing unit and including a pad for wireless charging; a wired charging unit connected to the switching processing unit and a terminal for wired charging; a display unit connected to the switching processing unit; and a control unit connected to the switching processing unit to control operations according to the mode.

Display device and display system incorporating wired and wireless charging apparatuses

Disclosed herein are a side-face radiation antenna and a wireless communication module. According to an embodiment of the present invention, there is provided the side-face radiation antenna including a via patch part formed at a side portion of a module substrate including laminated substrates to perform a side-face radiation, and formed by metal filled in a plurality of vias arranged at a predetermined interval in the side portion and connected, and a feed line part inserted between intermediate layers of the module substrate, and connected to the via at a center portion of the via patch part. In addition, there is provided the wireless communication module including the side-face radiation antenna.

Side-face radiation antenna and wireless communication module

Embodiments of the invention provide a dielectric waveguide antenna including a dielectric waveguide transmitting a signal applied from a power feeder, a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture, and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.

Dielectric waveguide antenna

A dielectric resonator antenna is disclosed that includes a multi-layer substrate on which a plurality of insulating layers and conductor layers are alternately stacked. The dielectric resonator antenna also includes a first conductor plate that has an opening part on the upper portion of the top insulating layer of the multi-layer substrate and a second conductor plate that is formed on the lower portion of the bottom insulating layer from the first conductor plate. The insulating layer is formed with at least two stacked layers and is disposed at a position corresponding to the opening part. The dielectric resonator antenna also includes a plurality of first metal via holes, a feeding part and a matching substrate that is stacked on the opening part and is stacked with at least one insulating layer.

Dielectric resonant antenna using a matching substrate

There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.

Semiconductor package

A dielectric resonator antenna embedded in a multilayer substrate is described. The dielectric resonator antenna includes a multilayer substrate, a first conductive plate, a second conductive plate, a plurality of first metal via holes, a feeding part configured to feed a dielectric resonator, and a conductive pattern part inserted into the dielectric resonator so that a vertical metal interface is formed in the dielectric resonator.

Dielectric resonator antenna embedded in multilayer substrate for enhancing bandwidth

Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.

Disclosed is a wireless energy transmission structure which includes a disc part including a first conductor plate and a second conductor plate which are spaced to face each other and a dielectric material inserted between the first conductor plate and the second conductor plate, and generating an electric field between the first conductor plate and the second conductor plate; and a ring-shaped wire part one end of which is connected to the first conductor plate and the other end of which is connected to the second conductor plate, and having a meta structure in which a plurality of meta cells is repetitively arranged so as to induce a magnetic field using the electric field, so that the wireless energy transmission structure is reduced in size and is improved in transmission distance and transmission efficiency.

Growing community of inventors

Gyunggi-do, South Korea

Jung Aun Lee