Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Junbum Park

Inkeun Baek

Younghwan Kim

Hyoungkyu Choi

Namil Koo

Youngjoo Lee

Jongmin Yoon

Jaegu Yoon

Suhwan Park

Jongsu Kim

Ikseon Jeon

Seongmin Kim

Jaeho Choi

Sungho Jang

Seungman Kim

Namsu Lee

Sangwoo Han

Hansung Lee

Jeongeun Shin

Kwangrak Kim

Yoojin Jeong

Martin Priwisch

Jungju Park

Wonki Lee

Proposed are a device provided in a vehicle and a method for controlling same. A device provided in a vehicle according to one embodiment of the present disclosure comprises: a first module which executes a first application and outputs first video data corresponding to the first application; and a second module which is wired or wirelessly connected to the first module and outputs video data, which is the same as the first video data, at a first timing. The second module is designed to output second video data which is different from the first video data in response to, for example, an event which has occurred at a second timing after the first timing.

Device provided in vehicle and method for controlling same

Proposed are a device provided to a vehicle and a control method therefor. Specifically, proposed is a device provided to a vehicle, the device comprising: a plurality of system on chips (SoCs) which execute at least one application and are connected via a predetermined input/output interface; and a display which is provided in the vehicle and outputs an execution screen of the at least one application. Further, proposed is that a first SoC, among the plurality of SoCs, requests the execution of a specific application, among the at least one application, to a second SoC on the basis of the resource state of the first SoC, and as a response to the request, receives the execution result of the specific application from the second SoC.

Device provided to vehicle and control method therefor

A semiconductor substrate processing apparatus includes: a metastructure layer divided into a plurality of microstructures by grooves, a light-transmitting dielectric substrate that supports the plurality of microstructures and is configured to allow an electromagnetic wave to be transmitted therethrough, and a frame including an exhaust hole configured to receive gas introduced from the grooves such as to provide suction force to the semiconductor substrate, wherein each of the plurality of microstructures has a smaller width than a wavelength of the electromagnetic wave, and each of the grooves has a smaller width than the wavelength of the electromagnetic wave.

Semiconductor substrate processing apparatus and semiconductor substrate measuring apparatus using the same

An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.

Inspection apparatus and inspection method using same

A vehicle apparatus according to one embodiment of the present invention comprises: a first control unit for executing a first application for a display, wherein the first control unit transmits display information about the first application to a first display unit; a second control unit for executing a second application for the display, wherein the second control unit transmits display information about the second application to a second display unit; a first switch unit connected to the first control unit and the second control unit, wherein the first switch unit receives the display information about the first application and the display information about the second application from the first control unit and the second control unit so as to transmit the display information about the first application and the display information about the second application to the first display unit and the second display nit, respectively; and a second switch unit for receiving the display information about the first application and the display information about the second application from the first control unit and the second control unit, respectively.

Vehicle apparatus and control method

A hybrid probe includes a probe body including a wiring and extending in a first direction; and a probe tip coupled to the probe body and including a first antenna, a second antenna, and an isolation layer. The hybrid probe may operate in a reflection mode using the first antenna and the second antenna, and operate in a transmission mode using the second antenna.

Hybrid probe, physical property analysis apparatus including the same, and method of measuring semiconductor device using the apparatus

Provided is a probe configured to detect a near field, the probe including a probe substrate having a tip region at an end portion of the probe substrate, a width of the tip region being less than a width of a remaining region of the probe substrate, a first electrode and a second electrode disposed on a surface of the probe substrate, the first electrode and the second electrode being spaced apart from each other and extending from the tip region along the probe substrate, an emitter and a detector disposed between the first electrode and the second electrode, the emitter and the detector being spaced apart from each other in a direction in which the probe substrate extends, and being configured to be photo switched, and a reflector disposed above the emitter and the detector in the direction in which the probe substrate extends opposite to the tip region, and configured to reflect an electromagnetic wave emitted from the emitter.

Probe for detecting near field and near-field detecting system including the same

A semiconductor substrate measuring apparatus includes a light source to generate irradiation light having a sequence of on/off at a predetermined interval, the light source to provide the irradiation light to a chamber with an internal space for processing a semiconductor substrate using plasma, an optical device between the light source and the chamber, the optical device to split a first measurement light into a first optical path, condensed while the light source is turned on, to split a second measurement light into a second optical path, condensed while the light source is turned off, and to synchronize with the on/off sequence, and a photodetector connected to the first and second optical paths, the photodetector to subtract spectra of first and second measurement lights to detect spectrum of reflected light, and to detect plasma emission light emitted from the plasma based on the spectrum of the second measurement light.

Semiconductor substrate measuring apparatus and plasma treatment apparatus using the same

An optical emission spectroscopy (OES) calibration system includes a chamber, an adapter, an OES device, a calibration device, and a spectrometer. The chamber includes a viewport. The adapter is fastened to the viewport, and includes a first beam splitter and a second beam splitter. The OES device detects plasma light generated in the chamber and transmitted through the adapter and generates OES data based on the detected plasma light. The calibration device includes a light source, and generates correction data for compensating for deviations in the OES data. The spectrometer detects light emitted from the light source and split by the first beam splitter or the second beam splitter. Each of the OES device, the calibration device, and the spectrometer is fastened to the adapter through an optical cable, and the calibration device generates the correction data using an intensity of light detected by the spectrometer.

Optical emission spectroscopy calibration device and system including the same

A mobile terminal including a wireless communication unit configured to provide wireless communication; a display unit including a touch sensor and a fingerprint recognition sensor overlapped with the touch sensor; and a controller configured to deactivate the fingerprint recognition sensor, receive a finger touch input on the display unit, extract, from the touch sensor, touch information related to a touch region where the finger touch input has been applied on the display unit, activate the fingerprint recognition sensor when the extracted touch information indicates a sufficient finger touch input has been received, sense fingerprint information of the finger using the activated fingerprint recognition sensor, and perform fingerprint authentication with respect to the sensed fingerprint information based on the extracted touch information.

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Goyang-si, South Korea

Junbum Park