Shenzhen China Star Optoelectronics Technology Co., Ltd.

Wuhan China Star Optoelectronics Technology Co., Ltd.

Tcl China Star Optoelectronics Technology Co., Ltd.

Other

Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Huizhou China Star Optoelectronics Display Co., Ltd.

Juncheng Xiao

Bin Zhao

Mang Zhao

Chao Tian

Yao Yan

Shangcao Cao

Ronglei Dai

Yanqing Guan

Hongyuan Xu

Xin Hui Zhang

Ji Li

Jun Zhao

Yun Yu

Huajun Lu

Yong Tian

Yoonsung Um

Wei Wu

Xiaojin He

Jinming Liu

Meinan Li

Chunxiao Hu

Qi Zhang

Fei Ai

Chao Dai

Xiaodan Lin

Guangmiao Wan

Shan Li

Yan Li

Haiming Cao

Yongxiang Zhou

Feng Zheng

Daobing Hu

Fen Long

Yingchun Zhao

Ru Ge

Yu Liu

Shi Tang

Bo Sun

Jing Liu

Jun Hong Zhao

Dewei Song

Jiyue Song

Yong Xu

Xin Zhang

Hongquan Wei

Maoxia Zhu

Yuan Yan

Yongping Fan

Quansheng Liu

Xu Wang

Junling Liu

Xin Liu

Xing Lei

Ling Zhao

Chengcai Dong

Huihua Liao

Cheng Gong

Wenxue Huo

Zhongbin Wang

Xinru Yao

Weimin Chang

Bizhang Zhu

Li Xu

Jiayang Fei

Yanzong Tang

The present application provides a splicing display device includes a liquid crystal display screen and an inorganic light emitting diode display screen. A color point coordinate of a color of a light emitted by the liquid crystal display screen in the CIE 1931 XYZ chromaticity diagram is in a first gamut triangle. A color point coordinate of a color of a light emitted by the inorganic light emitting diode display screen in the CIE 1931 XYZ chromaticity diagram is in a second gamut triangle. A gamut boundary of the second gamut triangle surrounds a gamut boundary of the first gamut triangle, and a difference between a NTSC color gamut corresponding to the second gamut triangle and a NTSC color gamut corresponding to the first gamut triangle is less than 30%.

Splicing display device

The present disclosure provides an array substrate, a method for manufacturing the array substrate, and a display device. The array substrate includes a substrate, a gate electrode, and an oxide semiconductor layer. Material of the oxide semiconductor layer includes a modified metal element. Proportion of the modified metal element in all metal elements gradually decreases from the gate electrode to the oxide semiconductor layer, which can solve technical problems of poor stability and low mobility of a metal oxide thin film transistor.

Array substrate, method for manufacturing array substrate, and display device

The present application provides a manufacturing method of an array substrate, an array substrate, and a display panel. The manufacturing method of the array substrate includes providing a base substrate; forming a conductive layer and a photoresist layer on the base substrate; patterning the photoresist layer and the conductive layer to form a conductive area and an electroplating area electrically connected to each other; removing the photoresist layer; forming an electroplating layer; and disconnecting the electroplating area from the conductive area. In the present application, the photoresist layer has a less thickness to reduce manufacturing costs of the array substrate.

Manufacturing method of array substrate, array substrate, and display panel

The present application provides a backlight module and a display device. The backlight module includes: a metal layer including signal lines and first signal connection lines extending along a first direction in the same layer; and light-emitting control structures. One signal line is disposed at each of at least one side of each column of the light-emitting control structures, each light-emitting control structure is connected to the corresponding signal line, and any two adjacent ones of the light-emitting control structures in each column of the light-emitting control structures are connected through one first signal connection line.

Backlight module and display device

A tiled apparatus is provided by the present disclosure. at least two of the tiled apparatus include display panels, backlight modules and lens parts. the display panel includes a display part and a tiled part. The tiled part is composed of transparent materials. An orthographic projection of the backlight module on the display panel covers the display part and at least a part of the tiled part. The lens part is disposed on a side of the display panel away from the backlight module and covers adjacent two tiled parts and a seam. The lens part partially overlaps with display parts of adjacent two display panels.

Tiled apparatuses

The present application discloses a splicing display device including a first light emission region disposed adjacent to a splicing gap. The first light emission region is located between a second light emission region and the splicing gap. Along a first direction, a first interval is defined between adjacent two of the light emission units disposed in first light emission region, and a second interval is defined between adjacent two of the light emission units disposed in the second light emission region. The first interval is greater than second interval.

