Henkel IP Holding Gmbh

Junbo Gao

Qizhuo Zhuo

Gina Hoang

Xinpei Cao

Glenda Castaneda

Provided herein are highly conductive compositions (having a volume resistivity no greater than 1&#xd7;10Ohms&#xb7;cm) using silver flake, powder or suspension in solvent for electromagnetic interference (EMI) applications. This high conductivity will allow the use of very thin films for EMI shielding protection, which in turn will be helpful to reduce package sizes. In some embodiments, the coating composition is applied on the device surface by suitable means, e.g., by an electrostatic spray process, air spray process, ultrasonic spray process, spin coating process, or the like.

Achieving electromagnetic interference shielding protection by deposition of highly conductive compositions

A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater.

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Concord, CA, United States of America

Junbo Gao