Intel Corporation

Junfeng Zhao

Cheng Yang

Bok Eng Cheah

Yen Hsiang Chew

Kooi Chi Ooi

Jiun Hann Sir

Yong She

Shanggar Periaman

Michael P Skinner

Jiamiao Tang

Saeed S Shojaie

A method for making a semiconductor device includes forming rims on first and second dice. The rims extend laterally away from the first and second dice. The second die is stacked over the first die, and one or more vias are drilled through the rims after stacking. The semiconductor device includes redistribution layers extending over at least one of the respective first and second dice and the corresponding rims. The one or more vias extend through the corresponding rims, and the one or more vias are in communication with the first and second dice through the rims.

Method for interconnecting stacked semiconductor devices

Some forms relate to an electronic assembly that includes a die that includes an upper surface and a conductive column extending from the upper surface such that the conductive column is not surrounded by any material other than where the conductive column engages the die. Other forms relate to an electronic package that includes a stack of electronic assemblies where each electronic assembly includes a die that having an upper surface and a plurality of conductive columns extending from the upper surface such that each conductive column is not surrounded by any material other than where the conductive column engages the die, and wherein the stack of electronic assemblies is arranged in an overlapping configuration such the plurality of conductive columns on each electronic assembly are not covered by another electronic assembly.

Overlapping stacked die package with vertical columns

Some forms relate to an electronic assembly () that includes a die () that includes an upper surface () and a conductive column () extending from the upper surface () such that the conductive column () is not surrounded by any material other than where the conductive column () engages the die (). Other forms relate to an electronic package () that includes a stack () of electronic assemblies () where each electronic assembly () includes a die () that having an upper surface () and a plurality of conductive columns () extending from the upper surface () such that each conductive column () is not surrounded by any material other than where the conductive column () engages the die (), and wherein the stack () of electronic assemblies () is arranged in an overlapping configuration such the plurality of conductive columns () on each electronic assembly () are not covered by another electronic assembly ().

Embodiments of integrated circuit (IC) assemblies and related techniques are disclosed herein. For example, in some embodiments, an IC assembly may include a first printed circuit board (PCB) having a first face and an opposing second face; a die electrically coupled to the first face of the first PCB; a second PCB having a first face and an opposing second face, wherein the second face of the second PCB is coupled to the first face of the first PCB via one or more solder joints; and a molding compound. The molding compound may be in contact with the first face of the first PCB and the second face of the second PCB. Other embodiments may be disclosed and/or claimed.

Integrated circuit assemblies with molding compound

Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.

Growing community of inventors

Shanghai, China

Junfeng Zhao