The present disclosure provides a method for manufacturing a thin film transistor array substrate and a display panel. The method includes: forming a plurality of dispersed metal oxide grains on a substrate; forming an amorphous metal oxide semiconductor layer in contact with the plurality of metal oxide grains, and at least one metal element in the metal oxide grain is same as metal elements in the metal oxide semiconductor layer; performing an annealing process on the amorphous metal oxide semiconductor layer, to obtain a crystallized metal oxide semiconductor layer.

Method for manufacturing thin film transistor array substrate and display panel

A light-emitting substrate and a manufacturing method thereof are disclosed. In the embodiment of the present disclosure, by providing a groove on a base plate in the manufacturing method of the light-emitting substrate, the accuracy of coating the solder resist ink layer can be improved so as to reduce a distance between the solder resist ink layer and the pad assembly and avoid poor soldering or soldering failure caused by the overflow of the solder resist ink onto the pad.

Light-emitting substrate and a manufacturing method thereof

A display panel, a method of manufacturing thereof, and an electronic device are provided. The display panel includes: a control module connected to data lines and scan lines corresponding to a corresponding light-emitting unit, a first end of a light-emitting device connected to a first power line corresponding to the corresponding light-emitting unit, and a drive module connected to a second power line corresponding to each light-emitting unit in a corresponding to-be-driven region, the control module in the corresponding to-be-driven region, and a second end of the light-emitting device.

Display panel and manufacturing method thereof and electronic device

The present application discloses a liquid crystal alignment method, a liquid crystal display panel, and a mobile terminal. In a liquid crystal alignment process, a first common electrode receives an alignment voltage, and a pretilt angle of a liquid crystal molecule arranged corresponding to a slit is smaller than a pretilt angle of a liquid crystal molecule arranged corresponding to a branch electrode. In an actual driving process, because an overall pretilt angle of liquid crystal molecules is increased and pretilt angles in a same domain of a subpixel are differentiated, a response time and view angle features of medium and low grayscale of the liquid crystal display panel can be improved.

Liquid crystal alignment method comprising applying an alignment voltage to a first common electrode, liquid crystal display panel, and mobile terminal

A display panel and a method for manufacturing the same are provided. The display panel includes a first bonding area and a second bonding area connected to the first bonding area. The display panel further includes a substrate and a bonding wiring layer. A thickness of a part of the substrate in the second bonding area is less than a thickness of a part of the substrate in the first bonding area. The bonding wiring layer is disposed on surfaces of the parts of the substrate in the first bonding area and the second bonding area. A side surface of the bonding wiring layer away from the first bonding area and a side surface of the substrate away from the first bonding area are located on a same plane.

Display panel and method for manufacturing same

An array substrate and a display panel are disclosed. The display panel includes the array substrate. An ion injection stopper layer and an active layer of the array substrate correspond to at least part of the channel part. The ion injection stopper layer blocks ions from being injected into the channel part. Therefore, an effective channel length of oxide TFTs is reduced. A width of a channel of the oxide TFTs can be reduced without changing a width-length ratio of the oxide TFTs. As such, a size of the oxide TFTs can be reduced, and an aperture ratio of the display panel is increased.

Array substrate and display panel

The present application discloses a splicing panel. The present application is provided with a dimming layer on a light-emitting diode lamp plate, and then the dimming layer is provided with a plurality of first light shading parts arranged in an array. A visual effect of the light-emitting diode lamp plate on both sides in a first direction can be adjusted through the plurality of the first light shading parts, so as to improve a visual difference between display panels of the splicing panel and the light-emitting diode lamp plate on both sides in the first direction.

Splicing panel

A display module and a seamless splicing display device are disclosed. The display module includes: a display panel including a central display area and a bezel area adjacent to the central display area, wherein the display panel is provided with a bezel driving circuit and an array substrate driving circuit; a compensation display component disposed on the display panel, located in the bezel area, and electrically connected with the bezel driving circuit; and a metal wiring located on a lateral surface of the display panel and connected with the bezel driving circuit and the array substrate driving circuit.

Display module and seamless splicing display device

Embodiments of the present application provide a spliced display panel and a spliced display device. In the spliced display panel provided by the embodiments of the present application, a second display module is disposed on a non-display surface of a first display module and corresponding to a spliced region.

Spliced display panel and spliced display device

Growing community of inventors

Guangdong, China

Juncheng Xiao